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25LC512T-M/SN

Microchip Technology

25LC512T-M/SN by Microchip Technology

25LC512T-M/SN by Microchip Technology is a 64KX8 EEPROM with SPI serial bus type, operating at 5V. It offers 1000000 write/erase cycles, -55 to 125 °C temperature range, and synchronous operation. Ideal for applications requiring small outline package style and high endurance memory.

Median Price

$17.360

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

NAC Semi

USA . 6,600 parts In-Stock

1+ parts

$17.360

100+ parts

$15.990

1k+ parts

$14.820

10k+ parts

-

6,600

$17.360

$15.990

$14.820

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Vyrian

USA . 4,594 parts In-Stock

1+ parts

-

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4,594

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VNN

France . 1,380 parts In-Stock

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1,380

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Nova Conductors

Japan . 300 parts In-Stock

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300

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Component Sense

UK . 106 parts In-Stock

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106

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,585 parts In-Stock

1+ parts

$19.000

100+ parts

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1,585

$19.000

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AZTECH Wire

Italy . 271 parts In-Stock

1+ parts

$20.540

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271

$20.540

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QUARKTWIN TECHNOLOGY LTD

USA . 27,583 parts In-Stock

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27,583

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NIA Electronics

USA . 8,176 parts In-Stock

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8,176

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LMD Electronica

Estonia . 4,533 parts In-Stock

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4,533

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LOOK Integrated Logistics

Peru . 3,890 parts In-Stock

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3,890

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Netroflash

USA . 2,000 parts In-Stock

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2,000

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Montano Global Distributors

Canada . 1,472 parts In-Stock

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1,472

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Ledger Components

France . 355 parts In-Stock

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355

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Overview

Unlock endless possibilities with the 25LC512T-M/SN by Microchip Technology. This high-quality EEPROM offers reliable data storage in a compact package, perfect for a wide range of applications. With a military-grade temperature grade, hardware write protection, and 1,000,000 write/erase cycles, this versatile memory IC ensures your data is safe and secure. Trust Microchip Technology for innovative solutions that deliver value, benefits, and advantages to meet all your memory needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the EEPROM, ensuring that it can withstand harsh environmental conditions.

Surface Mount: YES

Being surface mountable makes installation and soldering processes easier and more efficient, saving time and effort during production.

Operating Mode: SYNCHRONOUS

Synchronous operation allows for precise timing and coordination with other components in the system, improving overall performance.

Nominal Supply Voltage / Vsup (V): 5

A standard supply voltage of 5V ensures compatibility with a wide range of systems and applications.

Write Protection: HARDWARE

Hardware-based write protection adds an extra layer of security to the data stored in the EEPROM, preventing accidental or unauthorized changes.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the EEPROM energy-efficient and reliable in noisy environments.

Endurance: 1000000 Write/Erase Cycles

With a high endurance rating, this EEPROM can withstand frequent read/write operations, ensuring long-term reliability and data retention.

Serial Bus Type: SPI

SPI interface allows for fast and efficient communication with other devices, enabling quick data transfer and system responsiveness.

Memory IC Type: EEPROM

Being an EEPROM allows for non-volatile data storage, retaining information even when power is removed, making it ideal for saving configuration settings or user data.

Technical Specifications

EEPROM 25LC512T-M/SN attributes and parameters. Explore more EEPROM devices from Microchip Technology

Specs

Maximum Clock Frequency (fCLK):

10 MHz

Minimum Data Retention Time:

200

Endurance:

1000000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Memory Density:

524288 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

8

No. of Words:

65536 words

No. of Words Code:

64K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Organization:

64KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.23

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Programming Voltage (V):

5

Screening Level:

TS 16949

Maximum Seated Height:

1.75 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.00002 Amp

Maximum Supply Current:

10 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Maximum Write Cycle Time (tWC):

5 ms

Write Protection:

HARDWARE

Trade Compliance

25LC512T-M/SN Memory ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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