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25LC320/WF

Microchip Technology

25LC320/WF by Microchip Technology

25LC320/WF by Microchip Technology is a 32K-bit EEPROM with SPI interface, operating at up to 10 MHz. It features 4Kx8 organization, 5V nominal voltage, and endurance of 1M write/erase cycles. Ideal for applications requiring reliable non-volatile memory storage in commercial temperature range.

Median Price

$0.710

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$0.710

100+ parts

-

1k+ parts

-

10k+ parts

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10

$0.710

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-

-

Vyrian

USA . 7,877 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,877

-

-

-

-

VNN

France . 623 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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623

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Netroflash

USA . 100 parts In-Stock

1+ parts

$0.710

100+ parts

-

1k+ parts

-

10k+ parts

-

100

$0.710

-

-

-

AZTECH Wire

Italy . 640 parts In-Stock

1+ parts

$19.490

100+ parts

-

1k+ parts

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10k+ parts

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640

$19.490

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-

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Ampacity Inc.

Singapore . 947 parts In-Stock

1+ parts

$21.000

100+ parts

-

1k+ parts

-

10k+ parts

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947

$21.000

-

-

-

Marpe Global Electronics

Taiwan . 7,835 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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7,835

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-

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QualityLine Systems

Poland . 7,835 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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7,835

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-

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XL Components Corporation

Australia . 7,835 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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7,835

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Microchip USA

USA . 1,695 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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1,695

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Overview

Experience unparalleled quality and reliability with the 25LC320/WF EEPROM by Microchip Technology. As a leader in semiconductor solutions, Microchip ensures top-notch performance and durability in every product they create. This EEPROM is perfect for a wide range of applications, offering customers seamless data storage capabilities. With a high endurance of 1,000,000 write/erase cycles and a maximum clock frequency of 10 MHz, this chip provides exceptional value and efficiency. Trust Microchip Technology to deliver cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Surface Mount: YES

Makes it easy to integrate into PCB designs and saves space on the board.

Screening Level: TS 16949

Ensures high quality standards and reliability in automotive applications.

Operating Mode: SYNCHRONOUS

Allows for precise timing and synchronization in data transfer.

Nominal Supply Voltage / Vsup (V): 5

Standard voltage level for easy compatibility with other components.

Output Characteristics: 3-STATE

Enables the output to be in three states: high, low, and high-impedance, offering flexibility in data communication.

Write Protection: HARDWARE

Enhances security by allowing write protection through hardware mechanism.

Maximum Clock Frequency (fCLK): 10 MHz

Provides high-speed operation for efficient data handling.

Technology: CMOS

Uses CMOS technology for low power consumption and high noise immunity.

Endurance: 1000000 Write/Erase Cycles

Offers durable and long-lasting memory storage for frequent read/write operations.

Memory IC Type: EEPROM

Specifically designed for non-volatile data storage, ideal for storing configuration settings and small amounts of data.

Technical Specifications

EEPROM 25LC320/WF attributes and parameters. Explore more EEPROM devices from Microchip Technology

Specs

Additional Features:

ALSO OPERATES WITH 2.5V MIN @ 5MHZ AND 1.8VMIN @3MHZ

Maximum Clock Frequency (fCLK):

10 MHz

Minimum Data Retention Time:

200

Endurance:

1000000 Write/Erase Cycles

Input/Output Type:

SEPARATE

JESD-30 Code:

R-XUUC-N

Memory Density:

32768 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Ports:

1

No. of Words:

4096 words

No. of Words Code:

4K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

4KX8

Output Characteristics:

3-STATE

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Equivalence Code:

DIE OR CHIP

Package Shape:

Package Style (Meter):

UNCASED CHIP

Parallel or Serial:

SERIAL

Programming Voltage (V):

5

Screening Level:

TS 16949

Serial Bus Type:

SPI

Maximum Supply Current:

5 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Position:

UPPER

Maximum Write Cycle Time (tWC):

5 ms

Write Protection:

HARDWARE

Trade Compliance

25LC320/WF Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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