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25LC128-E/ST16KVAO

Microchip Technology

25LC128-E/ST16KVAO by Microchip Technology

25LC128-E/ST16KVAO by Microchip is a 16KX8 EEPROM with SPI serial bus, offering 1000000 write/erase cycles. Operating at -40 to 125 °C, it has a max clock frequency of 10 MHz and supports hardware/software write protection. Ideal for automotive applications due to AEC-Q100 screening level.

Median Price

$1.310

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$1.310

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10

$1.310

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Vyrian

USA . 3,590 parts In-Stock

1+ parts

-

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1k+ parts

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3,590

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VNN

France . 982 parts In-Stock

1+ parts

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982

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 5,746 parts In-Stock

1+ parts

$1.310

100+ parts

-

1k+ parts

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10k+ parts

$1.284

5,746

$1.310

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$1.284

Argo Parts USA

USA . 1,945 parts In-Stock

1+ parts

$1.310

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1,945

$1.310

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Netroflash

USA . 100 parts In-Stock

1+ parts

$1.310

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100

$1.310

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Aztec Data Supply Inc.

USA . 322 parts In-Stock

1+ parts

$2.660

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322

$2.660

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Corohmni

South Africa . 61 parts In-Stock

1+ parts

$3.309

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61

$3.309

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AZTECH Wire

Italy . 474 parts In-Stock

1+ parts

$8.312

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474

$8.312

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Ampacity Inc.

Singapore . 841 parts In-Stock

1+ parts

$12.000

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841

$12.000

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RGB Technical Solutions

Ukraine . 2,577 parts In-Stock

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2,577

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Microchip USA

USA . 927 parts In-Stock

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927

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Overview

Unlock the power of reliable data storage with the 25LC128-E/ST16KVAO by Microchip Technology. As a leading manufacturer in the industry, Microchip Technology ensures top-notch quality and performance. This EEPROM is perfect for a wide range of applications, offering seamless operation and durability. With its high endurance and fast write cycle time, customers can trust that their data is safe and secure. Experience the convenience and peace of mind that this product brings, making it an essential component for any project or system.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product durable and lightweight, ideal for various applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation, making this product convenient for production processes.

Screening Level: AEC-Q100

AEC-Q100 screening level ensures high reliability and quality, making this product suitable for automotive applications.

Package Shape: RECTANGULAR

The rectangular package shape provides a compact design, saving space and allowing for easy integration into systems.

Operating Mode: SYNCHRONOUS

The synchronous operating mode ensures precise and coordinated data transfer, making this product efficient and reliable.

Nominal Supply Voltage (Vsup): 5 V

The nominal supply voltage of 5V provides compatibility with standard power sources, making this product easy to use in various setups.

No. of Terminals: 8

With 8 terminals, this product offers ample connectivity options, enhancing flexibility in connectivity and application usage.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch package style allows for space-saving and lightweight design, perfect for compact devices.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, this product can withstand harsh environments and extended use.

Organization: 16KX8

The 16KX8 organization offers a decent memory capacity, suitable for storing and accessing a moderate amount of data efficiently.

Technical Specifications

EEPROM 25LC128-E/ST16KVAO attributes and parameters. Explore more EEPROM devices from Microchip Technology

Specs

Maximum Clock Frequency (fCLK):

10 MHz

Minimum Data Retention Time:

200

Endurance:

1000000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-G8

Length:

4.4 mm

Memory Density:

131072 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

8

No. of Words:

16384 words

No. of Words Code:

16K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

16KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Parallel or Serial:

SERIAL

Programming Voltage (V):

5

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.000005 Amp

Maximum Supply Current:

5 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

3 mm

Maximum Write Cycle Time (tWC):

5 ms

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

25LC128-E/ST16KVAO Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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