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25LC020AT-E/MS

Microchip Technology

25LC020AT-E/MS by Microchip Technology

25LC020AT-E/MS by Microchip Tech is a 256x8 EEPROM with 2048-bit memory density. Operating at 5V, it offers 1000000 write/erase cycles and SPI serial bus type for automotive applications. With a max clock frequency of 10MHz, it supports synchronous operation and hardware/software write protection.

Median Price

$0.740

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 59 parts In-Stock

1+ parts

$0.740

100+ parts

-

1k+ parts

-

10k+ parts

-

59

$0.740

-

-

-

Vyrian

USA . 6,635 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,635

-

-

-

-

VNN

France . 100 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

100

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bastille Electronics

Australia . 10 parts In-Stock

1+ parts

$0.740

100+ parts

$0.703

1k+ parts

$0.668

10k+ parts

$0.659

10

$0.740

$0.703

$0.668

$0.659

AZTECH Wire

Italy . 320 parts In-Stock

1+ parts

$17.997

100+ parts

-

1k+ parts

-

10k+ parts

-

320

$17.997

-

-

-

Ampacity Inc.

Singapore . 588 parts In-Stock

1+ parts

$29.000

100+ parts

-

1k+ parts

-

10k+ parts

-

588

$29.000

-

-

-

Marpe Global Electronics

Taiwan . 3,159 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,159

-

-

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QualityLine Systems

Poland . 3,159 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,159

-

-

-

-

XL Components Corporation

Australia . 3,159 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,159

-

-

-

-

Overview

Unlock endless possibilities with the 25LC020AT-E/MS by Microchip Technology. As a leading manufacturer in the industry, Microchip delivers top-notch quality and reliability in their EEPROM products. Perfect for automotive applications, this small outline package offers hardware/software write protection and a wide operating temperature range. With 256 words of memory and 1000000 write/erase cycles endurance, this EEPROM is ideal for your next project. Experience the value and benefits of Microchip's trusted technology today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy material ensures reliability and longevity of the product.

Surface Mount: YES

Easy installation and space-saving design make this product convenient for various applications.

Screening Level: AEC-Q100

This high screening level ensures the product meets automotive industry standards and requirements.

Package Shape: SQUARE

The square shape allows for efficient use of space on PCBs, making it ideal for compact designs.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures accurate and synchronized data transfer, enhancing overall performance.

Nominal Supply Voltage (Vsup): 5V

The 5V supply voltage provides stable power for consistent and reliable operation.

Power Supplies: 3/5V

Dual power supply options offer flexibility and compatibility with different systems.

No. of Terminals: 8

The 8 terminals provide ample connectivity options for easy integration into existing circuits.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space and allows for high-density mounting.

Maximum Operating Temperature: 125 °C

With a high operating temperature range, this product can withstand harsh environmental conditions.

Organization: 256X8

The 256x8 organization structure provides ample memory capacity for storing data efficiently.

Minimum Operating Temperature: -40 °C

The wide temperature range ensures reliable performance even in extreme cold conditions.

Terminal Finish: Matte Tin (Sn)

The matte tin finish ensures good contact reliability and solderability for long-term use.

Terminal Position: DUAL

Dual terminal positions offer flexibility in circuit board layout and connection options.

Write Protection: HARDWARE/SOFTWARE

Dual write protection options provide added security for stored data.

Maximum Seated Height: 1.1 mm

The low profile design allows for efficient use of space in compact devices.

Maximum Clock Frequency (fCLK): 10 MHz

The high clock frequency enables fast data transfer and processing speeds.

Width: 3 mm

The compact width of the product makes it suitable for use in tight spaces and small devices.

Minimum Supply Voltage (Vsup): 2.5V

The low minimum supply voltage allows for operation in low-power applications.

Maximum Time At Peak Reflow Temperature: 40s

The maximum reflow time ensures proper soldering and reliability during manufacturing.

Peak Reflow Temperature: 260C

The high peak reflow temperature tolerance ensures durability and stability during assembly processes.

Length: 3 mm

The compact length of the product allows for space-efficient placement on PCBs.

Programming Voltage (V): 5V

The 5V programming voltage supports reliable and accurate data programming.

Temperature Grade: AUTOMOTIVE

Designed for automotive use, this product meets industry standards for temperature resistance and reliability.

Technology: CMOS

The CMOS technology ensures low power consumption and high-speed performance.

Parallel or Serial: SERIAL

Serial data transfer allows for efficient communication and integration with other devices.

Terminal Form: GULL WING

The gull wing terminal form provides secure connections and ease of soldering during installation.

Maximum Supply Current: 5 mA

With a low supply current requirement, this product is energy-efficient and suitable for battery-powered devices.

No. of Words: 256 words

The 256-word capacity provides ample memory storage for various data types.

Memory Width: 8

The 8-bit memory width allows for efficient data access and manipulation.

Minimum Data Retention Time: 200

The minimum data retention time ensures stored data remains intact for extended periods.

Terminal Pitch: 0.65 mm

The small terminal pitch allows for high-density mounting on PCBs for space-saving designs.

No. of Words Code: 256

The 256-word code capacity offers versatility in data storage and retrieval.

Maximum Supply Voltage (Vsup): 5.5V

The high maximum supply voltage tolerance ensures stable operation and protection against voltage spikes.

Endurance: 1000000 Write/Erase Cycles

High endurance capacity allows for frequent read/write operations without compromising performance.

Serial Bus Type: SPI

The SPI bus type enables fast and efficient serial communication with other devices.

Maximum Write Cycle Time (tWC): 5 ms

The short write cycle time ensures quick and efficient data programming for time-sensitive applications.

Memory Density: 2048 bit

The high memory density provides ample storage capacity for various data types.

Memory IC Type: EEPROM

Equipped with EEPROM memory technology, this product offers non-volatile data storage and programmability.

Maximum Standby Current: 0.000005 Amp

With ultra-low standby current, this product is energy-efficient and ideal for long-term use.

Technical Specifications

EEPROM 25LC020AT-E/MS attributes and parameters. Explore more EEPROM devices from Microchip Technology

Specs

Maximum Clock Frequency (fCLK):

10 MHz

Minimum Data Retention Time:

200

Endurance:

1000000 Write/Erase Cycles

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e3

Length:

3 mm

Memory Density:

2048 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

8

No. of Words:

256 words

No. of Words Code:

256

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

256X8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Programming Voltage (V):

5

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

1.1 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.000005 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

5 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

3 mm

Maximum Write Cycle Time (tWC):

5 ms

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

25LC020AT-E/MS Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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