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24LC128T-I/ST14

Microchip Technology

24LC128T-I/ST14 by Microchip Technology

24LC128T-I/ST14 by Microchip is a 16KX8 EEPROM with 131072 bit memory density. It operates at 0.4 MHz clock frequency, has 1000000 Write/Erase cycles endurance, and uses I2C serial bus type. Ideal for industrial applications due to its -40 to 85 °C operating temperature range and small outline package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,803 parts In-Stock

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VNN

France . 2,118 parts In-Stock

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GES GmbH

Germany . 50 parts In-Stock

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50

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 3,862 parts In-Stock

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$3.890

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3,862

$3.890

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Corohmni

South Africa . 13 parts In-Stock

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$4.788

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13

$4.788

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AZTECH Wire

Italy . 564 parts In-Stock

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$19.751

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564

$19.751

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Ampacity Inc.

Singapore . 1,461 parts In-Stock

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$24.000

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1,461

$24.000

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Marpe Global Electronics

Taiwan . 6,875 parts In-Stock

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6,875

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Continental Prestige Electronics

USA . 6,816 parts In-Stock

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QualityLine Systems

Poland . 4,325 parts In-Stock

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XL Components Corporation

Australia . 3,733 parts In-Stock

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Bastille Electronics

Australia . 450 parts In-Stock

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450

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Argo Parts USA

USA . 430 parts In-Stock

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430

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Microchip USA

USA . 151 parts In-Stock

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Overview

Unlock the power of reliable data storage with the 24LC128T-I/ST14 by Microchip Technology. This high-quality EEPROM offers unparalleled endurance with 1,000,000 write/erase cycles and a wide operating temperature range, making it ideal for industrial applications. With a compact design and low power consumption, this memory IC is perfect for space-constrained projects that require dependable performance. Trust Microchip Technology to deliver cutting-edge solutions that provide lasting value and peace of mind.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability for long-term use.

Surface Mount: YES

The surface mount feature allows for easy installation and integration into a variety of circuit designs.

Package Shape: RECTANGULAR

The rectangular shape provides a compact and space-saving design for efficient use of board space.

Operating Mode: SYNCHRONOUS

The synchronous operation mode ensures accurate and synchronized data transfer for optimal performance.

Nominal Supply Voltage / Vsup (V): 3

The 3V nominal supply voltage offers compatibility with a wide range of electronic devices.

Power Supplies (V): 3/5

The support for both 3V and 5V power supplies allows for versatile compatibility with different systems.

No. of Terminals: 14

The 14 terminals provide ample connectivity options for seamless integration with other components.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch package style offer space-saving and high-density mounting options.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliability even in harsh environmental conditions.

Organization: 16KX8

The 16KX8 organization allows for efficient storage and retrieval of data in a structured format.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature enables reliable performance in extreme cold conditions.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides a durable and corrosion-resistant coating for long-term use.

I2C Control Byte: 1010DDDR

The I2C control byte simplifies communication and control, enhancing the overall functionality of the product.

Terminal Position: DUAL

The dual terminal position offers flexibility and ease of connection in various circuit configurations.

Write Protection: HARDWARE

The hardware write protection feature ensures data security and prevents accidental data loss.

Maximum Seated Height: 1.1 mm

The low maximum seated height allows for a compact and space-efficient installation.

Maximum Clock Frequency (fCLK): 0.4 MHz

The high maximum clock frequency enables fast data transfer and processing speeds.

Width: 4.4 mm

The compact width of 4.4mm ensures compatibility with small form factor devices.

Minimum Supply Voltage (Vsup): 2.5 V

The 2.5V minimum supply voltage ensures compatibility with a wide range of power sources.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures reliable soldering during manufacturing processes.

Length: 5 mm

The short length of 5mm provides a space-saving design for efficient board layouts.

Temperature Grade: INDUSTRIAL

The industrial temperature grade makes this product suitable for operation in harsh industrial environments.

Technology: CMOS

The CMOS technology offers low power consumption and high-speed operation for improved efficiency.

Parallel or Serial: SERIAL

The serial communication interface allows for easy data transfer and compatibility with various systems.

Terminal Form: GULL WING

The gull wing terminal form provides secure solder joints for reliable connectivity.

Maximum Supply Current: 3 mA

The low maximum supply current helps conserve energy and prolong battery life.

No. of Words: 16384 words

The 16384 words capacity allows for ample storage of data in the EEPROM.

Memory Width: 8

The memory width of 8 bits enables efficient data storage and retrieval in byte-sized chunks.

Minimum Data Retention Time: 200

The minimum data retention time of 200 years ensures data integrity and longevity.

Terminal Pitch: 0.65 mm

The small terminal pitch of 0.65mm enables high-density mounting for space-efficient designs.

No. of Words Code: 16K

The 16K words code provides a standardized format for data storage and retrieval.

Maximum Supply Voltage (Vsup): 5.5 V

The 5.5V maximum supply voltage ensures compatibility with a wide range of power sources.

Endurance: 1000000 Write/Erase Cycles

The high endurance rating of 1,000,000 write/erase cycles ensures long-lasting performance.

Serial Bus Type: I2C

The I2C serial bus type allows for easy interfacing with other devices and systems.

Maximum Write Cycle Time (tWC): 5 ms

The short maximum write cycle time of 5ms allows for fast data updates and modifications.

Memory Density: 131072 bit

The high memory density of 131,072 bits provides ample storage capacity for data-intensive applications.

Memory IC Type: EEPROM

The EEPROM memory IC type offers non-volatile data storage with fast read/write capabilities.

Maximum Standby Current: 0.000001 Amp

The low maximum standby current helps minimize power consumption during idle periods.

Technical Specifications

EEPROM 24LC128T-I/ST14 attributes and parameters. Explore more EEPROM devices from Microchip Technology

Specs

Additional Features:

1000000 ERASE/WRITE CYCLES, HARDWARE WRITE PROTECT, DATA RETENTION > 200 YEARS

Maximum Clock Frequency (fCLK):

.4 MHz

Minimum Data Retention Time:

200

Endurance:

1000000 Write/Erase Cycles

I2C Control Byte:

1010DDDR

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e3

Length:

5 mm

Memory Density:

131072 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

14

No. of Words:

16384 words

No. of Words Code:

16K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

16KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Serial Bus Type:

I2C

Maximum Standby Current:

.000001 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

3 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Maximum Write Cycle Time (tWC):

5 ms

Write Protection:

HARDWARE

Trade Compliance

24LC128T-I/ST14 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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