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24LC024-E/ST

Microchip Technology

24LC024-E/ST by Microchip Technology

24LC024-E/ST by Microchip Tech is an EEPROM with 256x8 organization, I2C control byte 1010DDDR, and 2048-bit memory density. It operates in synchronous mode at a max clock frequency of 0.4 MHz. Ideal for automotive applications due to TS16949 screening level and -40 to 125 °C temp range.

Median Price

$0.530

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 27,300 parts In-Stock

1+ parts

$0.480

100+ parts

$0.450

1k+ parts

$0.430

10k+ parts

$0.410

27,300

$0.480

$0.450

$0.430

$0.410

Mouser Electronics

USA . 327 parts In-Stock

1+ parts

$0.580

100+ parts

$0.487

1k+ parts

$0.481

10k+ parts

$0.476

327

$0.580

$0.487

$0.481

$0.476

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

NAC Semi

USA . 21,800 parts In-Stock

1+ parts

$0.520

100+ parts

$0.470

1k+ parts

$0.420

10k+ parts

-

21,800

$0.520

$0.470

$0.420

-

Vyrian

USA . 8,819 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,819

-

-

-

-

VNN

France . 2,727 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,727

-

-

-

-

Nova Conductors

Japan . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

500

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

QUARKTWIN TECHNOLOGY LTD

USA . 17,228 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

17,228

-

-

-

-

West Coast Incorporated

USA . 4,738 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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4,738

-

-

-

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Netroflash

USA . 50 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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50

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-

-

Overview

Unlock the power of reliable data storage with the 24LC024-E/ST by Microchip Technology. Crafted with precision and expertise, this EEPROM device offers unmatched quality and performance for a variety of applications. Seamlessly integrated into automotive systems, IoT devices, and industrial machinery, this compact yet powerful memory solution ensures seamless operation and enhanced reliability. Experience the value of superior technology and innovation with the 24LC024-E/ST, where quality meets excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable material that can withstand harsh environments, making it suitable for automotive applications.

Surface Mount: YES

Easily mountable on PCBs for efficient assembly and space-saving.

Nominal Supply Voltage / Vsup (V): 5

Operates at a common and stable supply voltage, making it compatible with various systems.

Maximum Operating Temperature: 125 °C

Can operate in high temperature conditions without performance degradation.

Memory Density: 2048 bit

Offers a good amount of memory storage for data retention and retrieval.

Endurance: 1000000 Write/Erase Cycles

High endurance for repeated read/write operations, ensuring longevity and reliability.

Serial Bus Type: I2C

Utilizes the widely-used I2C communication protocol for easy integration and communication with other components.

Technical Specifications

EEPROM 24LC024-E/ST attributes and parameters. Explore more EEPROM devices from Microchip Technology

Specs

Maximum Clock Frequency (fCLK):

.4 MHz

Minimum Data Retention Time:

200

Endurance:

1000000 Write/Erase Cycles

I2C Control Byte:

1010DDDR

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.4 mm

Memory Density:

2048 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

8

No. of Words:

256 words

No. of Words Code:

256

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

256X8

Output Characteristics:

OPEN-DRAIN

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Programming Voltage (V):

5

Qualification:

Not Qualified

Screening Level:

TS 16949

Maximum Seated Height:

1.2 mm

Serial Bus Type:

I2C

Maximum Standby Current:

.000005 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

3 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

3 mm

Maximum Write Cycle Time (tWC):

5 ms

Write Protection:

HARDWARE

Trade Compliance

24LC024-E/ST Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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