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24AA128-I/SM

Microchip Technology

24AA128-I/SM by Microchip Technology

24AA128-I/SM by Microchip Technology is an EEPROM with 16KX8 organization, I2C serial bus type, and 1000000 Write/Erase Cycles endurance. It operates at a max clock frequency of 0.4 MHz and is ideal for industrial applications requiring reliable non-volatile memory storage.

Median Price

$0.830

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 339 parts In-Stock

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$0.830

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339

$0.830

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Vyrian

USA . 4,270 parts In-Stock

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4,270

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VNN

France . 2,344 parts In-Stock

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2,344

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Nova Conductors

Japan . 10 parts In-Stock

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Semicontronic

India . 6,270 parts In-Stock

1+ parts

$0.680

100+ parts

$0.663

1k+ parts

$0.660

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6,270

$0.680

$0.663

$0.660

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Aztec Data Supply Inc.

USA . 1,120 parts In-Stock

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$2.180

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Corohmni

South Africa . 749 parts In-Stock

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$2.288

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Microchip USA

USA . 2,349 parts In-Stock

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$5.200

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2,349

$5.200

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Andel Nordic

Denmark . 4,985 parts In-Stock

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$7.872

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$7.557

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$7.557

4,985

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$7.557

AZTECH Wire

Italy . 540 parts In-Stock

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$10.117

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540

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RGB Technical Solutions

Ukraine . 7,689 parts In-Stock

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Continental Prestige Electronics

USA . 6,477 parts In-Stock

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Lixinc

USA . 3,698 parts In-Stock

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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Argo Parts USA

USA . 2,002 parts In-Stock

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Bastille Electronics

Australia . 900 parts In-Stock

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900

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Perfect Parts

USA . 774 parts In-Stock

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774

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Overview

Unlock the power of reliable data storage with the 24AA128-I/SM by Microchip Technology. Crafted with precision and expertise, this EEPROM memory device offers unparalleled quality and durability for a wide range of industrial applications. With its high endurance of 1,000,000 write/erase cycles and fast write cycle time of 5 ms, this versatile component ensures seamless performance and long-lasting reliability. Trust Microchip Technology for cutting-edge technology that delivers exceptional value and unmatched benefits to meet your specific needs. Elevate your projects with the 24AA128-I/SM and experience the innovation firsthand.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and protection for the EEPROM, ensuring a long lifespan.

Surface Mount: YES

The surface mount capability makes it easy to integrate this EEPROM into electronic circuit boards, saving space and simplifying assembly.

Nominal Supply Voltage / Vsup (V): 2.5

The 2.5V nominal supply voltage ensures compatibility with a wide range of electronics and power sources.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this EEPROM is suitable for industrial environments where temperature fluctuations may occur.

Memory Density: 131072 bit

The high memory density of 131072 bits allows for storing a large amount of data in a compact EEPROM, making it ideal for applications that require extensive data storage.

Memory IC Type: EEPROM

Being an EEPROM (Electrically Erasable Programmable Read-Only Memory) ensures that the data stored in this IC can be easily updated or modified as needed.

Technical Specifications

EEPROM 24AA128-I/SM attributes and parameters. Explore more EEPROM devices from Microchip Technology

Specs

Maximum Clock Frequency (fCLK):

.4 MHz

Minimum Data Retention Time:

200

Endurance:

1000000 Write/Erase Cycles

I2C Control Byte:

1010DDDR

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

5.26 mm

Memory Density:

131072 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

8

No. of Words:

16384 words

No. of Words Code:

16K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

16KX8

Output Characteristics:

OPEN-DRAIN

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5

Programming Voltage (V):

2.5

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

2.03 mm

Serial Bus Type:

I2C

Maximum Standby Current:

.000005 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

3 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.7 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

5.25 mm

Maximum Write Cycle Time (tWC):

5 ms

Write Protection:

HARDWARE

Trade Compliance

24AA128-I/SM Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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