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1N5712-1

Microchip Technology

1N5712-1 by Microchip Technology

RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;

Median Price

$4.139

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 21 parts In-Stock

1+ parts

$3.918

100+ parts

$3.730

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-

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21

$3.918

$3.730

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Mouser Electronics

USA . 1,023 parts In-Stock

1+ parts

$4.360

100+ parts

$4.050

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-

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1,023

$4.360

$4.050

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-

DigiKey

USA . 727 parts In-Stock

1+ parts

$4.360

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$4.050

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-

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727

$4.360

$4.050

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Verical

USA . 21 parts In-Stock

1+ parts

-

100+ parts

$3.730

1k+ parts

-

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21

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$3.730

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

NAC Semi

USA . 45 parts In-Stock

1+ parts

$4.590

100+ parts

$4.160

1k+ parts

$3.800

10k+ parts

-

45

$4.590

$4.160

$3.800

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Velocity Electronics

USA . 416 parts In-Stock

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416

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North Shore Components

USA . 416 parts In-Stock

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416

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 6,226 parts In-Stock

1+ parts

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6,226

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Marpe Global Electronics

Taiwan . 6,076 parts In-Stock

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6,076

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XL Components Corporation

Australia . 3,409 parts In-Stock

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3,409

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Assy Fe

Spain . 1,000 parts In-Stock

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1,000

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QualityLine Systems

Poland . 982 parts In-Stock

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982

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Cyclops Electronics Ltd (Excess)

UK . 6 parts In-Stock

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6

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Technical Specifications

Diodes & Rectifiers 1N5712-1 attributes and parameters. Explore more Diodes & Rectifiers devices from Microchip Technology

Specs

Additional Features:

METALLURGICALLY BONDED

Case Connection:

ISOLATED

Config:

SINGLE

Diode Element Material:

SILICON

Diode Type:

JEDEC-95 Code:

DO-35

JESD-30 Code:

O-LALF-W2

JESD-609 Code:

e0

No. of Elements:

1

No. of Phases:

1

No. of Terminals:

2

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-65 Cel

Maximum Output Current:

.075 A

Package Body Material:

GLASS

Package Shape:

Package Style (Meter):

LONG FORM

Qualification:

Not Qualified

Reference Standard:

MIL-S-19500/445

Surface Mount:

NO

Technology:

SCHOTTKY

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Position:

Trade Compliance

1N5712-1 Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.70

SB

8541.10.00.70

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

Category top products 20

Authentic purchasing experiences

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