Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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PROXIMITY SENSOR,PHOTOELECTRIC; Mounting Feature: SURFACE MOUNT; Package Shape or Style: RECTANGULAR; Housing: EPOXY RESIN; Body Width: 2.1 inch; Body Length/Diameter: 8.5 mm;
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11 July 2012 a US diversified manufacturing company Standex International Corporation (NYSE:SXI) announced the all-cash acquisition of German-based Meder Electronic GmbH without providing information on deal specifics. The capabilities and solutions Standex Electronics offers are robust. The impressively long list of items our company and teams can deliver to are led through our focus on customer driven innovation, and commitment to absolute customer satisfaction. At the soul of what we do is the passion our Engineers have to solve your toughest challenges, Sales Leaders who drive a relationship with a customer first attitude, and Operations who engage their work centered on delivering caring service and quality products. By leveraging our global resources that offer premier sales support, engineering leadership, and technical resources – we partner with you for customer-specific product development, and related manufacturing services. With our expert engineering staff and cutting-edge manufacturing capabilities, we are well-equipped to produce unique solutions for just about any environment or application. Whether it is a standard product, or need for a custom solution, we can utilize our diverse capabilities and dynamic solutions to partner with you around your engineering, design, and manufacturing needs to deliver quality results. The following are ways we enthusiastically partner with customers to solve problems, and deliver reliable high-quality results. Capabilities and solutions include, but are not limited to: CAPABILITIES Thermoset Molding • Thermoplastic inset molding (Horizontal and Vertical) • Vertical (inset molding) • Injection Molded Part Designs • PCB Assembly • Potting and Encapsulation • Environmental and Durability Testing • Stamping (terminals) • Soldering • Bobbin Winding (CNC, fine and heavy wire/foil) • Toroid Winding • Glass to Metal Sealing • Magnetic Mapping • Reed Switch Application Engineering • Stainless Steel Fabrication and Laser Welding • Reed Switch Manufacturing (precious metal plating, glass to metal sealing) • Hermetic Seals (glass to metal) • CNC Machining / Tooling Capabilities • Transformer Engineering and Testing • Reed Relay Design (standard and RF) • Wire Harness Processing • Specialized Sensor, Relay, and Reed Switch Test System for Design and Fabrication SOLUTIONS Engineering • Design • Custom Tooling • Machine Shop Fabrication • Supply Chain Management • Testing (Validation Testing) • Measurement • Prototyping • Process Development • Project Management • Regulatory Expertise • Custom Transformer Design • Custom Mechanical Packaging of Sensors, Reed Switches, and Reed Relays • World Class Quality Systems and Tools • Global Footprint for Design, Sourcing, Manufacturing, and Logistics • Vertical Integration • 3-D Printing
BAV99
Rfe International
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
M39029/56-351
Amphenol
CONNECTOR ACCESSORY; Minimum Operating Temperature: -65 Cel; Additional Features: STANDARD: MIL-DTL-38999; Contact Gender: FEMALE; MIL-Connector Accessory Name: CONTACT; Associated Military - Specifications: MIL-DTL-38999;
MBRS360T3G
Onsemi
MBRS360T3G by Onsemi is a Schottky rectifier diode with a max forward voltage of 0.63V and a max output current of 3A. It is designed for applications requiring high-speed switching and low power loss, making it suitable for use in various electronic devices.
Lite-on Technology
RECTIFIER DIODE; Surface Mount: YES; Terminal Finish: Tin/Lead (Sn/Pb); Maximum Operating Temperature: 175 Cel; Maximum Output Current: .1 A; Maximum Reverse Recovery Time: .006 us;
2N2222A
Microsemi
NPN; Configuration: SINGLE; Surface Mount: NO; Maximum Collector Current (IC): .8 A; Minimum DC Current Gain (hFE): 30; No. of Elements: 1;
BSS138
National Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Maximum Feedback Capacitance (Crss): 10 pF; JEDEC-95 Code: TO-236AB;
Sipex
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Moisture Sensitivity Level (MSL): 1; Peak Reflow Temperature (C): 240;
Philips Semiconductors
RECTIFIER DIODE; Surface Mount: YES; Maximum Output Current: .1 A; Peak Reflow Temperature (C): 260; Terminal Finish: MATTE TIN; Maximum Reverse Recovery Time: .006 us;
1N4148
Laube Technology
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
M39029/58-360
Itt Cannon
CONNECTOR ACCESSORY; Alternate Contacts: 030-2042-000; DIN Conformity: NO; Contact Gender: MALE; Terminal Type: WIRE; MIL-Connector Accessory Name: CONTACT;
MBRS130LT3G
Rochester Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: J BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148WT
Diotec Semiconductor Ag
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
INA826AIDGKR
Texas Instruments
INA826AIDGKR by Texas Instruments is an instrumentation amplifier with 150uV max input offset voltage, 0.095uA max average bias current, and 1MHz nominal bandwidth. Ideal for automotive applications due to its -40 to 125 °C operating temperature range and high common mode rejection ratio of 120dB.
NE555DR
NE555DR by Texas Instruments is an Analog Waveform Generation IC with 8 terminals, operating voltage of 5V, and power supplies ranging from 5-15V. It is a versatile component for pulse generation applications due to its small outline package and commercial temperature grade suitability.
CRCW040210K0FKED
Vishay Intertechnology
Vishay Intertechnology's CRCW040210K0FKED is a fixed resistor with 10000 ohm resistance, 1% tolerance, and 0.063 W power dissipation. Ideal for surface mount applications in electronics due to its compact SMT package style and high operating temperature range of -55 to 155 °C.
SMBJ18CA
Uniohm
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LL4148GS08
Temic Semiconductors
LL4148GS08 by Temic Semiconductors is a glass diode with a max reverse recovery time of 0.008 us and max forward voltage of 1 V. It is a rectifier diode with a max output current of 0.15 A, ideal for applications requiring fast switching speeds and low power dissipation in electronic circuits.
ULN2803ADWG4
ULN2803ADWG4 by Texas Instruments is a peripheral driver with 8 functions, open-collector output characteristics, and built-in transient protections. It operates at temperatures ranging from -40 to 85°C and has a max supply voltage of 3V. Ideal for applications requiring sink current flow direction in a small outline package style.
1N4148WS
General Instrument
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
QS30E
Hans Turck & Kg
PROXIMITY SENSOR,PHOTOELECTRIC;
MK02/0-1A66-500W
Meder Electronic Ag
PROXIMITY SENSOR,PHOTOELECTRIC; Mounting Feature: PANEL MOUNT; Package Shape or Style: RECTANGULAR; Response Time: 100 us; Termination Type: CABLE; Additional Features: IT ALSO OPERATES AT -5 TO 80 DEGREE CENTIGRADE;
ZS-00434-01
Honeywell Sensing And Control
ZS-00434-01 by Honeywell is an inductive proximity sensor with a 2mm to 2.99mm measurement range, suitable for applications requiring precise detection within this range. It operates b/w -40°C to 100°C, with a max supply voltage of 33V and stainless steel housing for durability. The sensor features a 3-wire interface output and termination via connector/wire connection.
E51SAL
Eaton Corporation
Proximity Sensors;
MK03-1A66C-500W
Standex-meder Electronics
MK03-1A66C-500W by Standex-Meder Electronics is a proximity sensor with a body height of 25.5mm and response time of 100us. It operates b/w -20°C to 85°C, housed in PBT glass fibre reinforced material. Ideal for applications requiring precise detection in industrial automation systems.
MK17-B-3
PROXIMITY SENSOR,PHOTOELECTRIC; Mounting Feature: SURFACE MOUNT; Package Shape or Style: RECTANGULAR; Body Width: 2.1 inch; Minimum Operating Temperature: -40 Cel; Housing: EPOXY RESIN;
BI5-M18-VP4X-H1141
BI5-M18-VP4X-H1141 by Hans Turck & KG is an inductive proximity sensor with PNP output type. It operates b/w -25 to 70°C, with a supply voltage range of 10-65V and max current of 200mA. Ideal for flush mounting applications due to its cylindrical metal housing design.
MK16-C-2
MK16-C-2 by Standex-Meder Electronics is a proximity sensor with dimensions 2.3" x 2.3mm x 11.5mm, operating b/w -40°C to 130°C. Housed in epoxy resin, it features solder termination and surface mount capability, ideal for photoelectric sensing applications.
CR18-8DN
Autonics
Autonics CR18-8DN is a 3-WIRE DC, NPN, NO proximity sensor with a measurement range of 0-8.8mm. Operating b/w -25 to 70°C, it has a supply voltage range of 10-30V and max current of 15mA. Ideal for industrial automation applications requiring precise object detection in tight spaces.
59135-3-V-04-D
Littelfuse
PROXIMITY SENSOR,PHOTOELECTRIC; Mounting Feature: FLANGE MOUNT; Package Shape or Style: RECTANGULAR; Termination Type: CABLE; Body Length/Diameter: 28.57 mm; Body Height: 3.43 mm;
VCNL4040M3OE-H5
MK23-90-B-2
PROXIMITY SENSOR,PHOTOELECTRIC; Mounting Feature: PANEL MOUNT; Package Shape or Style: CYLINDRICAL; Body Height: 2.8 mm; Minimum Operating Temperature: -40 Cel; Maximum Operating Temperature: 130 Cel;
59065-1-U-05-E
PROXIMITY SENSOR,PHOTOELECTRIC; Package Shape or Style: CYLINDRICAL; Body Height: 38.1 mm; Maximum Operating Current: 500 mA; Termination Type: CABLE; Response Time: 1000 us;
CD50CNF07NC
Carlo Gavazzi Holding Ag
CD50CNF07NC by Carlo Gavazzi Holding Ag is a 7x50x30 mm capacitive proximity sensor with NPN, NC output. It operates b/w 0-60°C with a supply voltage range of 9-33V. Ideal for board mounting applications, it has a measurement range of 0-7mm and uses a 3-wire interface for connection.
59170-1-T-00-D
Littelfuse 59170-1-T-00-D is a rectangular proximity sensor with dimensions of 2.29" x 2.29mm x 11.43mm, operating b/w -40°C to 125°C. It has a response time of 1000µs and uses solder termination for surface mount applications in various industries.
59150-1-T-02-F
PROXIMITY SENSOR,PHOTOELECTRIC; Mounting Feature: FLANGE MOUNT; Package Shape or Style: RECTANGULAR; Termination Type: CABLE; Body Length/Diameter: 28.57 mm; Response Time: 1000 us;
H1512-001
NXP Semiconductors
PROXIMITY SENSOR,HALL EFFECT; Output Type: ANALOG CURRENT; Package Shape or Style: ROUND; Maximum Measurement Range (mm): 1.52 mm; Body Length/Diameter: 1 mm; Minimum Measurement Range (mm): .12 mm;
MK23-35-D-2
MK23-35-D-2 by Standex-Meder Electronics is a cylindrical proximity sensor with a body length of 10.5 mm. It operates in temperatures ranging from -40 to 130 °C and has a surface mounting feature. It is commonly used in applications requiring photoelectric proximity sensing.
59145-3-T-02-F
PROXIMITY SENSOR,PHOTOELECTRIC; Mounting Feature: FLANGE MOUNT; Package Shape or Style: RECTANGULAR; Body Length/Diameter: 28.57 mm; Body Height: 6.35 mm; Minimum Operating Temperature: -40 Cel;
IME08-02BPSZT0S
Sick Ag
IME08-02BPSZT0S by Sick Ag is an inductive proximity sensor with PNP, NO output. It operates b/w -25 to 75 °C and has a measurement range of 0-2 mm. With a cylindrical shape and brass nickel plated housing, it is ideal for flush mounting applications.
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MK17-B-2
PROXIMITY SENSOR,PHOTOELECTRIC; Mounting Feature: SURFACE MOUNT; Package Shape or Style: RECTANGULAR; Body Length/Diameter: 8.5 mm; Minimum Operating Temperature: -40 Cel; Body Width: 2.1 inch;
Standex-Meder Electronics
MK17-B-2 by Standex-Meder Electronics is a 2.1" proximity sensor with a response time of 100 us. Ideal for surface mount applications, it operates b/w -40°C to 130°C temperatures. Featuring epoxy resin housing, this rectangular sensor is perfect for photoelectric sensing needs.
MK17-B-1
PROXIMITY SENSOR,PHOTOELECTRIC; Mounting Feature: SURFACE MOUNT; Package Shape or Style: RECTANGULAR; Maximum Operating Temperature: 130 Cel; Body Height: 2.1 mm; Body Length/Diameter: 8.5 mm;
PROXIMITY SENSOR,PHOTOELECTRIC; Mounting Feature: SURFACE MOUNT; Package Shape or Style: RECTANGULAR; Housing: EPOXY RESIN; Body Width: 2.1 inch; Minimum Operating Temperature: -40 Cel;
MK17-B-2BULK
PROXIMITY SENSOR,PHOTOELECTRIC; Mounting Feature: SURFACE MOUNT; Package Shape or Style: RECTANGULAR; Body Length/Diameter: 8.5 mm; Body Width: 2.1 inch; Housing: EPOXY RESIN;
MK17-C-1
PROXIMITY SENSOR,PHOTOELECTRIC; Mounting Feature: SURFACE MOUNT; Package Shape or Style: RECTANGULAR; Body Height: 2.1 mm; Body Length/Diameter: 8.5 mm; Termination Type: SOLDER;
PROXIMITY SENSOR,PHOTOELECTRIC; Mounting Feature: SURFACE MOUNT; Package Shape or Style: RECTANGULAR; Body Width: 2.1 inch; Maximum Operating Temperature: 130 Cel; Body Length/Diameter: 8.5 mm;
MK17-C-2
PROXIMITY SENSOR,PHOTOELECTRIC; Mounting Feature: SURFACE MOUNT; Package Shape or Style: RECTANGULAR; Termination Type: SOLDER; Body Height: 2.1 mm; Housing: EPOXY RESIN;
PROXIMITY SENSOR,PHOTOELECTRIC; Mounting Feature: SURFACE MOUNT; Package Shape or Style: RECTANGULAR; Housing: EPOXY RESIN; Response Time: 100 us; Minimum Operating Temperature: -40 Cel;
MK17-B-3 by Standex-Meder Electronics is a proximity sensor with dimensions of 2.1" x 2.1mm x 8.5mm, operating b/w -40°C to 130°C. It has a response time of 100us and uses epoxy resin housing for surface mount applications in various industries.
MK17-B-1BULK
PROXIMITY SENSOR,PHOTOELECTRIC; Package Shape or Style: RECTANGULAR; Termination Type: SOLDER; Minimum Operating Temperature: -40 Cel; Body Width: 2.1 inch; Body Height: 2.1 mm;
MK17-B-3BULK
PROXIMITY SENSOR,PHOTOELECTRIC; Mounting Feature: SURFACE MOUNT; Package Shape or Style: RECTANGULAR; Body Length/Diameter: 8.5 mm; Minimum Operating Temperature: -40 Cel; Maximum Operating Temperature: 130 Cel;
MK17-C-2BULK
PROXIMITY SENSOR,PHOTOELECTRIC; Mounting Feature: SURFACE MOUNT; Package Shape or Style: RECTANGULAR; Body Length/Diameter: 8.5 mm; Body Width: 2.1 inch; Body Height: 2.1 mm;
MK17-E-3
PROXIMITY SENSOR,PHOTOELECTRIC; Mounting Feature: SURFACE MOUNT; Package Shape or Style: RECTANGULAR; Housing: EPOXY RESIN; Response Time: 100 us; Maximum Operating Temperature: 130 Cel;
PROXIMITY SENSOR,PHOTOELECTRIC; Package Shape or Style: RECTANGULAR; Housing: EPOXY RESIN; Body Height: 2.1 mm; Body Length/Diameter: 8.5 mm; Maximum Operating Temperature: 130 Cel;
PROXIMITY SENSOR,PHOTOELECTRIC; Mounting Feature: SURFACE MOUNT; Package Shape or Style: RECTANGULAR; Termination Type: SOLDER; Housing: EPOXY RESIN; Minimum Operating Temperature: -40 Cel;
MK17-C-3
PROXIMITY SENSOR,PHOTOELECTRIC; Mounting Feature: SURFACE MOUNT; Package Shape or Style: RECTANGULAR; Minimum Operating Temperature: -40 Cel; Housing: EPOXY RESIN; Maximum Operating Temperature: 130 Cel;
MK17-E-1
PROXIMITY SENSOR,PHOTOELECTRIC; Mounting Feature: SURFACE MOUNT; Package Shape or Style: RECTANGULAR; Maximum Operating Temperature: 130 Cel; Body Width: 2.1 inch; Housing: EPOXY RESIN;
MK17-E-2
PROXIMITY SENSOR,PHOTOELECTRIC; Mounting Feature: SURFACE MOUNT; Package Shape or Style: RECTANGULAR; Body Width: 2.1 inch; Termination Type: SOLDER; Response Time: 100 us;
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