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MTPD2601N-030

Marktech Optoelectronics

MTPD2601N-030 by Marktech Optoelectronics

PIN PHOTODIODE;

Median Price

$13.200

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 31 parts In-Stock

1+ parts

$13.200

100+ parts

$8.555

1k+ parts

$7.572

10k+ parts

-

31

$13.200

$8.555

$7.572

-

Mouser Electronics

USA . 14 parts In-Stock

1+ parts

$13.200

100+ parts

$8.550

1k+ parts

$7.570

10k+ parts

-

14

$13.200

$8.550

$7.570

-

Technical Specifications

Photodiodes MTPD2601N-030 attributes and parameters. Explore more Photodiodes devices from Marktech Optoelectronics

Specs

Optoelectronic Type:

Manufacturer Highlights

Marktech Optoelectronics

Founded in 1985, the privately held, Marktech Optoelectronics is a well-established world-class provider of detector and emitter engineering, design, manufacturing, packaging, burn-in testing, and sorting with production facilities in the USA and Japan. Marktech’s founding members leveraged their deep knowledge of industrial markets and the technical needs of design engineers to rapidly grow and expand into many industries requiring advanced photonics devices. Today, Marktech Optoelectronics is one of the world’s leading manufacturers of UV, visible, near-infrared (NIR), and short-wavelength infrared (SWIR) emitters and photodiode detectors. The company also engineers and manufactures materials such as silicon photodetector wafers, chips, and InP epiwafers. In the infrared wavelength ranges, Marktech is a vertically integrated manufacturer growing epitaxy InP wafers, fabricating InGaAs detector and emitter chips, packaging chips, and even producing completed assemblies for some OEM customers. Marktech has leading-edge packaging capabilities with the ability to package die in molded plastic through-hole, SMD, chip-scale, TO can, chip on board (COB), and their proprietary seam-welded hermetic ATLAS package. Marktech’s advanced packaging capabilities can produce multiple die components including designs with multi-wavelength emitters, multiple detectors for broadband detection, and emitter-detector combinations.

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