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LCMXO3LF-2100E-6MG121I

Lattice Semiconductor

LCMXO3LF-2100E-6MG121I by Lattice Semiconductor

LCMXO3LF-2100E-6MG121I by Lattice Semiconductor is a 2100 Logic Cells FPGA with 264 CLBs, 100 Inputs/Outputs. Operating b/w -40 to 100 °C, it's ideal for applications requiring high-density programmable ICs in compact form factors.

Median Price

$11.942

Lifecycle Status

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Arrow

USA . 490 parts In-Stock

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$11.942

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$10.240

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Verical

USA . 490 parts In-Stock

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$11.942

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$10.240

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$10.042

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Flip Electronics (Authorized)

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Vyrian

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Chip Stock

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Nova Conductors

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Microchip USA

USA . 1,283 parts In-Stock

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Ampacity Inc.

Singapore . 3,486 parts In-Stock

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Continental Prestige Electronics

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Overview

Unlock endless possibilities with the Lattice Semiconductor LCMXO3LF-2100E-6MG121I FPGA! With 2100 logic cells and 264 CLBs, this cutting-edge technology offers unparalleled flexibility and performance. Manufactured by Lattice Semiconductor, a leader in the industry, this FPGA is perfect for applications ranging from telecommunications to industrial automation. Experience seamless integration and rapid prototyping with this high-quality product, providing you with the value and innovation you need to stay ahead in today's competitive market. Elevate your projects with the LCMXO3LF-2100E-6MG121I FPGA and unleash your creativity like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes this FPGA lightweight and cost-effective.

No. of Logic Cells: 2100

Having 2100 logic cells allows for complex programmable logic designs to be implemented effectively.

Surface Mount: YES

The surface mount capability simplifies the process of mounting and soldering the FPGA onto a PCB, saving time and effort during assembly.

Maximum Supply Voltage: 1.26 V

The low maximum supply voltage of 1.26V reduces power consumption and heat dissipation, making this FPGA energy-efficient.

No. of CLBs: 264

With 264 Configurable Logic Blocks (CLBs), this FPGA offers flexibility in designing and implementing a variety of logic functions.

No. of Inputs: 100

Having 100 input pins allows for a wide range of external signals to be processed by the FPGA, enabling versatile functionality.

Package Shape: SQUARE

The square package shape provides efficient use of space on the PCB and allows for easier placement and alignment during assembly.

Form of Terminal: BALL

The use of ball terminals simplifies the process of soldering the FPGA onto the PCB, ensuring reliable electrical connections.

Nominal Supply Voltage (V): 1.2

The nominal supply voltage of 1.2V ensures stable operation and performance of the FPGA within specified voltage ranges.

No. of Terminals: 121

Having 121 terminals provides sufficient connectivity options for interfacing the FPGA with external components and circuits.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a Field Programmable Gate Array (FPGA) allows for reprogramming and reconfiguring the device for different applications, making it versatile.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The grid array package style with a very thin profile and fine pitch enhances the overall compactness and density of the FPGA on the PCB.

Minimum Supply Voltage: 1.14 V

The low minimum supply voltage of 1.14V ensures reliable operation of the FPGA even under low voltage conditions, enhancing its robustness.

Maximum Operating Temperature: 100 °C

With a maximum operating temperature of 100°C, this FPGA can withstand high-temperature environments, ensuring reliable performance in extreme conditions.

Pitch of Terminal: 0.5 mm

The fine pitch of 0.5mm between terminals allows for high-density packaging of the FPGA, saving space on the PCB.

Organization: 264 CLBs

The organization of 264 Configurable Logic Blocks (CLBs) enables efficient implementation of complex logic functions and designs.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, this FPGA can operate in cold environments without compromising performance.

Finishing of Terminal Used: TIN SILVER COPPER

The use of tin, silver, and copper finishing on the terminals ensures reliable electrical connections and prevents corrosion, enhancing the longevity of the FPGA.

Position of Terminal: BOTTOM

Having terminals positioned at the bottom of the package simplifies the routing of connections on the PCB and improves overall signal integrity.

Moisture Sensitivity Level (MSL): 3

With a Moisture Sensitivity Level of 3, this FPGA can withstand moderate exposure to moisture during handling and assembly processes.

Maximum Seated Height: 1 mm

The low maximum seated height of 1mm reduces the overall profile of the FPGA on the PCB, allowing for compact and slim designs.

Width: 6 mm

The width of 6mm provides a compact form factor for the FPGA, making it suitable for space-constrained applications.

No. of Outputs: 100

Having 100 output pins allows for the FPGA to drive a variety of external devices and circuits, expanding its functionality.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C ensures reliable soldering of the FPGA onto the PCB during assembly processes.

Length: 6 mm

The length of 6mm provides a compact and square form factor for the FPGA, allowing for efficient utilization of space on the PCB.

Technical Specifications

Field Programmable Gate Arrays (FPGA) LCMXO3LF-2100E-6MG121I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Lattice Semiconductor

IC Features

Programmable IC Type:

No. of Logic Cells:

2100

No. of Inputs:

100

No. of Outputs:

100

No. of CLBs:

264

Organization:

264 CLBS

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.14 V

Maximum Supply Voltage:

1.26 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Very Thin Profile, Fine Pitch

Package Code:

Package Shape:

Length:

6 mm

Width:

6 mm

Maximum Seated Height:

1 mm

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

.5 mm

No. of Terminals:

121

Standards

JESD-30 Code:

S-PBGA-B121

JESD-609 Code:

e1

Trade Compliance

LCMXO3LF-2100E-6MG121I Programmable ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Lattice Semiconductor

Lattice Semiconductor (NASDAQ: LSCC) is the low power programmable leader. We solve customer problems across the network, from the Edge to the Cloud, in the growing communications, computing, industrial, automotive and consumer markets. Our technology, long-standing relationships, and commitment to world-class support lets our customers quickly and easily unleash their innovation to create a smart, secure and connected world.

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