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JAN2N6211

Intersil

JAN2N6211 by Intersil

PNP; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 20 MHz; Maximum Power Dissipation (Abs): 20 W; Maximum Collector Current (IC): 2 A;

Median Price

$29.000

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

< 1k

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TEDSS.com

USA . 5 parts In-Stock

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Manoshevitz Elec. Sales

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LWI Electronics Inc

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Speed Components Ltd

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

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$1.886

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RGB Technical Solutions

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Authorized Procurement Solutions

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Microchip USA

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Technical Specifications

Other Function Transistors JAN2N6211 attributes and parameters. Explore more Other Function Transistors devices from Intersil

Specs

Maximum Collector Current (IC):

2 A

Configuration:

Minimum DC Current Gain (hFE):

10

JESD-609 Code:

e0

No. of Elements:

1

Maximum Operating Temperature:

200 Cel

Polarity or Channel Type:

PNP

Maximum Power Dissipation (Abs):

Sub-Category:

Other Transistors

Surface Mount:

NO

Terminal Finish:

Tin/Lead (Sn/Pb)

Nominal Transition Frequency (fT):

Trade Compliance

JAN2N6211 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

NSN

5961-01-169-0161, 5961011690161, 5961-01-061-7530, 5961010617530, 5961-01-024-2135, 5961010242135

NIIN

011690161, 010617530, 010242135

Manufacturer Highlights

Intersil

Japanese semiconductor company Renesas acquired Intersil on February 24, 2017. Intersil Corporation (NASDAQ:ISIL), a wholly owned subsidiary of Renesas Electronics Corporation, is a leading provider of innovative power management and precision analog solutions. The company's products form the building blocks of increasingly intelligent, mobile and power hungry electronics enabling advances in power management to improve efficiency and extend battery life. With a deep portfolio of intellectual property and a rich history of design and process innovation, Intersil is the trusted partner to leading companies in some of the world's largest markets, including the industrial and infrastructure, mobile computing, automotive and aerospace.

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