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PEF24471

Intel

PEF24471 by Intel

DIGITAL TIME SWITCH; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 217; Package Code: BGA; Package Shape: SQUARE;

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,104 parts In-Stock

1+ parts

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1k+ parts

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1,104

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Vyrian

USA . 593 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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593

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

MARBEL Systems

Belgium . 300 parts In-Stock

1+ parts

$6.815

100+ parts

-

1k+ parts

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300

$6.815

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Texas Native Microelectronics

USA . 33,036 parts In-Stock

1+ parts

$7.833

100+ parts

$7.520

1k+ parts

$7.285

10k+ parts

$6.893

33,036

$7.833

$7.520

$7.285

$6.893

Kenton Components

USA . 848 parts In-Stock

1+ parts

$9.400

100+ parts

-

1k+ parts

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10k+ parts

$8.272

848

$9.400

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$8.272

Modulus Dynamics

Lithuania . 4,047 parts In-Stock

1+ parts

$9.416

100+ parts

$9.039

1k+ parts

$8.663

10k+ parts

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4,047

$9.416

$9.039

$8.663

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Qasali Group International

UK . 4,074 parts In-Stock

1+ parts

$21.149

100+ parts

-

1k+ parts

$19.669

10k+ parts

$18.611

4,074

$21.149

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$19.669

$18.611

Corphita

USA . 922 parts In-Stock

1+ parts

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922

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Technical Specifications

Telecom - Switching ICs PEF24471 attributes and parameters. Explore more Telecom - Switching ICs devices from Intel

Specs

JESD-30 Code:

S-PBGA-B217

Length:

23 mm

No. of Functions:

1

No. of Terminals:

217

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Qualification:

Not Qualified

Maximum Seated Height:

2.35 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Width:

23 mm

Trade Compliance

PEF24471 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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