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P82590

Intel

P82590 by Intel

SERIAL IO/COMMUNICATION CONTROLLER, LAN; Temperature Grade: OTHER; Terminal Form: THROUGH-HOLE; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR;

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LWI Electronics Inc

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Zilex Electronics Inc.

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J & M Industries LLC

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Digital Electronic Gebert Verwaltungs UG

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MARBEL Systems

Belgium . 52 parts In-Stock

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$55.329

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$53.115

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Andel Nordic

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Texas Native Microelectronics

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Technical Specifications

Serial Communication Controllers P82590 attributes and parameters. Explore more Serial Communication Controllers devices from Intel

Specs

Additional Features:

HIGH-SPPED MODE OF OPERATION WITH EXTERNAL ENCODER/DECODER

Address Bus Width:

0

Boundary Scan:

NO

Bus Compatibility:

IAPX 186; IAPX 188; IAPX 286; IAPX 386

Maximum Clock Frequency:

16 MHz

Communication Protocol:

SYNC, HDLC

Data Encoding or Decoding Method:

NRZ; NRZI-SPACE; BIPH-LEVEL(MANCHESTER); DIFF BIPH-LEVEL

Maximum Data Transfer Rate:

.5 MBps

External Data Bus Width:

8

JESD-30 Code:

R-PDIP-T28

JESD-609 Code:

e0

Length:

37.02 mm

Low Power Mode:

YES

No. of DMA Channels:

0

No. of I/O Lines:

0

No. of Serial I/Os:

1

No. of Terminals:

28

On Chip Data RAM Width:

0

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP28,.6

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Words:

0

Maximum Seated Height:

5.08 mm

Sub-Category:

Serial IO/Communication Controllers

Maximum Supply Current:

80 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

15.24 mm

Trade Compliance

P82590 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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