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LE80537GF0484M

Intel

LE80537GF0484M by Intel

MICROPROCESSOR; Terminal Form: BALL; No. of Terminals: 479; Package Code: BGA; Package Shape: SQUARE; Format: FIXED POINT;

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 275 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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275

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Digiode

USA . 221 parts In-Stock

1+ parts

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221

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Advanced Electronics

New Zealand . 15 parts In-Stock

1+ parts

$41.140

100+ parts

$37.437

1k+ parts

$33.735

10k+ parts

-

15

$41.140

$37.437

$33.735

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Andel Nordic

Denmark . 3,196 parts In-Stock

1+ parts

$53.710

100+ parts

-

1k+ parts

$37.595

10k+ parts

$37.595

3,196

$53.710

-

$37.595

$37.595

MARBEL Systems

Belgium . 500 parts In-Stock

1+ parts

$68.273

100+ parts

$65.542

1k+ parts

-

10k+ parts

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500

$68.273

$65.542

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Texas Native Microelectronics

USA . 3,372 parts In-Stock

1+ parts

$78.475

100+ parts

$75.336

1k+ parts

$72.982

10k+ parts

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3,372

$78.475

$75.336

$72.982

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Kenton Components

USA . 75 parts In-Stock

1+ parts

$94.170

100+ parts

-

1k+ parts

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10k+ parts

$82.870

75

$94.170

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$82.870

Ampacity Inc.

Singapore . 1,309 parts In-Stock

1+ parts

$257.000

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1,309

$257.000

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Qasali Group International

UK . 5,538 parts In-Stock

1+ parts

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100+ parts

$203.407

1k+ parts

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10k+ parts

$186.457

5,538

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$203.407

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$186.457

Corphita

USA . 449 parts In-Stock

1+ parts

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449

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Technical Specifications

Microprocessors LE80537GF0484M attributes and parameters. Explore more Microprocessors devices from Intel

Specs

Address Bus Width:

36

Bit Size:

64

Boundary Scan:

NO

External Data Bus Width:

64

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B479

Length:

35 mm

Low Power Mode:

YES

No. of Terminals:

479

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY, HEAT SINK/SLUG

Qualification:

Not Qualified

Maximum Seated Height:

2.963 mm

Speed:

2160 rpm

Maximum Supply Voltage:

1.3 V

Minimum Supply Voltage:

.75 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Width:

35 mm

Peripheral IC Type:

Trade Compliance

LE80537GF0484M Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.1

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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