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LD8156H

Intel

LD8156H by Intel

PARALLEL IO PORT, GENERAL PURPOSE; Temperature Grade: INDUSTRIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 40; Package Code: DIP; Package Shape: RECTANGULAR;

Median Price

-

Lifecycle Status

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3

In-Stock Inventory

< 1k

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Digiode

USA . 390 parts In-Stock

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390

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Vyrian

USA . 72 parts In-Stock

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72

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Sogenti Electronics

Canada . 30 parts In-Stock

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30

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Corohmni

South Africa . 2,561 parts In-Stock

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$17.039

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2,561

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MARBEL Systems

Belgium . 230 parts In-Stock

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$23.536

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Texas Native Microelectronics

USA . 800 parts In-Stock

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$27.053

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$23.807

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$27.053

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$23.807

Kenton Components

USA . 2,903 parts In-Stock

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$32.464

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$28.568

2,903

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$28.568

Qasali Group International

UK . 3,493 parts In-Stock

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$73.043

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$64.278

3,493

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$64.278

Corphita

USA . 472 parts In-Stock

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472

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Technical Specifications

Parallel I/O Ports LD8156H attributes and parameters. Explore more Parallel I/O Ports devices from Intel

Specs

CPU Family:

8085

External Data Bus Width:

8

JESD-30 Code:

R-GDIP-T40

JESD-609 Code:

e0

Length:

52.325 mm

Memory Organization:

256X8

No. of Bits:

14

No. of I/O Lines:

22

No. of Ports:

3

No. of Terminals:

40

No. of Timers:

1

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP40,.6

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

5.72 mm

Sub-Category:

Parallel IO Port

Maximum Supply Current:

125 mA

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

NMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

15.24 mm

Peripheral IC Type:

Trade Compliance

LD8156H Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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