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JL82599ESSLGWF

Intel

JL82599ESSLGWF by Intel

Intel JL82599ESSLGWF is a Serial IO/Communication Controller with 576 terminals in a square grid array package. Operating at 1.2-3.3V, it uses CMOS technology and is suitable for LAN applications due to its surface mount capability and plastic/epoxy body material.

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3

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1k+

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Vyrian

USA . 1,084 parts In-Stock

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Nova Conductors

Japan . 650 parts In-Stock

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Digiode

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Ampacity Inc.

Singapore . 457 parts In-Stock

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$6.000

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AZTECH Wire

Italy . 313 parts In-Stock

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MARBEL Systems

Belgium . 1,824 parts In-Stock

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Texas Native Microelectronics

USA . 2,266 parts In-Stock

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Kenton Components

USA . 10 parts In-Stock

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$54.443

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Qasali Group International

UK . 4,674 parts In-Stock

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$122.496

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Aranea Global

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Corphita

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Overview

Experience seamless and reliable communication with the Intel JL82599ESSLGWF serial communication controller. Crafted by a trusted manufacturer, this controller boasts top-notch quality and unparalleled performance. Perfect for a variety of applications, this controller offers exceptional value with its efficient power supplies and versatile terminal options. Say goodbye to connectivity issues and hello to smooth operations with the Intel JL82599ESSLGWF - your ultimate solution for all your communication needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable for easy handling and long-term use.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly on circuit boards, saving time and effort during installation.

Package Shape: SQUARE

The square package shape helps in optimizing space utilization on the circuit board, especially in compact designs.

Power Supplies (V): 1.2, 3.3

Support for multiple power supply voltages (1.2V and 3.3V) allows for compatibility with various system configurations, enhancing flexibility.

No. of Terminals: 576

The high number of terminals provides numerous connection points for interfacing with other components, enabling versatile communication capabilities.

Package Style (Meter): GRID ARRAY

The grid array package style facilitates efficient heat dissipation and electrical performance, ensuring stable operation under demanding conditions.

Terminal Position: BOTTOM

Bottom terminal position simplifies PCB layout and routing, making it easier to integrate the product into the overall system design.

Peripheral IC Type: SERIAL IO/COMMUNICATION CONTROLLER, LAN

The inclusion of serial IO and LAN communication capabilities makes the product suitable for a wide range of connectivity applications, promoting seamless data transfer.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, ensuring efficient operation and reliable performance in various operating environments.

Terminal Form: BALL

The ball terminal form simplifies soldering and rework processes, promoting ease of maintenance and repair for the end user.

Terminal Pitch: 1 mm

The 1mm terminal pitch allows for densely packed terminals, enabling high-density integration on the PCB and maximizing functionality in a limited space.

Technical Specifications

Serial Communication Controllers JL82599ESSLGWF attributes and parameters. Explore more Serial Communication Controllers devices from Intel

Specs

JESD-30 Code:

S-PBGA-B576

No. of Terminals:

576

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA576,24X24,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

Sub-Category:

Serial IO/Communication Controllers

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Trade Compliance

JL82599ESSLGWF Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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