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FTX710-AM2SR1ZP

Intel

FTX710-AM2SR1ZP by Intel

SERIAL IO/COMMUNICATION CONTROLLER, LAN; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 576; Package Code: BGA; Package Shape: SQUARE;

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 265 parts In-Stock

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265

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Vyrian

USA . 229 parts In-Stock

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229

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,115 parts In-Stock

1+ parts

$13.000

100+ parts

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1,115

$13.000

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MARBEL Systems

Belgium . 1,000 parts In-Stock

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$35.027

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1,000

$35.027

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Texas Native Microelectronics

USA . 2,102 parts In-Stock

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$40.261

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$35.430

2,102

$40.261

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$35.430

Kenton Components

USA . 27,009 parts In-Stock

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$48.313

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$42.516

27,009

$48.313

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$42.516

Qasali Group International

UK . 400 parts In-Stock

1+ parts

$108.705

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$95.660

400

$108.705

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$95.660

Corphita

USA . 451 parts In-Stock

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451

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Technical Specifications

Serial Communication Controllers FTX710-AM2SR1ZP attributes and parameters. Explore more Serial Communication Controllers devices from Intel

Specs

Boundary Scan:

YES

Bus Compatibility:

PCI; CARDBUS; USB

Communication Protocol:

SYNC, BIT, BYTE, ETHERNET

Data Encoding or Decoding Method:

NRZ; BIPH-LEVEL(MANCHESTER)

Maximum Data Transfer Rate:

12.5 MBps

JESD-30 Code:

S-PBGA-B576

Length:

25 mm

Low Power Mode:

YES

No. of Serial I/Os:

18

No. of Terminals:

576

Maximum Operating Temperature:

55 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Maximum Seated Height:

1.84 mm

Maximum Supply Voltage:

3.46 V

Minimum Supply Voltage:

3.14 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

25 mm

Trade Compliance

FTX710-AM2SR1ZP Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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