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FAGD16524100BA

Intel

FAGD16524100BA by Intel

ATM/SONET/SDH CLOCK RECOVERY CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 100; Package Code: HLFQFP; Package Shape: SQUARE;

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 438 parts In-Stock

1+ parts

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438

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Vyrian

USA . 279 parts In-Stock

1+ parts

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279

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

MARBEL Systems

Belgium . 2,516 parts In-Stock

1+ parts

$5.939

100+ parts

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1k+ parts

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10k+ parts

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2,516

$5.939

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Texas Native Microelectronics

USA . 4,307 parts In-Stock

1+ parts

$6.827

100+ parts

$6.554

1k+ parts

$6.349

10k+ parts

$6.008

4,307

$6.827

$6.554

$6.349

$6.008

Kenton Components

USA . 71 parts In-Stock

1+ parts

$8.192

100+ parts

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1k+ parts

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10k+ parts

$7.209

71

$8.192

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$7.209

Qasali Group International

UK . 1,789 parts In-Stock

1+ parts

$18.433

100+ parts

-

1k+ parts

$17.143

10k+ parts

$16.221

1,789

$18.433

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$17.143

$16.221

A-Z Elektronik GmbH

Germany . 6,953 parts In-Stock

1+ parts

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6,953

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Alle Elektronik GmbH

Germany . 4,635 parts In-Stock

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4,635

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Corphita

USA . 144 parts In-Stock

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144

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Technical Specifications

ATM/SONET/SDH Circuits FAGD16524100BA attributes and parameters. Explore more ATM/SONET/SDH Circuits devices from Intel

Specs

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Trade Compliance

FAGD16524100BA Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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