Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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Featured manufacturers
EPF8282ALC84-3N by Intel is a 5.25V CMOS PLD with 84 terminals in a square chip carrier package. It features 4 dedicated inputs, 68 I/O lines, and operates b/w 0-70°C. Ideal for applications requiring registered output functions and programmable IC types.
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PLASTIC/EPOXY - Lightweight and durable material for easy handling and long-lasting performance.
YES - Allows for easy and space-saving integration onto circuit boards.
5.25 V - Provides flexibility in power supply options.
CMOS - Low power consumption and high noise immunity for efficient operation.
SQUARE - Compact design for efficient use of space on circuit boards.
J BEND - Simplifies soldering process and ensures secure connections.
5 - Standard voltage for compatibility with various systems.
84 - Offers ample connectivity options for complex circuit designs.
LOADABLE PLD - Allows for flexible programming to meet diverse application requirements.
CHIP CARRIER - Provides protection and ease of handling during installation.
REGISTERED - Ensures stability and accuracy in data output.
4.75 V - Ensures reliable operation even at lower voltage levels.
70 °C - Suitable for a wide range of operating environments.
1.27 mm - Allows for efficient and precise connection to external components.
4 DEDICATED INPUTS, 68 I/O - Versatile input and output options for versatile applications.
4 - Specifically designated inputs for enhanced flexibility in design.
0 °C - Reliable performance even in low-temperature environments.
MATTE TIN - Ensures high-quality contacts and corrosion resistance.
QUAD - Organized terminal layout for easier circuit design and troubleshooting.
5.08 mm - Low-profile design for compact and efficient circuit board integration.
29.3116 mm - Compact width for space-saving design considerations.
29.3116 mm - Compact length for efficient use of board space.
68 - Ample input and output options for complex circuit applications.
COMMERCIAL - Suitable for standard commercial operating conditions.
Programmable Logic Devices (PLD) EPF8282ALC84-3N attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Intel
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EPF8282ALC84-3N Programmable ICs trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.
SS14
SPC TECHNOLOGY/ MULTICOMP
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
M39029/58-360
TE Connectivity
TE Connectivity's M39029/58-360 is a CRIMP terminal backshell for 22-28 AWG wires, rated at 5A. Ideal for male contacts in Mil-Spec applications, it offers a cross-section area of 0.34 mm2 and ensures secure connections in demanding environments.
CR0805-FX-10R0ELF
Bourns
Bourns CR0805-FX-10R0ELF is a SMT fixed resistor with 10 ohm resistance, 1% tolerance, and 0.125 W power dissipation. Ideal for applications requiring a temperature range of -55 to 155 °C, such as automotive electronics and industrial control systems.
1N4148
Gulf Semiconductor
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
FDN306P
Fairchild Semiconductor
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .5 W; Maximum Drain Current (Abs) (ID): 2.6 A; Operating Mode: ENHANCEMENT MODE;
Philips Components
LM107H
Advanced Micro Devices
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Maximum Bias Current (IIB) @25C: .075 uA;
2N7002
Yangzhou Yangjie Electronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; No. of Elements: 1; Terminal Form: GULL WING; Maximum Drain Current (ID): .34 A;
Teledyne Components
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; JESD-30 Code: R-PDSO-G3; Maximum Operating Temperature: 150 Cel; No. of Terminals: 3;
LM107H/883
Linear Technology
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Technology: BIPOLAR;
2N2222A
Tt Electronics Plc
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Collector Current (IC): .8 A; JESD-30 Code: O-MBCY-W3;
LM555CM
Harris Semiconductor
Analog Waveform Generation Functions; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
Solid State Devices
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
MMBT3906LT1G
Onsemi
MMBT3906LT1G by Onsemi is a PNP BJT with VCEsat of 0.4V, hFE of 30, and fT of 250MHz. Ideal for small signal applications in electronics due to its low power dissipation, high transition frequency, and compact SOT-23 package. Suitable for use in temperature-sensitive environments with an operating range from -65°C to 150°C.
Changzhou Galaxy Century Microelectronics
RECTIFIER DIODE; Surface Mount: NO; Config: SINGLE; Peak Reflow Temperature (C): 260; No. of Phases: 1; Diode Element Material: SILICON;
Jgd Semiconductors
RECTIFIER DIODE; Surface Mount: YES; Technology: SCHOTTKY; Maximum Non Repetitive Peak Forward Current: 30 A; Maximum Forward Voltage (VF): .55 V; No. of Phases: 1;
BAV99
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
LL4148
International Semiconductor
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
LM107H/883C
Rochester Electronics
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Package Equivalence Code: CAN8,.2;
SN65HVD234DR
Texas Instruments
SN65HVD234DR by Texas Instruments is an 8-terminal interface circuit with a data rate of 1 Mbps. Operating temperature ranges from -40 to 125 °C, making it ideal for automotive applications. With a supply voltage of 3.3 V and low current draw of 6 mA, it's suitable for network interfaces in compact designs.
5M1270ZT144C5N
Altera
FLASH PLD; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE;
ATF22V10CQZ-20JU
Microchip Technology
ATF22V10CQZ-20JU by Microchip: 20ns Propagation Delay, 5.5V Max Supply Voltage, CMOS Tech. Ideal for PAL-TYPE applications with 22 inputs, 10 I/O lines, and a max clock frequency of 38.5MHz in industrial settings.
GAL22V10D-7LJN
Lattice Semiconductor
GAL22V10D-7LJN by Lattice Semiconductor is a 5V CMOS PLD with 7.5ns propagation delay, 132 product terms, and 111MHz clock frequency. Ideal for PAL-type applications requiring EE PLDs in commercial extended temperature range. Features include 22 inputs, 10 I/O lines, and macrocell output function in a square chip carrier package.
XCR3032XL-7CSG48I
Xilinx
Xilinx XCR3032XL-7CSG48I is a 32 macrocell EE PLD with 7.5ns propagation delay, operating at max clock frequency of 119MHz. Ideal for industrial applications, it features in-system programmability and JTAG boundary scan test capability.
5M40ZE64C5N
FLASH PLD; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 64; Package Code: HTFQFP; Package Shape: SQUARE;
5M1270ZF256C5N
FLASH PLD; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;
GAL16V8D-7LJNI
GAL16V8D-7LJNI by Lattice Semiconductor is a PLD with 7.5ns propagation delay, 18 inputs, and 64 product terms. It's used in applications requiring EE PLDs with 100MHz clock frequency, such as industrial automation and control systems.
ATF22V10CQZ-20PI
Atmel
EE PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: THROUGH-HOLE; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR;
XC9572XL-10VQ64I
Xilinx XC9572XL-10VQ64I is a 3.6V PLD with 72 macro cells, 36 inputs/outputs, and 100MHz clock frequency. Ideal for industrial applications, it offers in-system programmability and JTAG boundary scan testing capabilities. With a compact form factor of 10x10mm, this CMOS technology-based device suits projects requiring high-speed processing and flexibility.
XC2C32A-4CP56C
The Xilinx XC2C32A-4CP56C is a 32 macrocell FLASH PLD with 33 I/O lines, operating at up to 450 MHz. It features a propagation delay of 4 ns and can be in-system programmable. This low-profile, fine-pitch device is ideal for applications requiring fast clock frequencies and high I/O count in commercial temperature environments.
5M1270ZF256A5N
FLASH PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;
EPM570F100C5N
Intel
Intel EPM570F100C5N is a PLD with 440 macro cells, 76 inputs/outputs, and 8.7ns propagation delay. Ideal for applications requiring FLASH PLD technology, it offers in-system programmability and JTAG boundary scan testing capabilities. With a low profile grid array package style, it operates b/w 0-85°C temperature range.
5M570ZF256C5N
The Intel 5M570ZF256C5N is a FLASH PLD with 440 macro cells, 159 I/O lines, and a max clock frequency of 118.3 MHz. It is used in applications requiring programmable logic devices with low profile grid array package style for surface mount technology. The device offers fast propagation delay of 17.7 ns and operates at temperatures ranging from 0 to 85°C.
XCR3128XL-10VQ100C
The Xilinx XCR3128XL-10VQ100C is a programmable logic device with 128 macro cells. It operates on a max supply voltage of 3.6V and has a propagation delay of 10ns. This PLD is commonly used for applications requiring in-system programmability and a clock frequency of up to 95MHz.
EPM7064AETI100-7N
EPM7064AETI100-7N by Intel is a 64 macrocell EE PLD with 68 I/O lines, operating at up to 135.1 MHz clock frequency. It features a propagation delay of 7.5 ns and can handle a max supply voltage of 3.6 V. Ideal for industrial applications requiring in-system programmability and JTAG boundary scan testing capabilities.
LCMXO2-256HC-4TG100C
LCMXO2-256HC-4TG100C by Lattice Semiconductor is a FLASH PLD with 55 inputs/outputs, 7.36 ns propagation delay, and operates at 2.375-3.462 V. Ideal for applications requiring programmable logic devices in a compact square package with gull wing terminals and low profile design.
5M1270ZT144I5N
Intel 5M1270ZT144I5N is a PLD with 980 macro cells, 114 I/O lines, and 201.1 MHz clock frequency. Ideal for industrial applications requiring in-system programmability and JTAG boundary scan testing. Operating temperature ranges from -40 to 100°C, making it suitable for various environments.
EPF10K50RI240-4N
EPF10K50RI240-4N by Intel is a PLD with 2880 logic cells, 0.6 ns propagation delay, and 189 inputs. Ideal for industrial applications, it operates at -40 to 85 °C with a clock frequency of 62.89 MHz. The package style includes flatpack and heat sink/slug options in a square shape with gull wing terminals.
LC4256ZE-7MN144I
LC4256ZE-7MN144I by Lattice Semiconductor is a 256 macrocell EE PLD with 7.5 ns propagation delay and 111 MHz max clock frequency. Ideal for applications requiring in-system programmability, it features 108 I/O lines, 0.5 mm terminal pitch, and thin profile grid array package style.
EPM7064SLC44-10N
EPM7064SLC44-10N by Intel is a 64 macrocell EE PLD with 36 I/O lines, operating at up to 125 MHz. It features a propagation delay of 10 ns and can be in-system programmable. This Programmable Logic Device (PLD) is commonly used in commercial applications requiring fast processing speeds and versatile input/output configurations.
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EPF8452ALI84-3
LOADABLE PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: J BEND; No. of Terminals: 84; Package Code: QCCJ; Package Shape: SQUARE;
EPF8636AQC208-4
LOADABLE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: GULL WING; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE;
EPF8452ALI84-4
EPF8452ALI84-4N
EPF8282ALC84-3
EPF8282ALC84-3 by Intel is a 208 logic cell PLD with 68 inputs and 64 outputs. It operates at a max frequency of 385 MHz, suitable for applications requiring high-speed processing. With a package style of chip carrier and J bend terminals, it is ideal for commercial temperature range projects.
EPF8282LC84-3
LOADABLE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: J BEND; No. of Terminals: 84; Package Code: QCCJ; Package Shape: SQUARE;
EPF8452ALC84-3
EPF8636AQC160-3N
LOADABLE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: GULL WING; No. of Terminals: 160; Package Code: QFP; Package Shape: SQUARE;
EPF8282ATC100-4N
LOADABLE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: GULL WING; No. of Terminals: 100; Package Code: LFQFP; Package Shape: SQUARE;
EPF8282TC100-3
EPF8452ALI84-6
EPF8636ALC84-4
EPF8636AQC160-4
EPF8820GM883B192-3
LOADABLE PLD; Grading Of Temperature: MILITARY; Form Of Terminal: PIN/PEG; No. of Terminals: 192; Package Code: PGA; Package Shape: SQUARE;
EPF81188AGI232-4
LOADABLE PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: PIN/PEG; No. of Terminals: 232; Package Code: PGA; Package Shape: SQUARE;
EPF8282TM100-2
LOADABLE PLD; Grading Of Temperature: MILITARY; Form Of Terminal: GULL WING; No. of Terminals: 100; Package Code: LFQFP; Package Shape: SQUARE;
EPF8636AQC160-A-2
EPF81188RM240-3
LOADABLE PLD; Grading Of Temperature: MILITARY; Form Of Terminal: GULL WING; No. of Terminals: 240; Package Code: HFQFP; Package Shape: SQUARE;
EPF8820AQI208-4
LOADABLE PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE;
EPF8282ALC84-2
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