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EP1AGX60DF780I6N

Intel

EP1AGX60DF780I6N by Intel

EP1AGX60DF780I6N by Intel is a Field Programmable Gate Array with 60100 CLBs and 350 inputs/outputs. Operating at a max clock frequency of 640 MHz, it is ideal for industrial applications requiring high-speed data processing in a compact form factor. With a package style of GRID ARRAY and moisture sensitivity level of 3, this FPGA offers reliable performance in harsh environments.

Median Price

$118.902

Lifecycle Status

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5

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1k+

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Nova Conductors

Japan . 100 parts In-Stock

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Vyrian

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Digiode

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Flip Electronics

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One Stop Electronics

USA . 869 parts In-Stock

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AZTECH Wire

Italy . 693 parts In-Stock

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Semicontronic

India . 476 parts In-Stock

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$17.460

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Ampacity Inc.

Singapore . 503 parts In-Stock

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$25.000

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MARBEL Systems

Belgium . 3,249 parts In-Stock

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Texas Native Microelectronics

USA . 3,493 parts In-Stock

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Kenton Components

USA . 598 parts In-Stock

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Qasali Group International

UK . 4,613 parts In-Stock

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Modulus Dynamics

Lithuania . 360 parts In-Stock

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$98.165

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Microchip USA

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Vigor

Singapore . 916 parts In-Stock

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Futuretech Components

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Continental Prestige Electronics

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Argo Parts USA

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Supply Digital

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Bastille Electronics

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Corphita

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Corohmni

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Overview

Unlock endless possibilities with the EP1AGX60DF780I6N by Intel, a top-of-the-line Field Programmable Gate Array that delivers unparalleled performance and reliability. Intel's reputation for quality shines through in this product, offering customers a powerful solution for a wide range of applications. From cutting-edge technology to efficient power management, this FPGA is designed to exceed expectations. Experience the value and benefits of Intel's EP1AGX60DF780I6N and take your projects to new heights with ease.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy makes this FPGA lightweight and durable, ideal for portable and rugged applications.

Surface Mount: YES

With surface mounting capability, this FPGA can easily be integrated onto circuit boards, saving space and simplifying the assembly process.

Maximum Supply Voltage: 1.25 V

The low maximum supply voltage of 1.25V ensures efficient power consumption and reduced heat generation, making it energy-efficient.

No. of CLBs: 60100

With a large number of Configurable Logic Blocks, this FPGA offers great flexibility and customization for complex logic functions.

No. of Inputs: 350

The high number of inputs allows for versatile connectivity options, making it suitable for diverse input requirements.

Package Shape: SQUARE

The square package shape provides uniformity and ease of integration into circuit designs, enhancing overall aesthetics and functionality.

Form Of Terminal: BALL

The ball terminal design offers a reliable connection and facilitates easy soldering, ensuring secure connections for stable performance.

Nominal Supply Voltage (V): 1.2

The nominal supply voltage of 1.2V provides stable power delivery for consistent and reliable operation of the FPGA.

Power Supplies (V): 1.2,2.5/3.3

Multiple power supply options allow for compatibility with various systems, offering flexibility in deployment and integration.

No. of Terminals: 780

The high number of terminals provides ample connectivity options, enabling versatile configurations and compatibility with different systems.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a Field Programmable Gate Array, this IC offers reconfigurability and adaptability for evolving application needs, making it a versatile choice.

Technical Specifications

Field Programmable Gate Arrays (FPGA) EP1AGX60DF780I6N attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of Inputs:

350

No. of Outputs:

350

No. of CLBs:

60100

Maximum Clock Frequency:

640 MHz

Sub-Category:

Field Programmable Gate Arrays

Organization:

60100 CLBS

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.15 V

Maximum Supply Voltage:

1.25 V

Power Supplies:

1.2,2.5/3.3 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

29 mm

Width:

29 mm

Maximum Seated Height:

3.5 mm

Package Equivalence Code:

BGA780,28X28,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

780

Standards

JESD-30 Code:

S-PBGA-B780

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

EP1AGX60DF780I6N Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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