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DW82801FBM

Intel

DW82801FBM by Intel

Multifunction Peripherals; Terminal Form: BALL; No. of Terminals: 609; Package Code: BGA; Package Shape: SQUARE; Maximum Seated Height: 2.49 mm;

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

< 1k

Distributors (In-Stock)

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Sensible Micro Corp

USA . 700 parts In-Stock

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700

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Digiode

USA . 162 parts In-Stock

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162

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Vyrian

USA . 105 parts In-Stock

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105

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Fibra_Brandt Electronic GMBH

Germany . 8 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 4,103 parts In-Stock

1+ parts

$15.440

100+ parts

-

1k+ parts

$10.811

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$10.811

4,103

$15.440

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$10.811

$10.811

MARBEL Systems

Belgium . 4,543 parts In-Stock

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$48.161

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$46.234

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4,543

$48.161

$46.234

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Texas Native Microelectronics

USA . 2,581 parts In-Stock

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$55.357

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$53.143

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$51.482

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2,581

$55.357

$53.143

$51.482

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Kenton Components

USA . 160 parts In-Stock

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$66.428

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$58.457

160

$66.428

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$58.457

Corohmni

South Africa . 134 parts In-Stock

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$73.496

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134

$73.496

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Qasali Group International

UK . 2,018 parts In-Stock

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$143.485

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$131.528

2,018

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$143.485

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$131.528

Corphita

USA . 218 parts In-Stock

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Technical Specifications

Multi-functional Peripherals DW82801FBM attributes and parameters. Explore more Multi-functional Peripherals devices from Intel

Specs

Address Bus Width:

32

Boundary Scan:

NO

Bus Compatibility:

PCI; USB; LPC

Maximum Clock Frequency:

48 MHz

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B609

Length:

31 mm

No. of I/O Lines:

20

No. of Terminals:

609

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

RAM Words:

256

Maximum Seated Height:

2.49 mm

Maximum Supply Voltage:

1.575 V

Minimum Supply Voltage:

1.425 V

Nominal Supply Voltage:

1.5 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

1.118 mm

Terminal Position:

BOTTOM

Width:

31 mm

Trade Compliance

DW82801FBM Peripheral ICs trade compliance attributes, and parameters.

ECCN

4A994

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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