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CL8066201939604SR2DV

Intel

CL8066201939604SR2DV by Intel

MICROPROCESSOR; Terminal Form: BALL; No. of Terminals: 1440; Package Code: BGA; Package Shape: RECTANGULAR; Package Style (Meter): GRID ARRAY;

Median Price

$386.270

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

< 1k

CL8066201939604SR2DV by Intel
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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

TME

Poland . 448 parts In-Stock

1+ parts

$386.270

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448

$386.270

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Vyrian

USA . 295 parts In-Stock

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295

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Digiode

USA . 60 parts In-Stock

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60

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 29,672 parts In-Stock

1+ parts

$5.000

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29,672

$5.000

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MARBEL Systems

Belgium . 1,000 parts In-Stock

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$18.547

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1,000

$18.547

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Texas Native Microelectronics

USA . 458 parts In-Stock

1+ parts

$21.318

100+ parts

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$19.826

10k+ parts

$18.760

458

$21.318

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$19.826

$18.760

Kenton Components

USA . 28 parts In-Stock

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$25.582

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$22.512

28

$25.582

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$22.512

Qasali Group International

UK . 2,233 parts In-Stock

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$57.559

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2,233

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Corphita

USA . 111 parts In-Stock

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111

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Electronic Sources GmbH

Germany . 4 parts In-Stock

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Overview

Intel® Core™ i3-6100 Mobile Processors are 64-bit multi-core processors built on 14-nanometer process technology. These devices are offered in a 2-chip platform and are connected to a discrete Intel 100 Series Chipset Family Platform Controller Hub (PCH) on the motherboard. These devices leverage the power efficiency of a new microarchitecture to deliver faster performance than previous generation processors. Intelligent power management with Intel Turbo Boost 2.0 dynamically controls performance and power—for cores and graphics—boosting performance precisely when it is needed, and saving energy when it counts.

Technical Specifications

Microprocessors CL8066201939604SR2DV attributes and parameters. Explore more Microprocessors devices from Intel

Specs

Bit Size:

64

Boundary Scan:

NO

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

R-PBGA-B1440

Low Power Mode:

NO

No. of Terminals:

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Speed:

2700 rpm

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Position:

BOTTOM

Peripheral IC Type:

Trade Compliance

CL8066201939604SR2DV Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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