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IS31SE5104-GRLS2-TR

Integrated Silicon Solution

IS31SE5104-GRLS2-TR by Integrated Silicon Solution

TOUCH SENSOR; Mounting Feature: SURFACE MOUNT; No. of Terminals: 16; Package Shape or Style: RECTANGULAR; Maximum Operating Temperature: 85 Cel; Output (V): OPEN-DRAIN;

Median Price

-

Lifecycle Status

Suppliers In-Stock

0

In-Stock Inventory

< 1k

Technical Specifications

Other Function Sensors & Transducers IS31SE5104-GRLS2-TR attributes and parameters. Explore more Other Function Sensors & Transducers devices from Integrated Silicon Solution

Specs

Body Width:

3.9 inch

Body Height:

1.75 mm

Body Length/Diameter:

9.9 mm

Mounting Feature:

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output (V):

OPEN-DRAIN

Package Body Material:

PLASTIC/EPOXY

Package Equivalence Code:

SOP16,.25

Package Shape or Style:

Sensors or Transducers Type:

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.7 V

Trade Compliance

IS31SE5104-GRLS2-TR Sensors & Transducers trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Integrated Silicon Solution

ISSI is a technology leader that designs, develops, and markets high performance integrated circuits for the following key markets: (i) automotive, (ii) industrial and medical, (iii) communications/enterprise, and (iv) digital consumer. Our primary products are high speed and low power SRAM and low and medium density DRAM, NOR/NAND Flash, and eMMC products. We target these key markets with our cost-effective, high-quality semiconductor products and seek to build long-term relationships with our customers. We have been a committed long-term supplier of memory products, including lower density and smaller volume products, even during periods of tight manufacturing capacity. Our outsourced manufacturing model is based upon a history of joint technology development relationships with key foundries. We also make strategic equity purchases in selected foundries. We have expanded our presence in important markets by adding to design groups in US, China, Korea and Taiwan, and investing in applications engineering and technical support in closer proximity to end customers. These groups complement our core engineering and product management teams located in our Silicon Valley Headquarters in California. In recent years, the need for sophisticated semiconductor memory has expanded beyond the personal computer market and into the automotive, communications, digital consumer, industrial and medical markets. Increased memory content is required in these products in order to help process large amounts of data.

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