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ISL32173EFVZ

Integrated Device Technology

ISL32173EFVZ by Integrated Device Technology

TELECOM CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: TSSOP; Package Shape: RECTANGULAR;

Median Price

$2.105

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Technical Specifications

Other Function Telecom Interface ICs ISL32173EFVZ attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Integrated Device Technology

Specs

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e3

Length:

5 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

ISL32173EFVZ Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Integrated Device Technology

Renesas Electronics Corporation (TSE: 6723, “Renesas”), a premier supplier of advanced semiconductor solutions, and Integrated Device Technology, Inc. (“IDT”), a leading supplier of analog mixed-signal products, including sensors, connectivity and wireless power, today jointly announced the successful completion of Renesas’ acquisition of IDT, as of March 30, 2019 JST, March 29, 2019 PDT, following approvals by IDT shareholders and the relevant regulatory authorities.

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