Loading...

74SSTU32864CBFG8

Integrated Device Technology

74SSTU32864CBFG8 by Integrated Device Technology

D FLIP-FLOP; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 96; Package Code: BGA; Package Shape: RECTANGULAR;

Median Price

$2.330

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DF Sales Co.

USA . 710 parts In-Stock

1+ parts

$2.330

100+ parts

-

1k+ parts

-

10k+ parts

-

710

$2.330

-

-

-

DF Sales Co.

USA . 710 parts In-Stock

1+ parts

$2.330

100+ parts

-

1k+ parts

-

10k+ parts

-

710

$2.330

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 580 parts In-Stock

1+ parts

$2,379.930

100+ parts

$2,332.331

1k+ parts

$2,308.532

10k+ parts

$2,284.733

580

$2,379.930

$2,332.331

$2,308.532

$2,284.733

Northwest PG Solutions

USA . 1,274 parts In-Stock

1+ parts

$2,617.923

100+ parts

-

1k+ parts

-

10k+ parts

-

1,274

$2,617.923

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 16,773 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

16,773

-

-

-

-

Microchip USA

USA . 5,748 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,748

-

-

-

-

Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

Metaverse IC Inc.

Canada . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

A-Z Elektronik GmbH

Germany . 1,800 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,800

-

-

-

-

Technical Specifications

Latches & Flip-Flops 74SSTU32864CBFG8 attributes and parameters. Explore more Latches & Flip-Flops devices from Integrated Device Technology

Specs

Additional Features:

14 BIT 1:2 CONFIGURATION ALSO POSSIBLE

Family:

SSTU

JESD-30 Code:

R-PBGA-B96

JESD-609 Code:

e1

Logic IC Type:

Moisture Sensitivity Level (MSL):

3

No. of Bits:

25

No. of Functions:

1

No. of Terminals:

96

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA96,6X16,32

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8

Propagation Delay (tpd):

2.35 ns

Qualification:

Not Qualified

Sub-Category:

Other Logic ICs

Maximum Supply Voltage (Vsup):

1.9 V

Minimum Supply Voltage (Vsup):

1.7 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Minimum fmax:

340 MHz

Trade Compliance

74SSTU32864CBFG8 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Integrated Device Technology

Renesas Electronics Corporation (TSE: 6723, “Renesas”), a premier supplier of advanced semiconductor solutions, and Integrated Device Technology, Inc. (“IDT”), a leading supplier of analog mixed-signal products, including sensors, connectivity and wireless power, today jointly announced the successful completion of Renesas’ acquisition of IDT, as of March 30, 2019 JST, March 29, 2019 PDT, following approvals by IDT shareholders and the relevant regulatory authorities.

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.