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XMC1404Q064X0128AAXUMA1

Infineon Technologies

XMC1404Q064X0128AAXUMA1 by Infineon Technologies

XMC1404Q064X0128AAXUMA1 by Infineon is a 32-bit microcontroller with 131072 ROM words, 16384 RAM bytes, and 12-Ch 12-Bit ADC channels. It operates at a max clock frequency of 48 MHz and features peripherals like BOD, POR, RTC, and WDT. Ideal for industrial applications requiring high-speed processing and connectivity with CAN(2) and USIC(4).

Median Price

$1.494

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 88 parts In-Stock

1+ parts

$1.000

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88

$1.000

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Vyrian

USA . 6,406 parts In-Stock

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6,406

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IBS Electronics

USA . 2,500 parts In-Stock

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$1.989

2,500

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$1.989

Digiode

USA . 625 parts In-Stock

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625

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Argo Parts USA

USA . 4,994 parts In-Stock

1+ parts

$1.000

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4,994

$1.000

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Continental Prestige Electronics

USA . 2,001 parts In-Stock

1+ parts

$1.000

100+ parts

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10k+ parts

$0.980

2,001

$1.000

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-

$0.980

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$1.000

100+ parts

-

1k+ parts

$0.950

10k+ parts

$0.930

2,000

$1.000

-

$0.950

$0.930

Ampacity Inc.

Singapore . 2,342 parts In-Stock

1+ parts

$1.190

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2,342

$1.190

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AZTECH Wire

Italy . 1,012 parts In-Stock

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$14.520

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1,012

$14.520

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Microchip USA

USA . 7,434 parts In-Stock

1+ parts

$16.184

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7,434

$16.184

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Modulus Dynamics

Lithuania . 2,618 parts In-Stock

1+ parts

$17.983

100+ parts

$17.264

1k+ parts

$16.544

10k+ parts

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2,618

$17.983

$17.264

$16.544

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Andel Nordic

Denmark . 5,885 parts In-Stock

1+ parts

$28.870

100+ parts

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1k+ parts

$20.208

10k+ parts

$20.208

5,885

$28.870

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$20.208

$20.208

Aztec Data Supply Inc.

USA . 500 parts In-Stock

1+ parts

$37.080

100+ parts

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500

$37.080

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Perfect Parts

USA . 5,600 parts In-Stock

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5,600

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Corphita

USA . 273 parts In-Stock

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273

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Overview

Unlock the power of innovation with the XMC1404Q064X0128AAXUMA1 microcontroller by Infineon Technologies. As a leader in the industry, Infineon guarantees top-notch quality and reliability in all their products. This versatile microcontroller is perfect for a wide range of applications, offering advanced features and capabilities to meet your unique needs. Experience seamless connectivity, precise control, and efficient performance with this cutting-edge device. Elevate your projects and bring your ideas to life with the XMC1404Q064X0128AAXUMA1 microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and lightweight design, making it easy to handle and suitable for various applications.

Surface Mount: YES

Allows for easy and secure mounting on circuit boards, streamlining the manufacturing process.

Maximum Supply Voltage: 5.5 V

Supports a wide range of input voltages, enabling compatibility with different power sources.

Package Shape: SQUARE

Helps maximize space utilization on circuit boards, ideal for compact designs.

Bit Size: 32

Offers high processing power and efficiency for handling complex tasks quickly.

No. of Terminals: 64

Provides ample connectivity options for interfacing with external components.

Package Style: FLATPACK, LOW PROFILE, FINE PITCH

Facilitates a slim design and precise placement on circuit boards, enhancing overall aesthetics.

Minimum Supply Voltage: 1.8 V

Allows for operation at lower voltages, leading to energy efficiency and extended battery life.

Maximum Operating Temperature: 105 °C

Ensures reliable performance even in high-temperature environments.

Minimum Operating Temperature: -40 °C

Suitable for use in extreme cold conditions without compromising functionality.

Terminal Finish: NICKEL GOLD PALLADIUM SILVER

Provides excellent corrosion resistance and conductivity for reliable data transmission.

ADC Channels: YES

Enables analog-to-digital conversion for versatile sensing and monitoring capabilities.

Terminal Position: QUAD

Enhances stability and ease of connection with other components on the circuit board.

ROM Words: 131072

Offers ample storage capacity for program instructions and data, accommodating complex programming requirements.

Maximum Seated Height: 1.6 mm

Contributes to a low-profile design, ideal for compact and space-constrained applications.

Width: 10 mm

Takes up minimal space on the circuit board, allowing for efficient use of available area.

Peripherals: BOD, BOR, COMPARATOR(4), LEDTS(3), POR, RTC, TIMER(16), WDT

Provides a wide range of built-in features for enhanced functionality and versatility.

Maximum Clock Frequency: 48 MHz

Offers high processing speed for quick execution of tasks, ideal for real-time applications.

Length: 10 mm

Complements the width measurement for a compact square form factor, suitable for space-sensitive designs.

Temperature Grade: INDUSTRIAL

Designed to withstand harsh industrial environments without compromising performance.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes a streamlined RISC architecture for efficient data processing and execution of commands.

RAM Bytes: 16384

Offers ample memory capacity for temporary data storage and processing, supporting multitasking and data-intensive applications.

Technology: CMOS

Provides low power consumption and high noise immunity, ideal for battery-operated devices and noise-sensitive applications.

Terminal Form: GULL WING

Ensures secure and reliable connections on the circuit board, minimizing the risk of disconnections or signal interference.

Analog To Digital Convertors: 12-Ch 12-Bit

Allows for the conversion of analog signals into digital data with high precision and accuracy.

Nominal Supply Voltage: 3.3 V

Operates efficiently at a standard voltage level, ensuring compatibility with common power sources.

PWM Channels: YES

Supports pulse-width modulation for precise control of digital signals and power management.

Connectivity: CAN(2), USIC(4)

Offers multiple communication interfaces for seamless integration with external devices and networks.

ROM Programmability: FLASH

Enables fast and flexible program updates, ensuring adaptability to changing requirements.

Terminal Pitch: 0.5 mm

Provides a fine pitch spacing for terminals, allowing for dense packing on the circuit board, suitable for high-density designs.

Moisture Sensitivity Level (MSL): 3

Ensures resistance to moisture and humidity, making it suitable for various environmental conditions.

Speed: 48 rpm

Enables rapid data processing and execution of commands, ensuring timely operation for time-sensitive applications.

On Chip Program ROM Width: 8

Accommodates a wide data bus for efficient program execution and memory access.

No. of I/O Lines: 55

Offers a large number of input/output lines for versatile connectivity options with external peripherals and devices.

Technical Specifications

Microcontrollers XMC1404Q064X0128AAXUMA1 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Additional Features:

CONNECTIVITY, PERIPHERALS CONSIDERED FROM SDOC

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

48 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

55

No. of Terminals:

64

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

RAM Bytes:

16384

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

48 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL GOLD PALLADIUM SILVER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(2), USIC(4)

Peripherals:

BOD, BOR, COMPARATOR(4), LEDTS(3), POR, RTC, TIMER(16), WDT

Analog To Digital Convertors:

12-Ch 12-Bit

Trade Compliance

XMC1404Q064X0128AAXUMA1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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