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XMC1403Q064X0128AAXUMA1

Infineon Technologies

XMC1403Q064X0128AAXUMA1 by Infineon Technologies

Infineon XMC1403Q064X0128AAXUMA1 is a 32-bit microcontroller with 131072 ROM words, 16384 RAM bytes, and 12-Ch 12-Bit ADC channels. It operates at up to 48 MHz clock frequency and offers peripherals like BOD, RTC, and TIMER(16). Ideal for industrial applications requiring high-speed processing and connectivity via CAN(2) and USIC(4).

Median Price

$2.968

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$2.968

100+ parts

-

1k+ parts

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10

$2.968

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Vyrian

USA . 2,705 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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2,705

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Digiode

USA . 246 parts In-Stock

1+ parts

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246

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Argo Parts USA

USA . 2,150 parts In-Stock

1+ parts

$2.968

100+ parts

-

1k+ parts

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2,150

$2.968

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Continental Prestige Electronics

USA . 1,017 parts In-Stock

1+ parts

$2.968

100+ parts

-

1k+ parts

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10k+ parts

$2.909

1,017

$2.968

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-

$2.909

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$2.968

100+ parts

-

1k+ parts

$2.820

10k+ parts

$2.761

1,000

$2.968

-

$2.820

$2.761

AZTECH Wire

Italy . 453 parts In-Stock

1+ parts

$7.759

100+ parts

-

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453

$7.759

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Microchip USA

USA . 7,139 parts In-Stock

1+ parts

$15.408

100+ parts

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7,139

$15.408

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Ampacity Inc.

Singapore . 1,565 parts In-Stock

1+ parts

$25.000

100+ parts

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1,565

$25.000

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Aztec Data Supply Inc.

USA . 10 parts In-Stock

1+ parts

$43.552

100+ parts

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10

$43.552

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Modulus Dynamics

Lithuania . 3,191 parts In-Stock

1+ parts

$62.486

100+ parts

$59.987

1k+ parts

$57.487

10k+ parts

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3,191

$62.486

$59.987

$57.487

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Corphita

USA . 79 parts In-Stock

1+ parts

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79

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Overview

Looking to power up your next project? The XMC1403Q064X0128AAXUMA1 by Infineon Technologies is the game-changer you've been looking for. With a wide range of applications in the microcontroller category, this product offers top-notch quality and reliability that only a manufacturer like Infineon can deliver. From advanced ADC channels to seamless connectivity options, this microcontroller is designed to optimize performance and efficiency. Say hello to endless possibilities with the XMC1403Q064X0128AAXUMA1!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this microcontroller lightweight and durable.

Surface Mount: YES

The surface mount option allows for easy and efficient assembly onto circuit boards.

Maximum Supply Voltage: 5.5 V

With a high maximum supply voltage, this microcontroller can handle a wide range of power sources.

Package Shape: SQUARE

The square package shape allows for efficient use of space on the circuit board.

Bit Size: 32

A 32-bit microcontroller offers enhanced computing power and performance.

No. of Terminals: 64

The high number of terminals provides versatility in connecting external components.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The package style options offer flexibility in design and integration.

Minimum Supply Voltage: 1.8 V

The low minimum supply voltage ensures compatibility with various power sources.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature makes this microcontroller suitable for industrial applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for use in extreme environments.

Terminal Finish: NICKEL GOLD PALLADIUM SILVER

The use of multiple finishes provides enhanced conductivity and reliability.

ADC Channels: YES

The inclusion of ADC channels allows for analog signal conversion, expanding the usability of this microcontroller.

Terminal Position: QUAD

The quad terminal position enables efficient connection layout on the PCB.

ROM Words: 131072

With a large ROM capacity, this microcontroller can store a vast amount of program data.

Maximum Seated Height: 1.6 mm

The low maximum seated height ensures compatibility with compact device designs.

Width: 10 mm

The slim width of the microcontroller makes it suitable for applications with limited space.

Peripherals: BOD, BOR, POR, RTC, TIMER(16), WDT

The inclusion of various peripherals enhances the functionality and versatility of this microcontroller.

Maximum Clock Frequency: 48 MHz

The high maximum clock frequency allows for fast processing speeds and real-time operation.

Length: 10 mm

The compact length of the microcontroller makes it suitable for small form factor applications.

Temperature Grade: INDUSTRIAL

The industrial-grade temperature range ensures reliability in harsh operating conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture of this microcontroller offers efficient processing and low power consumption.

RAM Bytes: 16384

With a large RAM capacity, this microcontroller can handle complex operations and data storage.

Technology: CMOS

The CMOS technology used in this microcontroller offers low power consumption and high reliability.

Terminal Form: GULL WING

The gull wing terminal form provides secure and reliable connections on the circuit board.

Analog To Digital Convertors: 12-Ch 12-Bit

The 12-channel 12-bit ADCs enable precise analog signal conversion for accurate data processing.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage ensures compatibility with standard power sources.

PWM Channels: YES

The presence of PWM channels allows for precise control of digital signals.

Connectivity: CAN(2), USIC(4)

The multiple connectivity options enhance communication capabilities with external devices.

ROM Programmability: FLASH

The flash ROM programmability offers flexibility in updating and customizing the microcontroller's firmware.

Terminal Pitch: 0.5 mm

The fine terminal pitch enables compact device designs and high-density PCB layouts.

Moisture Sensitivity Level (MSL): 3

The MSL 3 rating indicates the level of protection against moisture damage, making this microcontroller suitable for various environments.

Speed: 48 rpm

The high speed capability supports fast data processing and response times.

On Chip Program ROM Width: 8

The 8-bit on-chip program ROM width supports efficient data processing and storage.

No. of I/O Lines: 55

The high number of I/O lines provides versatility in connecting external devices and sensors.

Technical Specifications

Microcontrollers XMC1403Q064X0128AAXUMA1 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Additional Features:

CONNECTIVITY, PERIPHERALS CONSIDERED FROM SDOC

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

48 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

55

No. of Terminals:

64

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

RAM Bytes:

16384

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

48 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL GOLD PALLADIUM SILVER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(2), USIC(4)

Peripherals:

BOD, BOR, POR, RTC, TIMER(16), WDT

Analog To Digital Convertors:

12-Ch 12-Bit

Trade Compliance

XMC1403Q064X0128AAXUMA1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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