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XMC1301T038X0064ABXUMA2

Infineon Technologies

XMC1301T038X0064ABXUMA2 by Infineon Technologies

Infineon's XMC1301T038X0064ABXUMA2 microcontroller features 32-bit architecture, 38 terminals, and a clock speed of 32 MHz. Ideal for applications requiring PWM control, ADC channels, and up to 34 I/O lines in compact designs like IoT devices and industrial automation systems.

Median Price

$2.650

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 3,000 parts In-Stock

1+ parts

$2.650

100+ parts

$1.617

1k+ parts

$1.477

10k+ parts

$1.349

3,000

$2.650

$1.617

$1.477

$1.349

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,191 parts In-Stock

1+ parts

-

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7,191

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Digiode

USA . 644 parts In-Stock

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644

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Nova Conductors

Japan . 22 parts In-Stock

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22

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Distributors (Availability)

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Microchip USA

USA . 6,146 parts In-Stock

1+ parts

$9.773

100+ parts

-

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6,146

$9.773

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AZTECH Wire

Italy . 611 parts In-Stock

1+ parts

$13.690

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611

$13.690

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Ampacity Inc.

Singapore . 1,415 parts In-Stock

1+ parts

$15.000

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1,415

$15.000

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Modulus Dynamics

Lithuania . 4,724 parts In-Stock

1+ parts

$35.107

100+ parts

$33.703

1k+ parts

$32.298

10k+ parts

-

4,724

$35.107

$33.703

$32.298

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Continental Prestige Electronics

USA . 6,953 parts In-Stock

1+ parts

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6,953

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Argo Parts USA

USA . 2,201 parts In-Stock

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Aranea Global

USA . 2,000 parts In-Stock

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Corphita

USA . 491 parts In-Stock

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491

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Overview

Unlock endless possibilities with the XMC1301T038X0064ABXUMA2 microcontroller by Infineon Technologies. This powerful device offers unmatched quality and reliability, making it the perfect choice for a wide range of applications. With its compact design and advanced features, this microcontroller provides customers with valuable benefits such as increased efficiency, enhanced performance, and simplified development processes. Trust in Infineon Technologies to deliver cutting-edge technology that meets your needs and exceeds your expectations. Elevate your projects with the XMC1301T038X0064ABXUMA2 microcontroller today.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for compact and efficient circuit board design.

Maximum Supply Voltage: 5.5 V

Can handle a wide range of input voltages, making it versatile for different applications.

Package Shape: RECTANGULAR

Rectangular shape allows for easy integration into various PCB layouts.

Bit Size: 32

High bit size allows for complex processing capabilities.

No. of Terminals: 38

Sufficient number of terminals for interfacing with external components.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Compact package style saves space on the PCB and allows for dense circuit designs.

Minimum Supply Voltage: 1.8 V

Low minimum supply voltage enables operation in low-power scenarios.

ADC Channels: YES

Built-in ADC channels enable analog signal processing.

Terminal Position: DUAL

Dual terminal positioning provides flexibility in PCB layout.

Width: 4.4 mm

Narrow width saves space on the PCB.

Maximum Clock Frequency: 32 MHz

High clock frequency allows for fast processing speeds.

Length: 9.7 mm

Compact length for space-constrained applications.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture provides efficient processing capabilities.

Terminal Form: GULL WING

Gull wing terminals are robust and reliable for soldering.

Nominal Supply Voltage: 3.3 V

Standard nominal supply voltage for compatibility with common power sources.

PWM Channels: YES

Built-in PWM channels for precise control of output signals.

Terminal Pitch: 0.5 mm

Fine terminal pitch enables high-density PCB designs.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates good resistance to moisture, suitable for various environments.

Speed: 32 rpm

High processing speed of 32 rpm for efficient operation.

No. of I/O Lines: 34

Sufficient number of I/O lines for interfacing with external devices.

Technical Specifications

Microcontrollers XMC1301T038X0064ABXUMA2 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Length:

9.7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

34

No. of Terminals:

38

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Speed:

32 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Peripheral IC Type:

Trade Compliance

XMC1301T038X0064ABXUMA2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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