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XC878CM16FFI5VACFXUMA1

Infineon Technologies

XC878CM16FFI5VACFXUMA1 by Infineon Technologies

Infineon's XC878CM16FFI5VACFXUMA1 microcontroller features 8-bit architecture, 20 MHz clock frequency, and 40 I/O lines. Ideal for applications requiring ADC and PWM channels, with a supply voltage range of 4.5-5.5 V. Package style is flatpack with low profile and fine pitch terminals.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,263 parts In-Stock

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Digiode

USA . 852 parts In-Stock

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852

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Chip Stock

USA . 161 parts In-Stock

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Nova Conductors

Japan . 23 parts In-Stock

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AZTECH Wire

Italy . 563 parts In-Stock

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$11.800

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563

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Semicontronic

India . 1,502 parts In-Stock

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$24.000

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$23.400

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$23.280

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1,502

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Ampacity Inc.

Singapore . 290 parts In-Stock

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$31.000

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290

$31.000

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Corohmni

South Africa . 458 parts In-Stock

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$56.788

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458

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Modulus Dynamics

Lithuania . 4,222 parts In-Stock

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$61.881

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$59.406

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$56.931

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$56.931

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Aztec Data Supply Inc.

USA . 153 parts In-Stock

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$65.820

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Continental Prestige Electronics

USA . 6,727 parts In-Stock

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Argo Parts USA

USA . 3,501 parts In-Stock

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Bastille Electronics

Australia . 1,000 parts In-Stock

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Corphita

USA . 839 parts In-Stock

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Microchip USA

USA . 400 parts In-Stock

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Overview

Step into the future with the XC878CM16FFI5VACFXUMA1 by Infineon Technologies. This cutting-edge microcontroller offers unparalleled quality and reliability, thanks to its advanced technology and world-renowned manufacturer. Perfect for a wide range of applications, this microcontroller provides customers with unmatched value, benefits, and advantages. Whether you're looking to enhance your products with superior performance or streamline your operations with efficient automation, the XC878CM16FFI5VACFXUMA1 is the solution you've been searching for. Experience the difference today and take your projects to new heights.

Feature Benefit Bullets

Surface Mount: YES

This feature allows for easy and convenient installation on a circuit board, saving time and effort during assembly.

Maximum Supply Voltage: 5.5 V

Higher maximum supply voltage ensures stability and reliability of the microcontroller in various operating conditions.

Package Shape: SQUARE

Square package shape helps in efficient space utilization on the PCB, especially in compact electronic devices.

Bit Size: 8

8-bit processing capability provides a good balance between performance and cost-effectiveness for a wide range of applications.

ADC Channels: YES

Having ADC channels enables the microcontroller to interface with analog sensors and transducers, expanding its usability.

Width: 10 mm

Compact width allows for integration into small form factor devices without compromising on performance.

Maximum Clock Frequency: 20 MHz

Higher clock frequency allows for faster processing speeds and better overall performance of the microcontroller.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable.

PWM Channels: YES

PWM channels enable precise control over power output, making the microcontroller suitable for applications requiring varying levels of power.

No. of I/O Lines: 40

Having a high number of I/O lines allows for versatile connectivity and communication with external devices and peripherals.

Technical Specifications

Microcontrollers XC878CM16FFI5VACFXUMA1 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

Maximum Clock Frequency:

20 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

40

No. of Terminals:

64

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Speed:

24 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

10 mm

Peripheral IC Type:

Trade Compliance

XC878CM16FFI5VACFXUMA1 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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