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XC866L4FRA3VBELXUMA1

Infineon Technologies

XC866L4FRA3VBELXUMA1 by Infineon Technologies

Infineon's XC866L4FRA3VBELXUMA1 is an 8-bit microcontroller with a max clock frequency of 12 MHz. It features 27 I/O lines, ADC and PWM channels, suitable for applications requiring low power consumption and compact design. Ideal for small outline, thin profile packages in various electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

< 1k

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Vyrian

USA . 854 parts In-Stock

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Nova Conductors

Japan . 100 parts In-Stock

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Digiode

USA . 34 parts In-Stock

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AZTECH Wire

Italy . 792 parts In-Stock

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$6.178

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Ampacity Inc.

Singapore . 1,046 parts In-Stock

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$14.000

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Microchip USA

USA . 929 parts In-Stock

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$19.478

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Modulus Dynamics

Lithuania . 1,463 parts In-Stock

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$25.104

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$24.100

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$23.096

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Semicontronic

India . 1,341 parts In-Stock

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$30.000

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$29.250

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$29.100

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Aztec Data Supply Inc.

USA . 700 parts In-Stock

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$73.360

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Eastek

USA . 9,000 parts In-Stock

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Argo Parts USA

USA . 4,890 parts In-Stock

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Corphita

USA . 287 parts In-Stock

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Continental Prestige Electronics

USA . 162 parts In-Stock

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Bastille Electronics

Australia . 100 parts In-Stock

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Speed Components Ltd (Excess)

Israel . 50 parts In-Stock

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Overview

Unlock the possibilities with the XC866L4FRA3VBELXUMA1 by Infineon Technologies, a top-quality microcontroller designed to elevate your projects to new heights. With a compact form factor and advanced technology, this device is perfect for a wide range of applications. From industrial automation to consumer electronics, the XC866L4FRA3VBELXUMA1 offers reliability, efficiency, and versatility. Trust in the expertise of Infineon Technologies and experience the superior performance of this microcontroller. Elevate your designs and bring your ideas to life with the XC866L4FRA3VBELXUMA1.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easier and more efficient assembly of electronic circuits, making this microcontroller a convenient choice for manufacturers.

Maximum Supply Voltage: 2.7 V

This low maximum supply voltage ensures compatibility with a wide range of power sources and makes the microcontroller suitable for various applications.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient use of space on PCBs, making it ideal for compact designs and saving space in electronic devices.

Bit Size: 8

The 8-bit architecture provides a good balance between computational power and cost-effectiveness, making this microcontroller suitable for a range of applications.

No. of Terminals: 38

The high number of terminals enables versatile connectivity options and interfacing with various peripherals, making the microcontroller flexible in design.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

This package style offers a compact form factor, reducing the overall size of the device and contributing to space-saving designs in compact electronic applications.

Minimum Supply Voltage: 2.3 V

With a low minimum supply voltage, this microcontroller can operate efficiently even with lower power sources, enhancing its versatility in different power environments.

ADC Channels: YES

The analog-to-digital converter channels enable the microcontroller to interface with analog sensors and signals, making it suitable for applications that require analog input processing.

Terminal Position: DUAL

The dual terminal position allows for more flexible routing of connections on the PCB, enhancing the ease of circuit design and layout for the microcontroller.

Width: 4.4 mm

With a narrow width, this microcontroller can be integrated into slim and space-constrained electronic devices, offering design flexibility and compact solutions.

Maximum Clock Frequency: 12 MHz

The high maximum clock frequency provides fast processing capabilities, making the microcontroller suitable for applications that require quick response times and efficient operation.

Length: 9.7 mm

The compact length of the microcontroller contributes to a space-saving design, allowing it to be used in compact electronic devices without compromising performance.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller, this product integrates various peripherals and features into a single chip, simplifying system design and reducing the need for additional components.

Technology: CMOS

The CMOS technology used in this microcontroller offers low power consumption, high noise immunity, and compatibility with a wide range of operating voltages, making it a reliable and efficient choice.

Terminal Form: GULL WING

The gull-wing terminal form factor enhances solder joint reliability and thermal performance, ensuring secure and stable connections for the microcontroller in electronic assemblies.

Nominal Supply Voltage: 2.5 V

The nominal supply voltage of 2.5 V provides a standard operating voltage level for the microcontroller, ensuring compatibility with common power sources and ease of integration.

PWM Channels: YES

The pulse-width modulation channels enable the microcontroller to generate analog-like signals for controlling devices such as motors and LEDs, adding versatility to its application capabilities.

Terminal Pitch: 0.5 mm

The small terminal pitch allows for high-density mounting of the microcontroller on the PCB, enabling compact and space-efficient designs in electronic products.

Moisture Sensitivity Level (MSL): 3

The MSL 3 rating indicates that the microcontroller has a moderate level of moisture sensitivity, making it suitable for a wide range of environmental conditions and manufacturing processes.

Speed: 75 rpm

The speed of 75 rpm is a noteworthy performance specification that may be relevant for specific applications such as motor control or timing functions, adding value to the microcontroller.

No. of I/O Lines: 27

With a high number of input/output lines, this microcontroller offers ample interfacing options for connecting to external devices and sensors, enhancing its versatility in system integration.

Technical Specifications

Microcontrollers XC866L4FRA3VBELXUMA1 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

Maximum Clock Frequency:

12 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Length:

9.7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

27

No. of Terminals:

38

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Speed:

75 rpm

Maximum Supply Voltage:

2.7 V

Minimum Supply Voltage:

2.3 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

4.4 mm

Peripheral IC Type:

Trade Compliance

XC866L4FRA3VBELXUMA1 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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