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XC8664FRIBEFXUMA1

Infineon Technologies

XC8664FRIBEFXUMA1 by Infineon Technologies

Infineon's XC8664FRIBEFXUMA1 microcontroller features 8-bit size, 10 MHz clock frequency, and Flash ROM programmability. Ideal for industrial applications, it offers 27 I/O lines, PWM channels, and ADC channels for versatile functionality in a compact package.

Median Price

$1.814

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 5,653 parts In-Stock

1+ parts

-

100+ parts

$1.720

1k+ parts

$1.540

10k+ parts

$1.450

5,653

-

$1.720

$1.540

$1.450

Verical

USA . 4,918 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.925

10k+ parts

$1.813

4,918

-

-

$1.925

$1.813

RS (Exports)

UK . 442 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.814

10k+ parts

-

442

-

-

$1.814

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 142 parts In-Stock

1+ parts

$1.824

100+ parts

-

1k+ parts

-

10k+ parts

-

142

$1.824

-

-

-

Nova Conductors

Japan . 30 parts In-Stock

1+ parts

$2.410

100+ parts

-

1k+ parts

-

10k+ parts

-

30

$2.410

-

-

-

Vyrian

USA . 4,263 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,263

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 2,270 parts In-Stock

1+ parts

$1.540

100+ parts

-

1k+ parts

-

10k+ parts

-

2,270

$1.540

-

-

-

Semicontronic

India . 2,191 parts In-Stock

1+ parts

$1.540

100+ parts

$1.502

1k+ parts

$1.494

10k+ parts

-

2,191

$1.540

$1.502

$1.494

-

Corphita

USA . 955 parts In-Stock

1+ parts

$1.728

100+ parts

-

1k+ parts

-

10k+ parts

-

955

$1.728

-

-

-

Continental Prestige Electronics

USA . 3,830 parts In-Stock

1+ parts

$2.410

100+ parts

-

1k+ parts

-

10k+ parts

$2.362

3,830

$2.410

-

-

$2.362

Argo Parts USA

USA . 3,641 parts In-Stock

1+ parts

$2.410

100+ parts

-

1k+ parts

-

10k+ parts

-

3,641

$2.410

-

-

-

Microchip USA

USA . 1,827 parts In-Stock

1+ parts

$13.184

100+ parts

-

1k+ parts

-

10k+ parts

-

1,827

$13.184

-

-

-

AZTECH Wire

Italy . 1,104 parts In-Stock

1+ parts

$17.690

100+ parts

-

1k+ parts

-

10k+ parts

-

1,104

$17.690

-

-

-

Corohmni

South Africa . 275 parts In-Stock

1+ parts

$24.596

100+ parts

-

1k+ parts

-

10k+ parts

-

275

$24.596

-

-

-

Aztec Data Supply Inc.

USA . 4,875 parts In-Stock

1+ parts

$36.900

100+ parts

-

1k+ parts

-

10k+ parts

-

4,875

$36.900

-

-

-

Modulus Dynamics

Lithuania . 3,481 parts In-Stock

1+ parts

$45.376

100+ parts

$43.561

1k+ parts

$41.746

10k+ parts

-

3,481

$45.376

$43.561

$41.746

-

Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,000

-

-

-

-

Overview

Unleash the power of innovation with the XC8664FRIBEFXUMA1 microcontroller by Infineon Technologies. Designed with precision and quality in mind, this high-performance device offers unparalleled reliability and efficiency for a wide range of applications. From automotive to industrial automation, this compact yet powerful microcontroller provides exceptional value and benefits to customers seeking cutting-edge technology. Elevate your projects to new heights with the XC8664FRIBEFXUMA1 and experience the difference that superior engineering can make.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used for electronic components as it is lightweight, durable, and cost-effective.

Surface Mount: YES

Surface mount technology allows for efficient assembly processes and compact designs.

Maximum Supply Voltage: 5.5 V

Allows for a wide range of input voltage, making the microcontroller versatile for different applications.

Package Shape: RECTANGULAR

Rectangular shape allows for easy placement on PCBs and efficient use of space.

Bit Size: 8

8-bit microcontrollers are suitable for low to mid-range complexity applications.

No. of Terminals: 38

Sufficient number of terminals for connecting to external components and peripherals.

Package Style: SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Compact package style helps in space-constrained designs and efficient PCB layouts.

Minimum Supply Voltage: 4.5 V

Ensures stable operation at lower input voltage levels.

Maximum Operating Temperature: 85 °C

Can operate in a wide range of temperatures, suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Can withstand low temperatures, making it suitable for use in various environments.

Terminal Finish: NICKEL PALLADIUM GOLD SILVER

Provides good conductivity and corrosion resistance for reliable connections.

ADC Channels: YES

Analog-to-digital converter channels allow for interfacing with analog sensors and signals.

Terminal Position: DUAL

Dual terminal position provides flexibility in PCB layout and routing.

Maximum Seated Height: 1.2 mm

Low seated height helps in slim device designs and compact assemblies.

Width: 4.4 mm

Compact width dimension allows for efficient use of PCB space.

Maximum Clock Frequency: 10 MHz

High clock frequency allows for fast processing of instructions and data.

Length: 9.7 mm

Optimal length dimension for compact and space-efficient board designs.

Temperature Grade: INDUSTRIAL

Suitable for use in industrial environments with varying temperature ranges.

Peripheral IC Type: MICROCONTROLLER

Designed specifically for controlling various peripherals and interfacing with external devices.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing overall performance.

Terminal Form: GULL WING

Gull wing terminal form provides good mechanical strength and reliable solder joints.

Nominal Supply Voltage: 5 V

Standard supply voltage for compatibility with a wide range of electronic components and systems.

PWM Channels: YES

Pulse-width modulation channels allow for precise control of analog signals and systems.

ROM Programmability: FLASH

Flash ROM allows for easy reprogramming of the microcontroller firmware.

Terminal Pitch: 0.5 mm

Fine terminal pitch for high-density integration and compact board designs.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates the level of moisture sensitivity, ensuring reliability in handling and storage.

Speed: 80 rpm

Operates at a speed of 80 revolutions per minute, suitable for various control applications.

No. of I/O Lines: 27

Sufficient number of input/output lines for connecting to external devices and peripherals.

Technical Specifications

Microcontrollers XC8664FRIBEFXUMA1 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

Maximum Clock Frequency:

10 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G38

JESD-609 Code:

e4

Length:

9.7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

27

No. of Terminals:

38

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

80 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD SILVER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

4.4 mm

Peripheral IC Type:

Trade Compliance

XC8664FRIBEFXUMA1 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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