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XC2365A104F80LRABKXUMA1

Infineon Technologies

XC2365A104F80LRABKXUMA1 by Infineon Technologies

Infineon's XC2365A104F80LRABKXUMA1 is a 32-bit microcontroller with 24-bit address bus width, operating at up to 40 MHz. Ideal for automotive applications, it features 16-Ch 10-Bit ADCs, CAN(3), DMA(8), and UART connectivity. With ROM programmability and 51200 bytes of RAM, this CMOS technology-based chip offers high performance in a compact package.

Median Price

$13.596

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 150 parts In-Stock

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$13.596

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150

$13.596

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Maritex

Poland . 6,000 parts In-Stock

1+ parts

$28.860

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6,000

$28.860

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Chip Stock

USA . 7,501 parts In-Stock

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7,501

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Semtec, LLC

USA . 6,000 parts In-Stock

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6,000

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Vyrian

USA . 4,972 parts In-Stock

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4,972

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Rutronik

Germany . 1,000 parts In-Stock

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$10.270

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1,000

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$10.270

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Digiode

USA . 630 parts In-Stock

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630

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 3,883 parts In-Stock

1+ parts

$8.920

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3,883

$8.920

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Semicontronic

India . 3,861 parts In-Stock

1+ parts

$8.920

100+ parts

$8.697

1k+ parts

$8.652

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3,861

$8.920

$8.697

$8.652

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Modulus Dynamics

Lithuania . 3,320 parts In-Stock

1+ parts

$11.819

100+ parts

$11.346

1k+ parts

$10.873

10k+ parts

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3,320

$11.819

$11.346

$10.873

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Corohmni

South Africa . 695 parts In-Stock

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$11.819

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695

$11.819

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Advanced Electronics

New Zealand . 100 parts In-Stock

1+ parts

$12.174

100+ parts

$11.565

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$11.565

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100

$12.174

$11.565

$11.565

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Continental Prestige Electronics

USA . 4,683 parts In-Stock

1+ parts

$13.596

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$13.324

4,683

$13.596

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$13.324

Netroflash

USA . 100 parts In-Stock

1+ parts

$13.596

100+ parts

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$12.916

10k+ parts

$12.644

100

$13.596

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$12.916

$12.644

AZTECH Wire

Italy . 706 parts In-Stock

1+ parts

$16.590

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706

$16.590

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Microchip USA

USA . 2,718 parts In-Stock

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$30.445

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2,718

$30.445

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Aztec Data Supply Inc.

USA . 1,211 parts In-Stock

1+ parts

$46.770

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1,211

$46.770

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Eastek

USA . 17,000 parts In-Stock

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Argo Parts USA

USA . 3,389 parts In-Stock

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3,389

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iodParts Technologies Inc.

India . 900 parts In-Stock

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900

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Corphita

USA . 357 parts In-Stock

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357

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Formix International (Excess)

India . 181 parts In-Stock

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Robosynatics

Brazil . 150 parts In-Stock

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150

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Lucentia Tech

USA . 150 parts In-Stock

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150

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Overview

Discover the cutting-edge XC2365A104F80LRABKXUMA1 microcontroller by Infineon Technologies, a leading manufacturer in the industry. With its high-quality construction and advanced technology, this product is perfect for a wide range of applications. From automotive to industrial automation, this versatile microcontroller offers unmatched value and benefits to customers. Experience seamless connectivity, reliable performance, and innovative features with the XC2365A104F80LRABKXUMA1 - the ultimate solution for your project needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and protection for the microcontroller, making it suitable for a variety of applications.

Maximum Supply Voltage: 1.6 V

The high maximum supply voltage allows for flexibility in power input options, accommodating various power sources.

ADC Channels: YES

The inclusion of Analog to Digital Converters allows for accurate conversion of analog signals to digital data, enabling precise measurements and control.

RAM Bytes: 51200

With a large amount of Random Access Memory, the microcontroller can efficiently store and retrieve data during operation, improving overall performance.

Maximum Clock Frequency: 40 MHz

The high clock frequency enables fast processing and response times, making the microcontroller suitable for applications requiring real-time performance.

Connectivity: I2C, I2S, LIN, SIO(6), SPI(6), UART

Multiple connectivity options make it easy to interface the microcontroller with other devices and systems, enhancing its versatility and compatibility.

Technical Specifications

Microcontrollers XC2365A104F80LRABKXUMA1 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

32

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

76

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

RAM Bytes:

51200

ROM Words:

851968

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Maximum Supply Voltage:

1.6 V

Minimum Supply Voltage:

1.4 V

Nominal Supply Voltage:

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL GOLD PALLADIUM SILVER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, I2S, LIN, SIO(6), SPI(6), UART

Peripherals:

CAN(3), DMA(8), RTC, TIMER(17), WDT

Analog To Digital Convertors:

16-Ch 10-Bit

Trade Compliance

XC2365A104F80LRABKXUMA1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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