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XC2336B40F80LRABKXUMA1

Infineon Technologies

XC2336B40F80LRABKXUMA1 by Infineon Technologies

Infineon Technologies' XC2336B40F80LRABKXUMA1 is a 32-bit microcontroller with a max clock frequency of 40 MHz. It is used in automotive applications and features a square package, with 64 terminals and a width of 10 mm.

Median Price

$11.400

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 1,610 parts In-Stock

1+ parts

$17.620

100+ parts

$12.030

1k+ parts

$10.700

10k+ parts

$9.730

1,610

$17.620

$12.030

$10.700

$9.730

Rochester

USA . 1,414 parts In-Stock

1+ parts

-

100+ parts

$9.120

1k+ parts

$8.160

10k+ parts

$7.680

1,414

-

$9.120

$8.160

$7.680

Verical

USA . 1,414 parts In-Stock

1+ parts

-

100+ parts

$11.400

1k+ parts

$10.200

10k+ parts

$9.600

1,414

-

$11.400

$10.200

$9.600

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 78 parts In-Stock

1+ parts

$9.633

100+ parts

-

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-

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78

$9.633

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Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$10.480

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-

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100

$10.480

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Chip Stock

USA . 16,200 parts In-Stock

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16,200

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Rutronik

Germany . 7,100 parts In-Stock

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7,100

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Vyrian

USA . 1,127 parts In-Stock

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1,127

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,292 parts In-Stock

1+ parts

$8.620

100+ parts

-

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1,292

$8.620

-

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Semicontronic

India . 1,157 parts In-Stock

1+ parts

$8.620

100+ parts

$8.404

1k+ parts

$8.361

10k+ parts

-

1,157

$8.620

$8.404

$8.361

-

Corphita

USA . 680 parts In-Stock

1+ parts

$9.126

100+ parts

-

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680

$9.126

-

-

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Continental Prestige Electronics

USA . 3,316 parts In-Stock

1+ parts

$10.480

100+ parts

-

1k+ parts

-

10k+ parts

$10.270

3,316

$10.480

-

-

$10.270

Netroflash

USA . 100 parts In-Stock

1+ parts

$10.480

100+ parts

-

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100

$10.480

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Corohmni

South Africa . 178 parts In-Stock

1+ parts

$23.757

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178

$23.757

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Microchip USA

USA . 1,584 parts In-Stock

1+ parts

$24.891

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1,584

$24.891

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Aztec Data Supply Inc.

USA . 965 parts In-Stock

1+ parts

$35.160

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965

$35.160

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Advanced Electronics

New Zealand . 650 parts In-Stock

1+ parts

$39.316

100+ parts

$37.350

1k+ parts

$37.350

10k+ parts

-

650

$39.316

$37.350

$37.350

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Modulus Dynamics

Lithuania . 1,021 parts In-Stock

1+ parts

$42.041

100+ parts

$40.359

1k+ parts

$38.678

10k+ parts

-

1,021

$42.041

$40.359

$38.678

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GreenTree Electronics

Israel . 3,300 parts In-Stock

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3,300

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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1,000

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iodParts Technologies Inc.

India . 900 parts In-Stock

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900

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Argo Parts USA

USA . 721 parts In-Stock

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721

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Overview

Experience the power of cutting-edge technology with the XC2336B40F80LRABKXUMA1 microcontroller by Infineon Technologies. As a leading manufacturer in the industry, Infineon is committed to delivering high-quality products that exceed expectations. The XC2336B40F80LRABKXUMA1 offers unparalleled performance and versatility for a wide range of applications. With its advanced features and robust design, this microcontroller empowers you to bring your ideas to life. Whether you're working on automotive systems, industrial automation, or consumer electronics, the XC2336B40F80LRABKXUMA1 provides the speed, efficiency, and reliability you need. Discover a world of possibilities with Infineon's XC2336B40F80LRABKXUMA1 microcontroller and unlock your true potential.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the microcontroller, making it suitable for various environments.

Surface Mount: YES

The surface mount feature offers ease of installation and space-saving advantages, making it convenient for compact electronic designs.

Maximum Supply Voltage: 1.6V

With a higher supply voltage, this microcontroller can handle power requirements for demanding applications.

Package Shape: SQUARE

The square shape allows for efficient use of board space, enabling more compact and densely packed electronic systems.

Bit Size: 32

The 32-bit architecture provides enhanced processing capabilities, allowing for complex calculations and efficient execution of instructions.

No. of Terminals: 64

With 64 terminals, this microcontroller offers a wide range of connectivity options and allows for seamless integration within the application.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low-profile, fine pitch package style ensures better space utilization and facilitates reliable connections.

Minimum Supply Voltage: 1.4V

The lower supply voltage requirement enables energy-efficient operation, making it suitable for battery-powered or low-power applications.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this microcontroller can withstand harsh environmental conditions and maintain optimal performance.

Minimum Operating Temperature: -40 °C

The ability to operate at extremely low temperatures allows for deployment in freezing environments or automotive applications.

Terminal Finish: NICKEL GOLD PALLADIUM SILVER

The combination of nickel, gold, palladium, and silver terminal finish ensures excellent conductivity, corrosion resistance, and long-term reliability.

ADC Channels: YES

With ADC channels, the microcontroller can accurately convert analog signals into digital data, enabling precise measurement and control in various sensor-based applications.

Terminal Position: QUAD

The quad terminal position facilitates easy and secure soldering, ensuring reliable electrical connections in the system.

Maximum Seated Height: 1.6 mm

The low seated height allows for a compact overall design, making it suitable for applications with limited vertical space.

Width: 10 mm

The compact width dimension allows for efficient placement on PCBs and offers flexibility in the layout design.

Maximum Clock Frequency: 40 MHz

The high clock frequency enables fast data processing and efficient execution of instructions, making it suitable for demanding real-time applications.

Maximum Time At Peak Reflow Temperature (s): 40

The microcontroller can withstand a maximum of 40 seconds at peak reflow temperature during soldering, ensuring its reliability during manufacturing.

Peak Reflow Temperature °C: 260

The peak reflow temperature capability of 260°C ensures proper soldering of the microcontroller, resulting in robust electrical connections.

Length: 10 mm

The compact length dimension allows for efficient placement on PCBs and offers flexibility in the layout design.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this microcontroller meets the stringent temperature and reliability requirements of automotive electronic systems.

Peripheral IC Type: MICROCONTROLLER, RISC

As a microcontroller based on the RISC architecture, it provides efficient and streamlined processing for a wide range of application requirements.

Technology: CMOS

The CMOS technology offers low power consumption and high noise immunity, enhancing the efficiency and reliability of the microcontroller.

Terminal Form: GULL WING

The gull wing terminal form provides secure soldering connections, ensuring reliable electrical connections and easy PCB assembly.

Nominal Supply Voltage: 1.5V

The nominal supply voltage of 1.5V allows for stable and consistent power supply, ensuring reliable operation of the microcontroller.

PWM Channels: YES

With PWM channels, the microcontroller can control and modulate the intensity or speed of connected devices, making it suitable for applications requiring precise control.

ROM Programmability: FLASH

The flash programmability of the ROM allows for easy firmware updates or modifications, ensuring flexibility and scalability in the application.

Terminal Pitch: 0.5 mm

The narrow terminal pitch of 0.5 mm allows for fine spacing of terminals, enabling high-density integration within electronic systems.

Moisture Sensitivity Level (MSL): 3

The moisture sensitivity level of 3 ensures that the microcontroller can withstand moderate moisture exposure without damage during storage and handling.

Speed: 80 rpm

The microcontroller operates at a speed of 80 revolutions per minute (rpm), allowing for precise control of motor-driven applications.

No. of I/O Lines: 39

With 39 input/output lines, this microcontroller offers a sufficient number of interfaces for connecting peripherals and external devices in the system.

Technical Specifications

Microcontrollers XC2336B40F80LRABKXUMA1 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

39

No. of Terminals:

64

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Maximum Supply Voltage:

1.6 V

Minimum Supply Voltage:

1.4 V

Nominal Supply Voltage:

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL GOLD PALLADIUM SILVER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

10 mm

Peripheral IC Type:

Trade Compliance

XC2336B40F80LRABKXUMA1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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