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TLE4941

Infineon Technologies

TLE4941 by Infineon Technologies

TLE4941 by Infineon is a magnetic field sensor with 4.5-16.5V power supply, 8.4mA max operating current, and -20mT min magnetic field range. It features a digital current output and is used in applications requiring Hall effect sensors for differential output interface via 2-wire interface mounting through hole solder termination.

Median Price

$1.650

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 52,000 parts In-Stock

1+ parts

$1.650

100+ parts

$1.620

1k+ parts

$1.580

10k+ parts

-

52,000

$1.650

$1.620

$1.580

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 345 parts In-Stock

1+ parts

$2.242

100+ parts

-

1k+ parts

-

10k+ parts

-

345

$2.242

-

-

-

Vyrian

USA . 307 parts In-Stock

1+ parts

$2.360

100+ parts

-

1k+ parts

-

10k+ parts

-

307

$2.360

-

-

-

Rutronik

Germany . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$1.760

2,000

-

-

-

$1.760

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

50

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Stockers USA

USA . 34,114 parts In-Stock

1+ parts

$1.780

100+ parts

$1.690

1k+ parts

$1.640

10k+ parts

$1.950

34,114

$1.780

$1.690

$1.640

$1.950

Ampacity Inc.

Singapore . 27,899 parts In-Stock

1+ parts

$2.010

100+ parts

-

1k+ parts

-

10k+ parts

-

27,899

$2.010

-

-

-

Corphita

USA . 672 parts In-Stock

1+ parts

$2.124

100+ parts

-

1k+ parts

-

10k+ parts

-

672

$2.124

-

-

-

Modulus Dynamics

Lithuania . 2,101 parts In-Stock

1+ parts

$2.274

100+ parts

$2.183

1k+ parts

$2.092

10k+ parts

-

2,101

$2.274

$2.183

$2.092

-

Advanced Electronics

New Zealand . 100 parts In-Stock

1+ parts

$3.585

100+ parts

$3.262

1k+ parts

$2.940

10k+ parts

-

100

$3.585

$3.262

$2.940

-

Andel Nordic

Denmark . 289 parts In-Stock

1+ parts

$29.640

100+ parts

-

1k+ parts

$20.747

10k+ parts

$20.747

289

$29.640

-

$20.747

$20.747

GreenTree Electronics

Israel . 31,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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31,500

-

-

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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3,000

-

-

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A-Z Elektronik GmbH

Germany . 2,864 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,864

-

-

-

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,000

-

-

-

-

Overview

Experience the superior quality and reliability of Infineon Technologies with the TLE4941 Magnetic Field Sensor. This cutting-edge sensor offers precise detection and measurement of magnetic fields, making it ideal for a wide range of applications. With its digital current output and differential circuit type, the TLE4941 provides accurate and efficient results. Trust in Infineon's reputation for excellence and innovation, and see the difference this sensor can make in your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the sensor, ensuring it can withstand various environmental conditions.

Body Width: 1 inch

The compact size of the sensor makes it easy to integrate into different applications without taking up too much space.

Output Circuit Type: DIFFERENTIAL

Differential output circuitry allows for more accurate and reliable readings, making this sensor suitable for precise measurements.

Power Supplies (V): 4.5/16.5

The wide range of power supply options makes this sensor versatile and compatible with different systems and voltage requirements.

Sensors or Transducers Type: MAGNETIC FIELD SENSOR,HALL EFFECT

Hall Effect sensors are known for their high sensitivity and accuracy in measuring magnetic fields, making this sensor a reliable choice for applications requiring precise detection.

Body Height: 3.71 mm

The low profile of the sensor makes it suitable for applications where space is limited, allowing for easy installation in compact devices.

Package Shape or Style: RECTANGULAR

The rectangular shape of the sensor provides a versatile design that can be easily integrated into different systems and configurations.

Output Type: DIGITAL CURRENT

Digital output ensures compatibility with modern digital systems and provides clear and reliable data for monitoring and control applications.

Maximum Operating Current: 8.4 mA

The high maximum operating current capability of the sensor allows for reliable performance in demanding applications without the risk of overheating or malfunction.

Housing: PLASTIC

Plastic housing offers a lightweight and durable protection for the sensor, making it suitable for a wide range of applications.

Minimum Range Of Magnetic Field: -20 mT

With a wide range of magnetic field detection, this sensor can accurately detect weak magnetic fields, making it suitable for various sensing applications.

Maximum Output Current: 26 A

The high maximum output current capability of the sensor allows for reliable signal transmission and power delivery in high-current applications.

Technology: BICMOS

BICMOS technology offers a good balance between analog and digital circuitry, providing high accuracy and low power consumption for efficient operation.

Maximum Magnetic Field Range: 20 mT

The wide range of magnetic field detection allows this sensor to handle a variety of magnetic field strengths, making it versatile for different applications.

Body Length/Diameter: 5.34 mm

The compact size of the sensor body enables easy integration into different devices and systems without compromising performance.

Termination Type: SOLDER

Solder termination provides a reliable and secure connection for the sensor, ensuring stable operation and easy installation in various applications.

Output Interface Type: 2-WIRE INTERFACE

The 2-wire interface simplifies connectivity and communication with other devices, making this sensor easy to integrate into different systems.

Mounting Feature: THROUGH HOLE MOUNT

Through-hole mounting allows for secure and stable installation of the sensor in PCBs or other devices, ensuring proper alignment and connection for accurate readings.

Technical Specifications

Magnetic Field Sensors TLE4941 attributes and parameters. Explore more Magnetic Field Sensors devices from Infineon Technologies

Specs

Body Width:

1 inch

Body Height:

3.71 mm

Body Length/Diameter:

5.34 mm

Housing:

PLASTIC

Maximum Magnetic Field Range:

20 mT

Minimum Range Of Magnetic Field:

-20 mT

Mounting Feature:

Maximum Operating Current:

8.4 mA

Output (V):

DIFFERENTIAL

Output Circuit Type:

DIFFERENTIAL

Maximum Output Current:

26 A

Output Interface Type:

2-WIRE INTERFACE

Output Type:

Package Body Material:

PLASTIC/EPOXY

Package Equivalence Code:

SIP(UNSPEC)

Package Shape or Style:

Power Supplies (V):

4.5/16.5

Sensors or Transducers Type:

Sub-Category:

Other Sensors

Technology:

BICMOS

Termination Type:

SOLDER

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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