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TLE4286GNT

Infineon Technologies

TLE4286GNT by Infineon Technologies

TLE4286GNT by Infineon is a fixed positive single output LDO regulator with a nominal output voltage of 5V and max dropout voltage of 1.1V. It operates in temperatures ranging from -40 to 150°C, making it suitable for automotive applications requiring stable voltage regulation in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 726 parts In-Stock

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726

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Vyrian

USA . 612 parts In-Stock

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612

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Nova Conductors

Japan . 54 parts In-Stock

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54

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,350 parts In-Stock

1+ parts

$1.500

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1,350

$1.500

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Advanced Electronics

New Zealand . 200 parts In-Stock

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$2.564

100+ parts

$2.333

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$2.102

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200

$2.564

$2.333

$2.102

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Modulus Dynamics

Lithuania . 70 parts In-Stock

1+ parts

$5.199

100+ parts

$4.991

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$4.783

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70

$5.199

$4.991

$4.783

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AZTECH Wire

Italy . 766 parts In-Stock

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$6.985

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766

$6.985

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Continental Prestige Electronics

USA . 6,794 parts In-Stock

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Argo Parts USA

USA . 4,003 parts In-Stock

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4,003

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Corphita

USA . 233 parts In-Stock

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233

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Bastille Electronics

Australia . 41 parts In-Stock

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Overview

Upgrade your electronic devices with the TLE4286GNT by Infineon Technologies, a top-quality Fixed Regulator that ensures stable and reliable performance. Designed with precision and expertise, this regulator offers a wide range of applications in various industries. With Infineon's reputation for excellence, you can trust that this product delivers unmatched value, efficiency, and durability to meet your unique needs. Experience seamless power management like never before with the TLE4286GNT.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Makes the product lightweight and durable.

Maximum Dropout Voltage-1: 1.1 V

Provides a small dropout voltage which helps in maintaining a stable output voltage.

Surface Mount: YES

Allows for easy and convenient installation on circuit boards.

Operating Temperature (TJ-Max): 150 °C

Can operate at high temperatures, making it suitable for a variety of environments.

Screening Level: AEC-Q100

Meets automotive electronics quality standards.

Nominal Output Voltage-1: 5 V

Provides a stable output voltage for consistent performance.

Maximum Load Regulation: 0.01 %

Ensures that the output voltage remains stable even under varying load conditions.

Maximum Input Voltage: 42 V

Can handle a wide range of input voltages, making it versatile.

Technical Specifications

Fixed Regulators - Positive Single Output LDO TLE4286GNT attributes and parameters. Explore more Fixed Regulators - Positive Single Output LDO devices from Infineon Technologies

Specs

Adjustability:

FIXED

Maximum Dropout Voltage-1:

1.1 V

Nominal Dropout Voltage-1:

.8 V

Maximum Input Voltage Absolute:

Maximum Input Voltage:

42 V

Minimum Input Voltage:

6 V

JESD-30 Code:

R-PDSO-G5

Length:

2.9 mm

Maximum Line Regulation:

.01 %

Maximum Load Regulation:

.01 %

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

5

Operating Temperature (TJ-Max):

150 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

.015 A

Maximum Output Voltage-1:

5.2 V

Minimum Output Voltage-1:

4.8 V

Nominal Output Voltage-1:

5 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5,.09(UNSPEC)

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Screening Level:

AEC-Q100

Maximum Seated Height:

1.1 mm

Surface Mount:

YES

Terminal Form:

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Maximum Voltage Tolerance:

4 %

Width:

1.6 mm

Trade Compliance

TLE4286GNT Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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