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TD500N18KOF

Infineon Technologies

TD500N18KOF by Infineon Technologies

Infineon Technologies' TD500N18KOF SCR has a max on-state current of 500A, non-repetitive peak on-state current of 14500A, and max DC gate trigger current of 250mA. Ideal for applications requiring high power control such as industrial motor drives, soft starters, and welding equipment.

Median Price

$297.120

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 2 parts In-Stock

1+ parts

$297.120

100+ parts

-

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2

$297.120

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Distributors (In-Stock)

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Forefront Electronics and Design

USA . 6 parts In-Stock

1+ parts

$183.750

100+ parts

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6

$183.750

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Digiode

USA . 669 parts In-Stock

1+ parts

$282.264

100+ parts

-

1k+ parts

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669

$282.264

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Vyrian

USA . 582 parts In-Stock

1+ parts

$297.120

100+ parts

-

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582

$297.120

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Modulus Dynamics

Lithuania . 1,734 parts In-Stock

1+ parts

$3.724

100+ parts

$3.575

1k+ parts

$3.426

10k+ parts

-

1,734

$3.724

$3.575

$3.426

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Andel Nordic

Denmark . 4,967 parts In-Stock

1+ parts

$48.600

100+ parts

-

1k+ parts

$34.017

10k+ parts

$34.017

4,967

$48.600

-

$34.017

$34.017

Corphita

USA . 294 parts In-Stock

1+ parts

$267.408

100+ parts

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10k+ parts

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294

$267.408

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

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5,000

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Metaverse IC Inc.

Canada . 300 parts In-Stock

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300

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Overview

Experience seamless power control with the TD500N18KOF by Infineon Technologies. As a leading manufacturer in the industry, Infineon delivers top-notch quality and reliability. This Silicon Controlled Rectifier (SCR) offers a maximum on-state current of 500A, making it ideal for a wide range of applications. Whether you're looking to enhance industrial processes or improve energy efficiency, this SCR provides exceptional value and performance. Trust Infineon to power your innovations with the TD500N18KOF.

Feature Benefit Bullets

Maximum DC Gate Trigger Current: 250 mA

A high maximum gate trigger current allows for precise control over when the SCR turns on, resulting in reliable performance.

Configuration: SINGLE WITH BUILT-IN DIODE

Having a built-in diode simplifies the circuit design and saves space, making this SCR a convenient choice for various applications.

Non Repetitive Peak On-state Current: 14500 A

The high non-repetitive peak on-state current rating ensures that the SCR can handle sudden surges in current without damage, making it durable and reliable.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy mounting and efficient use of space in electronic circuits.

Maximum On-state Current: 500 A

With a high maximum on-state current rating, this SCR can handle heavy loads with ease, making it suitable for high-power applications.

Quick Connects Description: G-GR

The quick connect terminals make installation and maintenance of the SCR fast and efficient, saving time and effort.

Maximum Leakage Current: 100 mA

The low maximum leakage current ensures that the SCR maintains low power consumption when in the off-state, improving energy efficiency.

Repetitive Peak Reverse Voltage: 1800 V

The high repetitive peak reverse voltage rating provides protection against reverse voltage spikes, enhancing the reliability of the SCR.

No. of Terminals: 5

Having 5 terminals allows for a range of connection options, making this SCR versatile and adaptable to different circuit configurations.

Package Style (Meter): FLANGE MOUNT

The flange mount package style provides secure mounting and heat dissipation for the SCR, ensuring reliable operation under various conditions.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this SCR can withstand elevated temperatures without performance degradation, making it suitable for harsh environments.

Trigger Device Type: SCR

Being an SCR (Silicon Controlled Rectifier) ensures that this device can handle high power levels and provide precise control over current flow, making it ideal for demanding applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature rating allows this SCR to function reliably even in cold environments, expanding its range of potential applications.

Maximum RMS On-state Current: 900 A

The high maximum RMS on-state current rating indicates the SCR's ability to handle continuous current flow efficiently, making it suitable for continuous operation in high-power circuits.

Maximum DC Gate Trigger Voltage: 2.2 V

The low maximum gate trigger voltage ensures that the SCR can be easily triggered with a low voltage signal, providing precise and efficient control over its operation.

Case Connection: ISOLATED

Having an isolated case connection enhances safety by preventing electrical contact with external components, reducing the risk of short circuits and improving reliability.

Repetitive Peak Off-state Voltage: 1800 V

The high repetitive peak off-state voltage rating ensures that the SCR can withstand voltage spikes without breakdown, enhancing its durability and reliability.

Maximum Holding Current: 300 mA

The maximum holding current specifies the minimum current required to keep the SCR in the on-state, providing stability and preventing unintentional turn-off in critical applications.

Screw Terminals Description: A-K-AK

The screw terminals with A-K-AK description offer a secure and reliable connection method, making installation and maintenance of the SCR hassle-free.

Technical Specifications

Silicon Controlled Rectifiers (SCR) TD500N18KOF attributes and parameters. Explore more Silicon Controlled Rectifiers (SCR) devices from Infineon Technologies

Specs

Case Connection:

Maximum DC Gate Trigger Current:

250 mA

Maximum DC Gate Trigger Voltage:

2.2 V

Quick Connects Description:

G-GR

Screw Terminals Description:

A-K-AK

Maximum Holding Current:

300 mA

JESD-30 Code:

R-XXFM-X5

Maximum Leakage Current:

100 mA

Non Repetitive Peak On-state Current:

14500 A

No. of Elements:

1

No. of Terminals:

5

Maximum On-state Current:

500 A

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum RMS On-state Current:

900 A

Repetitive Peak Off-state Voltage:

1800 V

Repetitive Peak Reverse Voltage:

1800 V

Sub-Category:

Silicon Controlled Rectifiers

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Device Type:

SCR

Trade Compliance

TD500N18KOF Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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