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T640N16TOFXPSA1

Infineon Technologies

T640N16TOFXPSA1 by Infineon Technologies

T640N16TOFXPSA1 by Infineon Technologies is a SINGLE SCR with 1600V repetitive peak reverse voltage and 1450A max RMS on-state current. Ideal for high-power applications, it features a surface mount design and 250mA max DC gate trigger current.

Median Price

$124.000

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 7 parts In-Stock

1+ parts

$109.130

100+ parts

-

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7

$109.130

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Mouser Electronics

USA . 26 parts In-Stock

1+ parts

$121.420

100+ parts

$121.420

1k+ parts

$121.420

10k+ parts

$121.420

26

$121.420

$121.420

$121.420

$121.420

Verical

USA . 12 parts In-Stock

1+ parts

$124.000

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12

$124.000

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Chip1Stop

Japan . 12 parts In-Stock

1+ parts

$124.000

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12

$124.000

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DigiKey

USA . 8 parts In-Stock

1+ parts

$126.820

100+ parts

$109.688

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8

$126.820

$109.688

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Newark

USA . 11 parts In-Stock

1+ parts

$158.170

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11

$158.170

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Element14

Singapore . 7 parts In-Stock

1+ parts

$183.340

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7

$183.340

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 203 parts In-Stock

1+ parts

$109.250

100+ parts

-

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203

$109.250

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Vyrian

USA . 6,919 parts In-Stock

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Nova Conductors

Japan . 76 parts In-Stock

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76

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 51 parts In-Stock

1+ parts

$2.415

100+ parts

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51

$2.415

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Modulus Dynamics

Lithuania . 1,673 parts In-Stock

1+ parts

$4.389

100+ parts

$4.213

1k+ parts

$4.038

10k+ parts

-

1,673

$4.389

$4.213

$4.038

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Corphita

USA . 104 parts In-Stock

1+ parts

$103.500

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104

$103.500

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Microchip USA

USA . 2,902 parts In-Stock

1+ parts

$200.655

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2,902

$200.655

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Continental Prestige Electronics

USA . 2,642 parts In-Stock

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2,642

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Argo Parts USA

USA . 103 parts In-Stock

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103

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Aranea Global

USA . 50 parts In-Stock

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50

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Overview

Discover the power of Infineon Technologies with the T640N16TOFXPSA1 Silicon Controlled Rectifier. Designed for high-performance applications, this SCR offers unmatched reliability and efficiency. With a maximum DC Gate Trigger Current of 250 mA and a Repetitive Peak Reverse Voltage of 1600 V, this product is perfect for a wide range of industrial and commercial uses. Trust in Infineon's reputation for quality and innovation, and experience the value that this SCR brings to your projects.

Feature Benefit Bullets

Maximum DC Gate Trigger Current: 250 mA

This allows for precise control over when the SCR is triggered, making it suitable for a wide range of applications.

Configuration: SINGLE

The single configuration simplifies the setup and installation process, making it user-friendly.

Surface Mount: YES

Being surface mountable makes it easy to integrate into various electronic circuits and PCB designs.

Package Shape: ROUND

The round shape allows for efficient heat dissipation and compact packaging, saving valuable space.

Repetitive Peak Reverse Voltage: 1600 V

With a high reverse voltage rating, this SCR can withstand voltage spikes and surges, ensuring durability and reliability.

No. of Terminals: 3

Having only 3 terminals simplifies the connection and reduces the chances of errors during installation.

Package Style (Meter): DISK BUTTON

The disk button package style is commonly used for SCR, providing a robust and durable housing for the component.

Trigger Device Type: SCR

As an SCR, this component offers high current and voltage handling capabilities, making it suitable for power control applications.

Maximum RMS On-state Current: 1450 A

With a high RMS current rating, this SCR can handle heavy load currents, making it ideal for high-power applications.

Repetitive Peak Off-state Voltage: 1600 V

The high off-state voltage rating ensures reliable blocking of current in off-state conditions, providing enhanced safety and performance.

Technical Specifications

Silicon Controlled Rectifiers (SCR) T640N16TOFXPSA1 attributes and parameters. Explore more Silicon Controlled Rectifiers (SCR) devices from Infineon Technologies

Specs

Configuration:

Maximum DC Gate Trigger Current:

250 mA

JESD-30 Code:

O-XXDB-X3

No. of Elements:

1

No. of Terminals:

3

Package Body Material:

UNSPECIFIED

Package Shape:

ROUND

Package Style (Meter):

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum RMS On-state Current:

1450 A

Repetitive Peak Off-state Voltage:

1600 V

Repetitive Peak Reverse Voltage:

1600 V

Surface Mount:

YES

Terminal Form:

UNSPECIFIED

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Device Type:

SCR

Trade Compliance

T640N16TOFXPSA1 Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

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