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SPI15N60C3

Infineon Technologies

SPI15N60C3 by Infineon Technologies

SPI15N60C3 by Infineon Technologies is a N-CHANNEL Power FET with 600V DS Breakdown Voltage. Ideal for SWITCHING applications, it features a Max Drain Current of 15A and Max Pulsed Drain Current of 45A. With an Operating Temperature up to 150°C, this FET has a low on-resistance of 0.28 ohm for efficient performance.

Median Price

$1.575

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 15,894 parts In-Stock

1+ parts

-

100+ parts

$1.410

1k+ parts

$1.260

10k+ parts

$1.180

15,894

-

$1.410

$1.260

$1.180

Verical

USA . 15,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.575

10k+ parts

$1.475

15,000

-

-

$1.575

$1.475

DigiKey

USA . 894 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.850

10k+ parts

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894

-

-

$1.850

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 544 parts In-Stock

1+ parts

$1.482

100+ parts

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544

$1.482

-

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Vyrian

USA . 10,407 parts In-Stock

1+ parts

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10,407

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Nova Conductors

Japan . 900 parts In-Stock

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900

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LittleDiode

UK . 9 parts In-Stock

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9

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 67 parts In-Stock

1+ parts

$0.390

100+ parts

-

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67

$0.390

-

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Semicontronic

India . 10,423 parts In-Stock

1+ parts

$1.330

100+ parts

$1.297

1k+ parts

$1.290

10k+ parts

-

10,423

$1.330

$1.297

$1.290

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Ampacity Inc.

Singapore . 10,254 parts In-Stock

1+ parts

$1.330

100+ parts

-

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10,254

$1.330

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Modulus Dynamics

Lithuania . 14,808 parts In-Stock

1+ parts

$1.390

100+ parts

$1.334

1k+ parts

$1.279

10k+ parts

-

14,808

$1.390

$1.334

$1.279

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Corohmni

South Africa . 150 parts In-Stock

1+ parts

$1.390

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150

$1.390

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Corphita

USA . 233 parts In-Stock

1+ parts

$1.404

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233

$1.404

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Advanced Electronics

New Zealand . 350 parts In-Stock

1+ parts

$1.612

100+ parts

$1.483

1k+ parts

$1.390

10k+ parts

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350

$1.612

$1.483

$1.390

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Microchip USA

USA . 197 parts In-Stock

1+ parts

$9.750

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197

$9.750

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Andel Nordic

Denmark . 4,512 parts In-Stock

1+ parts

$47.100

100+ parts

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$32.967

10k+ parts

$32.967

4,512

$47.100

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$32.967

$32.967

Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,398 parts In-Stock

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6,398

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Continental Prestige Electronics

USA . 6,223 parts In-Stock

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6,223

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Argo Parts USA

USA . 798 parts In-Stock

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798

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Bastille Electronics

Australia . 50 parts In-Stock

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50

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Overview

Unleash the power of innovation with the SPI15N60C3 by Infineon Technologies! As a leader in the industry, Infineon Technologies consistently delivers top-notch quality and reliability. The SPI15N60C3 is a game-changer in the Power FET category, offering unmatched performance and efficiency for various applications. Experience seamless switching capabilities and enhanced functionality with this single-channel transistor featuring a built-in diode. Elevate your projects with the SPI15N60C3 and enjoy the benefits of cutting-edge technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body enhances durability and thermal resistance of the transistor, making it suitable for various operating conditions.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are known for their high efficiency and fast switching speeds, making this transistor ideal for applications where these characteristics are important.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode helps protect the transistor from voltage spikes and reverse currents, increasing its reliability and lifespan in switching applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this transistor offers high performance and efficiency in controlling power flow within a circuit.

Minimum DS Breakdown Voltage: 600 V

With a minimum breakdown voltage of 600V, this transistor can handle high voltage levels, making it suitable for industrial and power electronics applications.

Maximum Pulsed Drain Current (IDM): 45 A

The high pulsed drain current rating of 45A allows the transistor to handle short-duration peak currents, making it reliable for applications that require sudden power spikes.

Avalanche Energy Rating (EAS): 460 mJ

The high avalanche energy rating ensures that the transistor can withstand voltage surges and spikes, providing robust protection in harsh electrical environments.

Maximum Power Dissipation (Abs): 156 W

With a high power dissipation rating of 156W, this transistor can handle significant power loads without overheating, ensuring reliable performance in high-power applications.

Maximum Operating Temperature: 150 °C

The high operating temperature of 150°C allows the transistor to operate in elevated temperature environments without performance degradation, increasing its versatility.

Maximum Drain-Source On Resistance: 0.28 ohm

The low drain-source on resistance of 0.28 ohms minimizes power losses and improves efficiency in the transistor, making it suitable for high-frequency switching applications.

Technical Specifications

Power Field Effect Transistors (FET) SPI15N60C3 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Additional Features:

AVALANCHE RATED

Avalanche Energy Rating (EAS):

460 mJ

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (Abs) (ID):

15 A

Maximum Drain Current (ID):

15 A

Maximum Drain-Source On Resistance:

.28 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-262AA

JESD-30 Code:

R-PSIP-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

45 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

SPI15N60C3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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