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SPI08N80C3

Infineon Technologies

SPI08N80C3 by Infineon Technologies

Infineon's SPI08N80C3 is a N-CHANNEL FET with 800V DS breakdown voltage, ideal for SWITCHING applications. It features 24A IDM, 340mJ EAS, and 0.65 ohm RDS(on). The transistor operates in ENHANCEMENT MODE with max temp of 150°C, making it suitable for high-power circuits.

Median Price

$3.590

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 480 parts In-Stock

1+ parts

$3.590

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$1.950

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480

$3.590

$1.950

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Distributors (In-Stock)

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Digiode

USA . 969 parts In-Stock

1+ parts

$3.410

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969

$3.410

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Vyrian

USA . 3,545 parts In-Stock

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3,545

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Nova Conductors

Japan . 450 parts In-Stock

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Sunrise Surplus Inc.

USA . 25 parts In-Stock

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25

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Distributors (Availability)

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Modulus Dynamics

Lithuania . 17,596 parts In-Stock

1+ parts

$1.295

100+ parts

$1.243

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$1.191

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17,596

$1.295

$1.243

$1.191

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Ampacity Inc.

Singapore . 246 parts In-Stock

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$3.050

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246

$3.050

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Corphita

USA . 662 parts In-Stock

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$3.231

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662

$3.231

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AZTECH Wire

Italy . 1,210 parts In-Stock

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$15.420

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$15.420

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Metaverse IC Inc.

Canada . 56,986 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 27,840 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,674 parts In-Stock

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Microchip USA

USA . 4,109 parts In-Stock

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Netroflash

USA . 500 parts In-Stock

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500

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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500

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GreenTree Electronics

Israel . 480 parts In-Stock

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480

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Overview

Unleash the power with the SPI08N80C3 from Infineon Technologies, a top-tier manufacturer known for delivering quality products. As a Power Field Effect Transistor, this N-CHANNEL gem offers enhanced performance in switching applications with its single configuration and built-in diode. With a high DS Breakdown Voltage of 800V and maximum Drain Current of 8A, this transistor ensures reliability and efficiency in operation. Whether you're in the automotive, industrial, or consumer electronics industry, the SPI08N80C3 provides the value, benefits, and advantages you need to take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material ensures durability and protection for the transistor, making it suitable for various environments and applications.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically have better performance and lower resistance compared to P-channel transistors, making this product efficient for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and protects against reverse current flow, enhancing the product's functionality and reliability.

Transistor Application: SWITCHING

Designed specifically for switching applications, this transistor provides fast switching speeds and efficient power control.

Minimum DS Breakdown Voltage: 800 V

With a high breakdown voltage, this transistor can handle high voltage applications, ensuring reliability and safety in operation.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for easy placement and mounting on a circuit board, facilitating installation and maintenance.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide a secure and reliable connection to the circuit board, ensuring stable operation and ease of soldering.

Operating Mode: ENHANCEMENT MODE

Enhancement mode transistors offer better control over the switching process and reduced power consumption, making this product energy-efficient.

Maximum Pulsed Drain Current (IDM): 24 A

The high pulsed drain current rating allows the transistor to handle sudden surges in current, providing protection against overload situations.

Avalanche Energy Rating (EAS): 340 mJ

The high avalanche energy rating ensures that the transistor can withstand voltage spikes and transient events, increasing its reliability in harsh environments.

Maximum Drain Current (Abs) (ID): 8 A

With a maximum drain current of 8 A, this transistor can handle moderate current loads, making it suitable for a wide range of applications.

No. of Terminals: 3

Having 3 terminals allows for easy connection in a circuit, providing flexibility and compatibility with various electronic systems.

Maximum Power Dissipation (Abs): 104 W

The high power dissipation rating enables the transistor to handle high power levels without overheating, ensuring long-term reliability in operation.

Package Style (Meter): IN-LINE

The in-line package style offers a compact and space-saving design, making it ideal for applications where board space is limited.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology provides high efficiency and performance, making this transistor suitable for demanding switching applications.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150°C, this transistor can withstand high-temperature environments, ensuring reliable performance in various conditions.

Transistor Element Material: SILICON

Silicon-based transistors offer high performance, low leakage, and good thermal stability, making this product a reliable choice for switching applications.

Maximum Drain-Source On Resistance: 0.65 ohm

The low drain-source on resistance results in minimal power loss and heat generation, improving the efficiency and performance of the transistor.

Terminal Position: SINGLE

Having a single terminal position simplifies the connection process and ensures proper alignment in the circuit, reducing the risk of errors during installation.

Technical Specifications

Power Field Effect Transistors (FET) SPI08N80C3 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Additional Features:

AVALANCHE RATED, HIGH VOLTAGE

Avalanche Energy Rating (EAS):

340 mJ

Minimum DS Breakdown Voltage:

800 V

Maximum Drain Current (Abs) (ID):

8 A

Maximum Drain Current (ID):

8 A

Maximum Drain-Source On Resistance:

.65 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-262AA

JESD-30 Code:

R-PSIP-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

24 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

SPI08N80C3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

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