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SI4410DYTRPBF

Infineon Technologies

SI4410DYTRPBF by Infineon Technologies

Infineon Technologies' SI4410DYTRPBF is a N-CHANNEL FET with 30V DS Breakdown Voltage, ideal for SWITCHING applications. Features include 50A IDM, 0.0135 ohm RDS(on), and 400mJ EAS. Its GULL WING terminals and ENHANCEMENT MODE operation make it suitable for various power management needs.

Median Price

$0.891

Lifecycle Status

Suppliers In-Stock

21

In-Stock Inventory

1k+

Distributors (In-Stock)

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Nova Conductors

Japan . 87 parts In-Stock

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$0.338

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Maritex

Poland . 180 parts In-Stock

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$2.542

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Chip Stock

USA . 11,500 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 3,300 parts In-Stock

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Bristol Electronics

USA . 1,876 parts In-Stock

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Sea View Technologies

USA . 1,840 parts In-Stock

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Atlantic Semiconductor

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M&R Communications

USA . 1,750 parts In-Stock

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Vyrian

USA . 1,579 parts In-Stock

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Odintec Ltd.

Israel . 1,353 parts In-Stock

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Semi Source

USA . 1,158 parts In-Stock

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Digiode

USA . 306 parts In-Stock

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Lantek

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Sensible Micro Corp

USA . 100 parts In-Stock

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$0.891

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$0.822

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100

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EMSNET

USA . 100 parts In-Stock

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Flex Direct, LLC

USA . 84 parts In-Stock

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Inventory MP

USA . 38 parts In-Stock

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First Choice Components Inc.

USA . 30 parts In-Stock

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Speed Components Ltd

Israel . 20 parts In-Stock

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Cyclops Electronics Ltd

UK . 14 parts In-Stock

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Prism Electronics

USA . 2 parts In-Stock

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Distributors (Availability)

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Argo Parts USA

USA . 4,657 parts In-Stock

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$0.338

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$0.328

4,657

$0.338

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Continental Prestige Electronics

USA . 3,111 parts In-Stock

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$0.338

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$0.331

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$0.338

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Modulus Dynamics

Lithuania . 23,102 parts In-Stock

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$0.846

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$0.812

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$0.778

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$0.846

$0.812

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Aztec Data Supply Inc.

USA . 1,199 parts In-Stock

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$0.861

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Corohmni

South Africa . 27 parts In-Stock

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$1.832

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Semicontronic

India . 725 parts In-Stock

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$11.050

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$10.774

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$10.718

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AZTECH Wire

Italy . 825 parts In-Stock

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$14.503

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Ampacity Inc.

Singapore . 1,229 parts In-Stock

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GreenTree Electronics

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Futuretech Components

Singapore . 10,000 parts In-Stock

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Perfect Parts

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Lixinc

USA . 5,887 parts In-Stock

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Microchip USA

USA . 4,708 parts In-Stock

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Kepictronics

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Cyclops Electronics Ltd (Excess)

UK . 3,300 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,003 parts In-Stock

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Bastille Electronics

Australia . 853 parts In-Stock

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Corphita

USA . 572 parts In-Stock

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Overview

Discover the Infineon Technologies SI4410DYTRPBF, a high-quality N-CHANNEL Power FET designed for switching applications. With a maximum pulsed drain current of 50A and a low on-resistance of 0.0135 ohm, this transistor offers superior performance and reliability. Its small outline package with gull wing terminals makes it ideal for surface mount applications. Trust in Infineon's expertise in semiconductor technology to deliver a product that meets your power management needs. Upgrade your designs with the SI4410DYTRPBF and experience enhanced efficiency and functionality.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and reliability for the product, ensuring a longer lifespan.

Polarity or Channel Type: N-CHANNEL

N-CHANNEL type provides better performance and efficiency in a switching application.

Transistor Application: SWITCHING

Designed specifically for switching applications, making it reliable and efficient for such tasks.

Minimum DS Breakdown Voltage: 30 V

With a minimum breakdown voltage of 30V, this product can handle higher voltage applications with ease.

Maximum Pulsed Drain Current (IDM): 50 A

With a maximum pulsed drain current of 50A, this product is capable of handling high power requirements.

Maximum Drain Current (ID): 10 A

Capable of handling a maximum drain current of 10A, making it suitable for various applications.

Maximum Drain-Source On Resistance: 0.0135 ohm

Low on-resistance ensures minimal power loss and efficient operation of the product.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology provides high performance and reliability for the product.

Technical Specifications

Power Field Effect Transistors (FET) SI4410DYTRPBF attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

400 mJ

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (ID):

10 A

Maximum Drain-Source On Resistance:

.0135 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

MS-012AA

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

50 A

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

SI4410DYTRPBF Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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