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SFH3211FA

Infineon Technologies

SFH3211FA by Infineon Technologies

PHOTO TRANSISTOR; Mounting Feature: SURFACE MOUNT; Terminal Finish: Tin/Lead (Sn/Pb); Minimum Operating Temperature: -40 Cel; No. of Functions: 1; Maximum On State Current: .015 A;

Median Price

$0.159

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Newark

USA . 150 parts In-Stock

1+ parts

$0.066

100+ parts

$0.066

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$0.066

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150

$0.066

$0.066

$0.066

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Arrow

USA . 4,000 parts In-Stock

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$0.159

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$0.159

Verical

USA . 4,000 parts In-Stock

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$0.159

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$0.159

EBV Elektronik

Germany . 2,000 parts In-Stock

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Distributors (In-Stock)

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Vyrian

USA . 670 parts In-Stock

1+ parts

$0.114

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670

$0.114

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ComSIT Distribution GmbH

Germany . 6,000 parts In-Stock

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NAC Semi

USA . 2,000 parts In-Stock

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$0.890

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$0.890

ACDS - Activité Composants Distribution Service

France . 1,997 parts In-Stock

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1,997

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Bristol Electronics

USA . 1,997 parts In-Stock

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$0.703

1k+ parts

$0.487

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1,997

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$0.703

$0.487

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Dan-Mar Components

USA . 1,997 parts In-Stock

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Digiode

USA . 148 parts In-Stock

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148

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Distributors (Availability)

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Modulus Dynamics

Lithuania . 1,873 parts In-Stock

1+ parts

$0.585

100+ parts

$0.562

1k+ parts

$0.538

10k+ parts

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1,873

$0.585

$0.562

$0.538

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Perfect Parts

USA . 35,840 parts In-Stock

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35,840

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Cyclops Electronics Ltd (Excess)

UK . 16,000 parts In-Stock

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Kepictronics

USA . 13,000 parts In-Stock

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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Corphita

USA . 32 parts In-Stock

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32

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Technical Specifications

Phototransistors SFH3211FA attributes and parameters. Explore more Phototransistors devices from Infineon Technologies

Specs

Minimum Collector-emitter Breakdown Voltage:

35 V

Configuration:

SINGLE

Maximum Dark Current:

200 nA

Infrared (IR) Range:

YES

JESD-609 Code:

e0

Nominal Light Current:

.016 mA

Mounting Feature:

No. of Functions:

1

Maximum On State Current:

.015 A

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Optoelectronic Type:

Peak Wavelength (nm):

900

Shape:

ROUND

Size:

2.4 mm

Sub-Category:

Photo Transistors

Terminal Finish:

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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