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SFH2400FA

Infineon Technologies

SFH2400FA by Infineon Technologies

SFH2400FA by Infineon Technologies is a silicon photodiode with a max operating temperature of 100°C and a min operating temperature of -55°C. It has a max dark current of 1nA and a max response time of 5ns. This surface mount photodiode is commonly used in applications such as optical sensors and communication systems.

Median Price

$0.503

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

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Arrow

USA . 2,000 parts In-Stock

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Verical

USA . 2,000 parts In-Stock

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$0.504

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$0.504

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TME

Poland . 198 parts In-Stock

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$0.770

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$0.460

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$0.430

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198

$0.770

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Rutronik

Germany . 18,000 parts In-Stock

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$0.381

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Bristol Electronics

USA . 2,079 parts In-Stock

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Vyrian

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Cyclops Electronics Ltd

UK . 1,457 parts In-Stock

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Digiode

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Nova Conductors

Japan . 15 parts In-Stock

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Ampacity Inc.

Singapore . 29,751 parts In-Stock

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$0.273

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Aztec Data Supply Inc.

USA . 1,305 parts In-Stock

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$0.279

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$0.279

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Modulus Dynamics

Lithuania . 4,771 parts In-Stock

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$0.795

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$0.763

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$0.731

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Perfect Parts

USA . 141,120 parts In-Stock

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Kepictronics

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Authorized Procurement Solutions

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Argo Parts USA

USA . 4,423 parts In-Stock

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Component Stockers USA

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Continental Prestige Electronics

USA . 980 parts In-Stock

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Corohmni

South Africa . 839 parts In-Stock

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Corphita

USA . 520 parts In-Stock

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Aranea Global

USA . 500 parts In-Stock

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S.R.D Solutions

India . 450 parts In-Stock

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Futuretech Components

Singapore . 127 parts In-Stock

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Overview

Discover the SFH2400FA by Infineon Technologies, a top-quality photodiode that revolutionizes the way you perceive light. Crafted with precision and expertise by Infineon Technologies, a renowned manufacturer in the industry, this photodiode offers unrivaled performance and reliability. Suitable for a vast range of applications, its advanced features ensure accurate and fast response times, while its superior semiconductor material guarantees optimal results. With a maximum operating temperature of 100 °C and a minimum operating temperature of -55 °C, this surface-mount device is built to withstand extreme conditions. Choose the SFH2400FA and experience enhanced sensitivity, efficiency, and value like never before.

Feature Benefit Bullets

Max Operating Temp:

100 °C - Suitable for high-temperature environments, ensuring reliable performance.

Min Operating Temp:

55 °C - Can withstand extremely cold conditions, ideal for various applications.

Terminal Finish:

Tin/Lead (Sn/Pb) - Easy to solder and provides excellent electrical conductivity.

Max Dark Current:

1 nA - Low dark current minimizes noise and enhances signal-to-noise ratio.

Max Response Time:

0.000000005 s - Ultra-fast response time allows for precise detection and measurement.

Max Reverse Voltage:

50 V - High reverse voltage rating for robust protection against voltage surges.

Semiconductor Material:

Silicon - Silicon offers excellent sensitivity and stability for accurate photodetection.

Mounting Feature:

SURFACE MOUNT - Convenient surface mount design for easy integration into various devices.

Technical Specifications

Photodiodes SFH2400FA attributes and parameters. Explore more Photodiodes devices from Infineon Technologies

Specs

Maximum Dark Current:

1 nA

JESD-609 Code:

e0

Mounting Feature:

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-55 Cel

Maximum Response Time:

.000000005 s

Maximum Reverse Voltage:

50 V

Semiconductor Material:

Silicon

Sub-Category:

Photo Diodes

Terminal Finish:

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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