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SAE800GGEGXUMA1

Infineon Technologies

SAE800GGEGXUMA1 by Infineon Technologies

Infineon's SAE800GGEGXUMA1 is a small outline tone/music synthesizer IC with 8 terminals. Operating temperature ranges from -25°C to 125°C, supporting supply voltages b/w 2.8V to 18V. Ideal for music and sound synthesizer applications due to its bipolar technology and compact rectangular package design.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,249 parts In-Stock

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6,249

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Chip Stock

USA . 4,392 parts In-Stock

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Digiode

USA . 376 parts In-Stock

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376

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Distributors (Availability)

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Corohmni

South Africa . 17 parts In-Stock

1+ parts

$1.398

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17

$1.398

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Advanced Electronics

New Zealand . 20 parts In-Stock

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$1.600

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$1.520

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$1.520

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20

$1.600

$1.520

$1.520

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Aztec Data Supply Inc.

USA . 3,257 parts In-Stock

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$1.689

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$1.689

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Modulus Dynamics

Lithuania . 851 parts In-Stock

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$3.499

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$3.359

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$3.219

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851

$3.499

$3.359

$3.219

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Semicontronic

India . 519 parts In-Stock

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$3.800

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$3.705

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$3.686

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519

$3.800

$3.705

$3.686

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Ampacity Inc.

Singapore . 375 parts In-Stock

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$7.800

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375

$7.800

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AZTECH Wire

Italy . 645 parts In-Stock

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$14.625

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645

$14.625

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Microchip USA

USA . 6,802 parts In-Stock

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Argo Parts USA

USA . 3,677 parts In-Stock

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Bastille Electronics

Australia . 2,263 parts In-Stock

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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Corphita

USA . 240 parts In-Stock

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Robosynatics

Brazil . 100 parts In-Stock

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$15.010

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$15.010

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$15.010

100

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$15.010

$15.010

$15.010

Lucentia Tech

USA . 100 parts In-Stock

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$15.010

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$15.010

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$15.010

100

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$15.010

$15.010

$15.010

Continental Prestige Electronics

USA . 65 parts In-Stock

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Overview

Unleash a world of endless possibilities with the SAE800GGEGXUMA1 by Infineon Technologies. Crafted with precision and excellence, this Music & Sound Synthesizer IC is designed to elevate your audio experience to new heights. Whether you are a music enthusiast or a tech-savvy professional, this small outline package delivers unparalleled performance and reliability. From its durable plastic/epoxy body to its advanced technology, this tone/music synthesizer boasts dual terminals and a wide operating temperature range. Discover the power of innovation and creativity with the SAE800GGEGXUMA1 - where quality meets innovation for an exceptional audio journey.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the IC lightweight and durable, perfect for portable music devices.

General IC Type: TONE/MUSIC SYNTHESIZER

Specifically designed for tone and music synthesis, ensuring high-quality sound output.

Minimum Operating Temperature: -25 °C

Can operate in a wide range of temperatures, making it suitable for various environmental conditions.

Technology: BIPOLAR

Bipolar technology offers reliable performance and precise control over the synthesized sound output.

Minimum Supply Voltage (Vsup): 2.8 V

Low minimum supply voltage requirement allows for efficient power consumption, ideal for battery-operated devices.

Technical Specifications

Music & Sound Synthesizer ICs SAE800GGEGXUMA1 attributes and parameters. Explore more Music & Sound Synthesizer ICs devices from Infineon Technologies

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G8

Length:

5 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

2.8 V

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

4 mm

Trade Compliance

SAE800GGEGXUMA1 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

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