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S25FL128SAGMFIR00

Infineon Technologies

S25FL128SAGMFIR00 by Infineon Technologies

Infineon's S25FL128SAGMFIR00 is a 3V NOR flash memory with 32Mx4 organization, operating at up to 133MHz. Ideal for industrial applications, it offers 100K write/erase cycles, SPI serial bus type, and hardware/software write protection. Measuring 10.3mm x 7.5mm in a small outline package, it has a temperature range of -40°C to +85°C.

Median Price

$3.780

Lifecycle Status

Suppliers In-Stock

16

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 558 parts In-Stock

1+ parts

$2.830

100+ parts

$2.290

1k+ parts

-

10k+ parts

-

558

$2.830

$2.290

-

-

Arrow

USA . 2,509 parts In-Stock

1+ parts

$3.545

100+ parts

$2.910

1k+ parts

$2.706

10k+ parts

-

2,509

$3.545

$2.910

$2.706

-

Newark

USA . 769 parts In-Stock

1+ parts

$3.780

100+ parts

$3.200

1k+ parts

$3.050

10k+ parts

-

769

$3.780

$3.200

$3.050

-

Mouser Electronics

USA . 1,183 parts In-Stock

1+ parts

$3.980

100+ parts

$3.150

1k+ parts

$3.000

10k+ parts

$2.840

1,183

$3.980

$3.150

$3.000

$2.840

DigiKey

USA . 779 parts In-Stock

1+ parts

$3.990

100+ parts

$3.534

1k+ parts

$3.217

10k+ parts

$3.157

779

$3.990

$3.534

$3.217

$3.157

Farnell

UK . 1,852 parts In-Stock

1+ parts

$4.544

100+ parts

$3.201

1k+ parts

-

10k+ parts

-

1,852

$4.544

$3.201

-

-

Element14

Singapore . 1,852 parts In-Stock

1+ parts

$5.271

100+ parts

$4.020

1k+ parts

$3.886

10k+ parts

-

1,852

$5.271

$4.020

$3.886

-

Verical

USA . 2,509 parts In-Stock

1+ parts

-

100+ parts

$2.910

1k+ parts

$2.706

10k+ parts

-

2,509

-

$2.910

$2.706

-

Rochester

USA . 287 parts In-Stock

1+ parts

-

100+ parts

$2.090

1k+ parts

$1.870

10k+ parts

$1.760

287

-

$2.090

$1.870

$1.760

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 516 parts In-Stock

1+ parts

$2.954

100+ parts

-

1k+ parts

-

10k+ parts

-

516

$2.954

-

-

-

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$4.244

100+ parts

-

1k+ parts

-

10k+ parts

-

50

$4.244

-

-

-

Flip Electronics

USA . 4,800 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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4,800

-

-

-

-

Component Sense

UK . 2,269 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,269

-

-

-

-

Vyrian

USA . 1,177 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,177

-

-

-

-

Chip Stock

USA . 210 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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210

-

-

-

-

Speed Components Ltd

Israel . 1 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 64 parts In-Stock

1+ parts

$1.974

100+ parts

-

1k+ parts

-

10k+ parts

-

64

$1.974

-

-

-

Semicontronic

India . 1,009 parts In-Stock

1+ parts

$2.730

100+ parts

$2.662

1k+ parts

$2.648

10k+ parts

-

1,009

$2.730

$2.662

$2.648

-

Corphita

USA . 975 parts In-Stock

1+ parts

$2.799

100+ parts

-

1k+ parts

-

10k+ parts

-

975

$2.799

-

-

-

Continental Prestige Electronics

USA . 1,887 parts In-Stock

1+ parts

$3.370

100+ parts

$2.620

1k+ parts

-

10k+ parts

-

1,887

$3.370

$2.620

-

-

Advanced Electronics

New Zealand . 50 parts In-Stock

1+ parts

$3.478

100+ parts

$3.304

1k+ parts

$3.304

10k+ parts

-

50

$3.478

$3.304

$3.304

-

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$4.244

100+ parts

-

1k+ parts

$4.032

10k+ parts

$3.947

2,000

$4.244

-

$4.032

$3.947

Argo Parts USA

USA . 863 parts In-Stock

1+ parts

$4.244

100+ parts

-

1k+ parts

-

10k+ parts

-

863

$4.244

-

-

-

Corohmni

South Africa . 172 parts In-Stock

1+ parts

$4.323

100+ parts

-

1k+ parts

-

10k+ parts

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172

$4.323

-

-

-

Modulus Dynamics

Lithuania . 711 parts In-Stock

1+ parts

$5.458

100+ parts

$5.240

1k+ parts

$5.021

10k+ parts

-

711

$5.458

$5.240

$5.021

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QUARKTWIN TECHNOLOGY LTD

USA . 21,324 parts In-Stock

1+ parts

-

100+ parts

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21,324

-

-

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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3,000

-

-

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Perfect Parts

USA . 2,240 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,240

-

-

-

-

Overview

Unlock a world of possibilities with the S25FL128SAGMFIR00 from Infineon Technologies. This cutting-edge flash memory device offers unparalleled quality and reliability, making it the perfect choice for a wide range of applications. With a focus on value and performance, this product provides customers with the peace of mind that comes with knowing their data is safe and secure. Whether you're looking to upgrade your system or enhance your devices, the S25FL128SAGMFIR00 delivers exceptional benefits and advantages that will take your technology to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protects the internal components, making it a reliable choice for long-term use.

Surface Mount: YES

With surface mount capability, this flash memory is easy to integrate into circuit boards, saving space and simplifying the manufacturing process.

Package Shape: RECTANGULAR

The rectangular shape allows for easy placement and alignment within a circuit layout, enhancing overall design efficiency.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures data transfer and processing are synchronized, leading to faster and more efficient performance.

Nominal Supply Voltage (Vsup): 3V

A 3V supply voltage ensures compatibility with a wide range of devices, making this flash memory versatile and widely applicable.

Power Supplies (V): 3/3.3

The multiple power supply options offer flexibility in differing voltage requirements, accommodating various system configurations.

No. of Terminals: 16

With 16 terminals, this flash memory provides ample connectivity options for seamless integration into different electronics setups.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space and allows for compact designs, ideal for applications where size is a constraint.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range ensures reliable performance even under extreme conditions, making it suitable for industrial use.

Technical Specifications

Flash Memory S25FL128SAGMFIR00 attributes and parameters. Explore more Flash Memory devices from Infineon Technologies

Specs

Additional Features:

IT ALSO CONFIGURED AS 256M X 1

Alternate Memory Width:

2

Boot Block:

BOTTOM

Maximum Clock Frequency (fCLK):

133 MHz

Minimum Data Retention Time:

20

Endurance:

100000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e3

Length:

10.3 mm

Memory Density:

134217728 bit

Memory IC Type:

Memory Width:

4

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

16

No. of Words:

33554432 words

No. of Words Code:

32M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

32MX4

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/3.3

Programming Voltage (V):

3

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.0001 Amp

Sub-Category:

Flash Memories

Maximum Supply Current:

100 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Type:

NOR TYPE

Width:

7.5 mm

Maximum Write Cycle Time (tWC):

500 ms

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

S25FL128SAGMFIR00 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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