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IRF8707TRPBF

Infineon Technologies

IRF8707TRPBF by Infineon Technologies

IRF8707TRPBF by Infineon is a N-CHANNEL FET with 30V DS Breakdown Voltage, ideal for SWITCHING applications. Features include 88A IDM, 53mJ EAS, and 0.0119 ohm RDS(on). Operating in ENHANCEMENT MODE, it has a max temp of 150°C and can handle up to 11A ID.

Median Price

$0.208

Lifecycle Status

Suppliers In-Stock

26

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1k+

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Future Electronics

Canada . 108,000 parts In-Stock

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Rochester

USA . 62,891 parts In-Stock

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Mouser Electronics

USA . 53,094 parts In-Stock

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Verical

USA . 21,025 parts In-Stock

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Chip1Stop

Japan . 10,938 parts In-Stock

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Element14

Singapore . 4,390 parts In-Stock

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Arrow

USA . 4,000 parts In-Stock

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Adafruit Industries

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Nova Conductors

Japan . 100 parts In-Stock

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Voyager Components

USA . 2,313 parts In-Stock

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Bristol Electronics

USA . 3,929 parts In-Stock

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Vyrian

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ACDS - Activité Composants Distribution Service

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Sensible Micro Corp

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Italy . 2,545 parts In-Stock

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Schukat

Germany . 1,800 parts In-Stock

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Atlantic Semiconductor

USA . 1,294 parts In-Stock

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Cyclops Electronics Ltd

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Digiode

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Ampacity Inc.

Singapore . 26,178 parts In-Stock

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Argo Parts USA

USA . 2,830 parts In-Stock

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Semicontronic

India . 28,336 parts In-Stock

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Modulus Dynamics

Lithuania . 2,532 parts In-Stock

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Corohmni

South Africa . 91 parts In-Stock

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Aztec Data Supply Inc.

USA . 4,618 parts In-Stock

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Continental Prestige Electronics

USA . 17,221 parts In-Stock

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Metaverse IC Inc.

Canada . 90,000 parts In-Stock

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Israel . 88,000 parts In-Stock

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Perfect Parts

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Infinite Electronics LLP (Excess)

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QUARKTWIN TECHNOLOGY LTD

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Robosynatics

Brazil . 22,487 parts In-Stock

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Lucentia Tech

USA . 22,487 parts In-Stock

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Epart123

USA . 16,000 parts In-Stock

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Lixinc

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Legend Electronics Inc. (Excess)

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Glotronic Ltd.

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S.R.D Solutions

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A-Z Elektronik GmbH

Germany . 2,670 parts In-Stock

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Alle Elektronik GmbH

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Assy Fe

Spain . 1,000 parts In-Stock

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Singapore . 842 parts In-Stock

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Corphita

USA . 481 parts In-Stock

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Advanced Electronics

New Zealand . 50 parts In-Stock

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Overview

Discover the Infineon Technologies IRF8707TRPBF Power FET, a game-changer in switching applications. With a robust design and high-quality materials, this N-CHANNEL transistor offers unmatched performance and reliability. Whether you're looking to enhance your power management system or optimize your circuitry, this single-diode configuration is the perfect solution. Say goodbye to overheating and inefficiencies with its low on-resistance and high pulsing capabilities. Trust Infineon Technologies to deliver cutting-edge technology that exceeds expectations. Upgrade to the IRF8707TRPBF and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the transistor, making it suitable for various environmental conditions.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower ON-resistance and higher switching speeds compared to P-channel FETs, making them a good choice for efficient power switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for protection against reverse polarity and ensures safe operation in various circuits.

Transistor Application: SWITCHING

Designed for switching applications, this FET can handle high current loads efficiently and reliably.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on PCBs, saving space and simplifying manufacturing processes.

Operating Mode: ENHANCEMENT MODE

Enhancement mode transistors offer easy control of the transistor's conductivity, providing greater flexibility in circuit design and operation.

Maximum Pulsed Drain Current (IDM): 88 A

The high pulsed drain current rating enables this FET to handle short-duration high current loads, making it suitable for power management in demanding applications.

Avalanche Energy Rating (EAS): 53 mJ

The high avalanche energy rating indicates the FET's ability to withstand high energy transients, ensuring reliable operation in harsh conditions.

Maximum Drain-Source On Resistance: 0.0119 ohm

The low ON-resistance results in minimal power losses and efficient power delivery, making this FET ideal for high-performance applications.

Technical Specifications

Power Field Effect Transistors (FET) IRF8707TRPBF attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

53 mJ

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

11 A

Maximum Drain Current (ID):

11 A

Maximum Drain-Source On Resistance:

.0119 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

MS-012AA

JESD-30 Code:

R-PDSO-G8

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

88 A

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IRF8707TRPBF Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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