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IRF630NSPBF

Infineon Technologies

IRF630NSPBF by Infineon Technologies

IRF630NSPBF by Infineon is a N-CHANNEL FET with 200V DS Breakdown Voltage, ideal for SWITCHING applications. It features 37A Max Pulsed Drain Current and 94mJ Avalanche Energy Rating. With a compact RECTANGULAR package style and GULL WING terminals, it operates in temperatures ranging from -55 to 175 °C.

Median Price

$1.099

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

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Adafruit Industries

USA . 350 parts In-Stock

1+ parts

$1.099

100+ parts

$1.044

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$1.044

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350

$1.099

$1.044

$1.044

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Distributors (In-Stock)

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Nova Conductors

Japan . 300 parts In-Stock

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$1.000

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$1.000

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Digiode

USA . 355 parts In-Stock

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$1.044

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355

$1.044

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Chip Stock

USA . 17,780 parts In-Stock

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Bristol Electronics

USA . 265 parts In-Stock

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$1.125

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$0.675

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265

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$1.125

$0.675

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ACDS - Activité Composants Distribution Service

France . 236 parts In-Stock

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Dan-Mar Components

USA . 236 parts In-Stock

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Vyrian

USA . 234 parts In-Stock

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Corel Iberica Componentes, S.L.

Spain . 150 parts In-Stock

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ComSIT Distribution GmbH

Germany . 47 parts In-Stock

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ComSIT USA

USA . 47 parts In-Stock

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Semtec, LLC

USA . 6 parts In-Stock

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 4,644 parts In-Stock

1+ parts

$0.598

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4,644

$0.598

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Modulus Dynamics

Lithuania . 23,324 parts In-Stock

1+ parts

$0.841

100+ parts

$0.807

1k+ parts

$0.774

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23,324

$0.841

$0.807

$0.774

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Corohmni

South Africa . 533 parts In-Stock

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$0.872

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533

$0.872

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Argo Parts USA

USA . 4,961 parts In-Stock

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$0.897

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4,961

$0.897

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Continental Prestige Electronics

USA . 3,976 parts In-Stock

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$0.897

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$0.879

3,976

$0.897

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$0.879

Semicontronic

India . 175 parts In-Stock

1+ parts

$0.930

100+ parts

$0.907

1k+ parts

$0.902

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175

$0.930

$0.907

$0.902

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Ampacity Inc.

Singapore . 126 parts In-Stock

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$0.930

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126

$0.930

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Corphita

USA . 580 parts In-Stock

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$0.989

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580

$0.989

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Netroflash

USA . 2,000 parts In-Stock

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$1.000

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2,000

$1.000

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Advanced Electronics

New Zealand . 350 parts In-Stock

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$1.099

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$1.044

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$1.044

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350

$1.099

$1.044

$1.044

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AZTECH Wire

Italy . 611 parts In-Stock

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$19.767

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611

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Microchip USA

USA . 5,667 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,574 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,716 parts In-Stock

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Perfect Parts

USA . 2,688 parts In-Stock

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Glotronic Ltd.

UK . 1,920 parts In-Stock

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Assy Fe

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Kepictronics

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Authorized Procurement Solutions

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GreenTree Electronics

Israel . 80 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 24 parts In-Stock

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Overview

Experience the power and reliability of Infineon Technologies with the IRF630NSPBF Power Field Effect Transistor. Ideal for switching applications, this N-channel transistor offers a high breakdown voltage and low on-resistance for efficient performance. With a maximum current rating of 9.3A and a power dissipation of 82W, this transistor delivers exceptional value and benefits to customers looking for quality components. Trust in the expertise of Infineon Technologies and elevate your projects with the IRF630NSPBF.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material ensures durability and reliability, making it a suitable choice for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel transistors offer better efficiency and lower resistance, making this product ideal for high-performance applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and enhances overall performance, making this transistor a convenient choice.

Transistor Application: SWITCHING

Designed specifically for switching applications, this transistor provides fast and efficient operation in various electronic circuits.

Surface Mount: YES

The surface-mount capability allows for easy installation and space-saving design, making it a practical choice for compact electronics.

Minimum DS Breakdown Voltage: 200 V

With a high breakdown voltage, this transistor can handle high voltages, ensuring safety and reliability in demanding environments.

Package Shape: RECTANGULAR

The rectangular shape provides a compact form factor, making it suitable for applications where space is limited.

Terminal Form: GULL WING

The gull wing terminals offer secure connections and easy soldering, ensuring a reliable electrical connection.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for precise control and efficient power management, making this transistor a versatile choice.

No. of Elements: 1

With a single element design, this transistor simplifies circuit layout and reduces component count, making it cost-effective and easy to use.

Maximum Pulsed Drain Current (IDM): 37 A

The high pulsed drain current rating allows for reliable operation under heavy loads, making it a suitable choice for power applications.

Avalanche Energy Rating (EAS): 94 mJ

The high avalanche energy rating ensures robust performance under transient conditions, making this transistor a reliable choice for demanding environments.

Maximum Drain Current (Abs) (ID): 9.3 A

The high drain current rating allows for efficient power handling, making this transistor suitable for high-current applications.

No. of Terminals: 2

With only two terminals, this transistor is easy to integrate into circuit designs, simplifying the overall system layout.

Maximum Power Dissipation (Abs): 82 W

The high power dissipation rating allows for reliable operation under heavy loads, making this transistor suitable for high-power applications.

Technical Specifications

Power Field Effect Transistors (FET) IRF630NSPBF attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Additional Features:

AVALANCHE RATED, HIGH RELIABILITY, ULTRA-LOW RESISTANCE

Avalanche Energy Rating (EAS):

94 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

200 V

Maximum Drain Current (Abs) (ID):

9.3 A

Maximum Drain Current (ID):

9.3 A

Maximum Drain-Source On Resistance:

.3 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-263AB

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

37 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN OVER NICKEL

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IRF630NSPBF Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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