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IRDM982-035MBTR

Infineon Technologies

IRDM982-035MBTR by Infineon Technologies

Infineon's IRDM982-035MBTR is a Motion Control IC with 40 terminals, operating voltage range of 13.5V to 16.5V, and max output current of 2A. Ideal for automotive applications due to its hybrid technology, it offers temp range from -40°C to 125°C in a compact square package.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,239 parts In-Stock

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6,239

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Nova Conductors

Japan . 1,000 parts In-Stock

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1,000

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Digiode

USA . 699 parts In-Stock

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699

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Ampacity Inc.

Singapore . 241 parts In-Stock

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$5.500

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241

$5.500

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AZTECH Wire

Italy . 233 parts In-Stock

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$16.947

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233

$16.947

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Modulus Dynamics

Lithuania . 2,456 parts In-Stock

1+ parts

$24.823

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$23.830

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$22.837

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2,456

$24.823

$23.830

$22.837

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Kepictronics

USA . 16,000 parts In-Stock

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16,000

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Aranea Global

USA . 1,000 parts In-Stock

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Corphita

USA . 933 parts In-Stock

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933

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Microchip USA

USA . 453 parts In-Stock

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453

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Overview

Discover the power of seamless motion control with the IRDM982-035MBTR by Infineon Technologies. As a leader in the industry, Infineon delivers top-quality products that excel in performance and reliability. Designed for automotive applications, this AC motor controller boasts a wide range of features and benefits, making it the ideal choice for your next project. Trust in the expertise of Infineon and elevate your designs with the IRDM982-035MBTR today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes the product durable and resistant to external factors, ensuring a longer lifespan.

Surface Mount: YES

Being surface mountable makes installation easier and more efficient, saving time and effort during assembly.

Nominal Supply Voltage (Vsup): 15 V

The nominal supply voltage of 15V provides a stable power source for the device, ensuring consistent performance.

No. of Terminals: 40

Having 40 terminals allows for complex connections and functionalities, making the product suitable for advanced motion control applications.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125 °C, the product can withstand heat and operate reliably in harsh environments.

Terminal Position: QUAD

The quad terminal position enables efficient routing and connection of signals, optimizing performance and functionality.

Maximum Output Current: 2 A

The high maximum output current of 2A allows the product to drive motors and control systems with higher power requirements.

Technology: HYBRID

The hybrid technology used in the IC provides a balance between performance and efficiency, making it a versatile choice for various applications.

Technical Specifications

Motion Control ICs IRDM982-035MBTR attributes and parameters. Explore more Motion Control ICs devices from Infineon Technologies

Specs

Other IC type:

JESD-30 Code:

S-PQMA-N40

Length:

12 mm

No. of Functions:

1

No. of Terminals:

40

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

2 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

QMA

Package Equivalence Code:

MODULE,40LEAD,.5SQ

Package Shape:

Package Style (Meter):

MICROELECTRONIC ASSEMBLY

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

1 mm

Maximum Supply Current (Isup):

24 mA

Maximum Supply Voltage (Vsup):

16.5 V

Minimum Supply Voltage (Vsup):

13.5 V

Nominal Supply Voltage (Vsup):

15 V

Surface Mount:

YES

Technology:

HYBRID

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

12 mm

Trade Compliance

IRDM982-035MBTR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

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