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IR2235JTRPBF

Infineon Technologies

IR2235JTRPBF by Infineon Technologies

IR2235JTRPBF by Infineon Technologies is a MOSFET gate driver with 3 functions, BICMOS technology, and a max supply voltage of 20V. It is used in applications requiring high side drivers, such as half bridge based MOSFET driver interfaces. The package style is chip carrier with dimensions of 16.5862mm x 16.5862mm x 4.57mm (LxWxH).

Median Price

$9.704

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 500 parts In-Stock

1+ parts

$8.073

100+ parts

-

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500

$8.073

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Chip1Stop

Japan . 500 parts In-Stock

1+ parts

$9.877

100+ parts

-

1k+ parts

$8.220

10k+ parts

-

500

$9.877

-

$8.220

-

Rochester

USA . 811 parts In-Stock

1+ parts

-

100+ parts

$9.530

1k+ parts

$8.530

10k+ parts

$8.020

811

-

$9.530

$8.530

$8.020

Verical

USA . 811 parts In-Stock

1+ parts

-

100+ parts

$11.912

1k+ parts

$10.662

10k+ parts

$10.025

811

-

$11.912

$10.662

$10.025

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 367 parts In-Stock

1+ parts

$8.675

100+ parts

-

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367

$8.675

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Nova Conductors

Japan . 300 parts In-Stock

1+ parts

$11.786

100+ parts

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300

$11.786

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Vyrian

USA . 223 parts In-Stock

1+ parts

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223

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Distributors (Availability)

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Modulus Dynamics

Lithuania . 851 parts In-Stock

1+ parts

$4.194

100+ parts

$4.026

1k+ parts

$3.858

10k+ parts

-

851

$4.194

$4.026

$3.858

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Corphita

USA . 177 parts In-Stock

1+ parts

$8.219

100+ parts

-

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177

$8.219

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Aranea Global

USA . 100 parts In-Stock

1+ parts

$11.551

100+ parts

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1k+ parts

$11.089

10k+ parts

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100

$11.551

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$11.089

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Continental Prestige Electronics

USA . 5,074 parts In-Stock

1+ parts

$11.786

100+ parts

-

1k+ parts

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10k+ parts

$11.551

5,074

$11.786

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-

$11.551

Ampacity Inc.

Singapore . 15 parts In-Stock

1+ parts

$16.890

100+ parts

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15

$16.890

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QUARKTWIN TECHNOLOGY LTD

USA . 25,797 parts In-Stock

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25,797

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Authorized Procurement Solutions

USA . 12,000 parts In-Stock

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12,000

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iodParts Technologies Inc.

India . 6,800 parts In-Stock

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6,800

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Microchip USA

USA . 4,499 parts In-Stock

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4,499

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Perfect Parts

USA . 1,121 parts In-Stock

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Argo Parts USA

USA . 88 parts In-Stock

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88

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Overview

Enhance the performance of your electronics with the IR2235JTRPBF MOSFET Gate Driver by Infineon Technologies. Known for their high-quality components, Infineon delivers reliable solutions for a wide range of applications. This versatile chip carrier offers three functions in one, making it a cost-effective and space-saving option for your projects. With fast turn-on and turn-off times, this driver ensures efficient operation and optimal power management. Upgrade your system today and experience the difference with Infineon's innovative technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, ideal for portable or rugged applications.

Surface Mount: YES

This surface mount feature allows for easy and secure installation on PCBs, saving time and effort during assembly.

Maximum Supply Voltage: 20 V

With a high maximum supply voltage, this gate driver can provide reliable performance in a wide range of power supply applications.

No. of Functions: 3

This gate driver offers multiple functions in a single package, simplifying circuit design and reducing component count.

Package Shape: SQUARE

The square package shape provides a compact footprint, allowing for space-efficient integration into electronic systems.

No. of Terminals: 32

The numerous terminals offer flexibility in connecting various components, enhancing the gate driver's versatility.

Package Style (Meter): CHIP CARRIER

The chip carrier package style ensures efficient heat dissipation, contributing to the gate driver's thermal performance.

Minimum Supply Voltage: 10 V

The low minimum supply voltage requirement makes this gate driver suitable for low-power applications, conserving energy.

Terminal Position: QUAD

The quad terminal position simplifies the connection of external components, facilitating system integration and maintenance.

Maximum Seated Height: 4.57 mm

The compact maximum seated height allows for vertical space savings, making this gate driver ideal for slim designs.

Width: 16.5862 mm

The moderate width dimensions enable easy placement on PCBs without sacrificing space for other components.

High Side Driver: YES

The inclusion of a high side driver in this gate driver provides versatility in controlling both high and low side power MOSFETs.

Length: 16.5862 mm

The balanced length dimensions ensure a proportionate form factor, contributing to a visually appealing and well-organized circuit layout.

Technology: BICMOS

The adoption of BiCMOS technology combines the advantages of bipolar and CMOS circuits, enhancing the gate driver's performance and efficiency.

Terminal Form: J BEND

The J bend terminal form offers secure and reliable connections, reducing the risk of disconnection or signal interference.

Nominal Supply Voltage: 15 V

The standard nominal supply voltage ensures compatibility with commonly used power sources, simplifying system design.

Turn-on Time: 1 us

The fast turn-on time of 1 microsecond minimizes delays in switching operations, enhancing the gate driver's responsiveness.

Terminal Pitch: 1.27 mm

The fine terminal pitch allows for precise connection of components, ensuring reliable signal transmission and system integrity.

Moisture Sensitivity Level (MSL): 3

The MSL 3 rating indicates moderate moisture sensitivity, making this gate driver suitable for a variety of operating environments.

Nominal Output Peak Current Limit: 0.5 A

The nominal output peak current limit of 0.5 amps provides reliable protection for connected components against overcurrent conditions.

Interface IC Type: HALF BRIDGE BASED MOSFET DRIVER

The half-bridge-based MOSFET driver interface IC type offers efficient control of power MOSFETs, making this gate driver suitable for diverse applications.

Turn-off Time: 0.95 us

The quick turn-off time of 0.95 microseconds enhances the gate driver's ability to switch between states rapidly, improving overall system performance.

Technical Specifications

MOSFET Gate Drivers IR2235JTRPBF attributes and parameters. Explore more MOSFET Gate Drivers devices from Infineon Technologies

Specs

Additional Features:

FLOATING LOAD DRIVER; UNDER VOLTAGE LOCKOUT CIRCUIT

High Side Driver:

YES

Interface IC Type:

JESD-30 Code:

S-PQCC-J32

Length:

16.5862 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

3

No. of Terminals:

32

Nominal Output Peak Current Limit:

.5 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Maximum Supply Voltage:

20 V

Minimum Supply Voltage:

10 V

Nominal Supply Voltage:

15 V

Surface Mount:

YES

Technology:

BICMOS

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Turn-off Time:

.95 us

Turn-on Time:

1 us

Width:

16.5862 mm

Trade Compliance

IR2235JTRPBF Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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