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IR2135JTRPBF

Infineon Technologies

IR2135JTRPBF by Infineon Technologies

IR2135JTRPBF by Infineon Technologies is a MOSFET gate driver with 3 functions, BICMOS technology, and a max supply voltage of 20V. It is used in applications requiring high side drivers, with a turn-on time of 1us and turn-off time of 0.95us.

Median Price

$3.570

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 102 parts In-Stock

1+ parts

$8.240

100+ parts

$6.200

1k+ parts

$3.850

10k+ parts

-

102

$8.240

$6.200

$3.850

-

DigiKey

USA . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.670

10k+ parts

-

500

-

-

$1.670

-

Element14

Singapore . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$4.841

10k+ parts

$4.826

500

-

-

$4.841

$4.826

Flip Electronics (Authorized)

USA . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

500

-

-

-

-

Verical

USA . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.932

10k+ parts

-

500

-

-

$1.932

-

Rochester

USA . 301 parts In-Stock

1+ parts

-

100+ parts

$3.570

1k+ parts

$3.200

10k+ parts

$3.010

301

-

$3.570

$3.200

$3.010

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 965 parts In-Stock

1+ parts

$4.332

100+ parts

-

1k+ parts

-

10k+ parts

-

965

$4.332

-

-

-

Vyrian

USA . 4,189 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,189

-

-

-

-

Flip Electronics

USA . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

500

-

-

-

-

DigiKey Marketplace

USA . 301 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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301

-

-

-

-

ACDS - Activité Composants Distribution Service

France . 259 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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259

-

-

-

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Bristol Electronics

USA . 259 parts In-Stock

1+ parts

-

100+ parts

$1.829

1k+ parts

$1.698

10k+ parts

-

259

-

$1.829

$1.698

-

Dan-Mar Components

USA . 259 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

259

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 829 parts In-Stock

1+ parts

$4.104

100+ parts

-

1k+ parts

-

10k+ parts

-

829

$4.104

-

-

-

Modulus Dynamics

Lithuania . 227 parts In-Stock

1+ parts

$7.690

100+ parts

$7.382

1k+ parts

$7.075

10k+ parts

-

227

$7.690

$7.382

$7.075

-

Advanced Electronics

New Zealand . 2,500 parts In-Stock

1+ parts

$15.189

100+ parts

$13.822

1k+ parts

$12.455

10k+ parts

-

2,500

$15.189

$13.822

$12.455

-

Microchip USA

USA . 1,842 parts In-Stock

1+ parts

$23.040

100+ parts

$22.710

1k+ parts

$22.540

10k+ parts

$22.380

1,842

$23.040

$22.710

$22.540

$22.380

Alle Elektronik GmbH

Germany . 3,950 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,950

-

-

-

-

Continental Prestige Electronics

USA . 500 parts In-Stock

1+ parts

-

100+ parts

$6.580

1k+ parts

$6.450

10k+ parts

-

500

-

$6.580

$6.450

-

Authorized Procurement Solutions

USA . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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500

-

-

-

-

A-Z Elektronik GmbH

Germany . 231 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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231

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Kepictronics

USA . 154 parts In-Stock

1+ parts

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100+ parts

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154

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Overview

Enhance your electronic designs with the IR2135JTRPBF MOSFET Gate Driver from Infineon Technologies. Known for their top-quality products, Infineon Technologies delivers reliability and performance in every component they create. This versatile gate driver is perfect for a wide range of applications, offering customers value, efficiency, and precision control. With its high side driver, fast turn-on/off times, and advanced technology, the IR2135JTRPBF is the ideal choice for your next project. Elevate your designs with this innovative gate driver today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components.

Surface Mount: YES

Allows for easy and efficient mounting on PCBs.

Maximum Supply Voltage: 20 V

Can handle high voltage input for robust applications.

No. of Functions: 3

Offers multiple functions in a single component for added convenience.

Package Shape: SQUARE

Compact square design saves space on the PCB.

No. of Terminals: 32

Provides multiple connection points for versatile applications.

Package Style (Meter): CHIP CARRIER

Chip carrier style ensures efficient heat dissipation.

Minimum Supply Voltage: 10 V

Can operate at low voltage for energy efficiency.

Terminal Position: QUAD

Quad terminal layout simplifies connections and reduces footprint.

Maximum Seated Height: 4.57 mm

Low profile design for compact systems.

Width: 16.5862 mm

Optimal width for easy integration into standard PCB layouts.

High Side Driver: YES

Includes high-side driver functionality for controlling power MOSFETs.

Length: 16.5862 mm

Balanced length for uniform distribution on the PCB.

Technology: BICMOS

Combines the advantages of both bipolar and CMOS technologies for optimal performance.

Terminal Form: J BEND

J bend terminals for easy soldering and secure connections.

Nominal Supply Voltage: 15 V

Ideal operating voltage for stable performance.

Turn-on Time: 1 us

Fast turn-on time for quick response in control applications.

Terminal Pitch: 1.27 mm

Standard terminal pitch for compatibility with various PCB layouts.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates resistance to moisture during storage and handling.

Nominal Output Peak Current Limit: 0.5 A

Nominal output current limit ensures safe operation within specified parameters.

Interface IC Type: HALF BRIDGE BASED MOSFET DRIVER

Designed for half bridge configurations with MOSFET drivers for efficient power control.

Turn-off Time: 0.95 us

Quick turn-off time for precise switching control in power applications.

Technical Specifications

MOSFET Gate Drivers IR2135JTRPBF attributes and parameters. Explore more MOSFET Gate Drivers devices from Infineon Technologies

Specs

Additional Features:

FLOATING LOAD DRIVER; UNDER VOLTAGE LOCKOUT CIRCUIT

High Side Driver:

YES

Interface IC Type:

JESD-30 Code:

S-PQCC-J32

Length:

16.5862 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

3

No. of Terminals:

32

Nominal Output Peak Current Limit:

.5 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

4.57 mm

Maximum Supply Voltage:

20 V

Minimum Supply Voltage:

10 V

Nominal Supply Voltage:

15 V

Surface Mount:

YES

Technology:

BICMOS

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Turn-off Time:

.95 us

Turn-on Time:

1 us

Width:

16.5862 mm

Trade Compliance

IR2135JTRPBF Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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